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  4. We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)
SEMINAR_EVENT
  • Dec 23, 2024
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Dec 23, 2024

We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)

タカヤ タカヤ
Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results in electronics packaging technology. Starting in 2023, a hybrid format of on-site participation and online attendance has been implemented, attracting around 700 participants, primarily from industry and academia involved in electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)
Date and time Tuesday, Mar 11, 2025 ~ Thursday, Mar 13, 2025
Capital Shizuoka University Bunkyo Campus & Online Hybrid Event 〒112-8585 3-4-14 Kohinata, Bunkyo-ku, Tokyo
Entry fee Charge
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Flying Probe Tester APT-2400F / 2600FD

[39th NePCON Japan Domestic Debut] Supports inspection of high-density printed circuit boards with industry-leading accuracy! New model of flying probe tester.

Takaya Corporation announces the new model of its flying probe tester, "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-fast inspection. Equipped with cutting-edge inspection technology that can check fine component placements and connections with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting product quality improvement. Additionally, thanks to our unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, the user-friendly interface allows anyone to operate it intuitively, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

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Flying Probe Tester APT-2400F

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards, and through its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. It is the next-generation flying probe tester. We accept evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing with actual circuit boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Flying Probe Tester APT-2400F-SL

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototype to mass production!

The APT-2400F-SL is a large model that retains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate component heights of 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch, where you can bring your boards for testing. A complete testing process is possible, including the creation of inspection programs, inspection using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Dual Side Flying Probe Tester APT-2600FD

A new innovation in substrate manufacturing. Achieving improved production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototype to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Dual Side Flying Probe Tester APT-2600FD-SL

A new innovation in substrate manufacturing. Achieving improved production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of up to 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring your boards for testing. A complete flow of testing is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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スクリーンショット 2023-02-24 112144.jpg

Integration with boundary scan testing using a flying probe tester.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

  • Measurement and Inspection

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Special Feature Article Published in the Electronics Packaging Technology Journal

We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

  • Measurement and Inspection

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Accelerating the inspection of flying probe testers using deep reinforcement learning.

We have presented a joint research report with Ehime University.

Takaya Corporation is conducting joint research with the Graduate School of Science and Engineering at Ehime University on accelerating inspections of flying probe testers using deep reinforcement learning. At the Ehime University booth during the JPCA Show 2023 / 2023 Microelectronics Show held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), the report on this research was displayed and introduced. You can download and view the report that was exhibited on that day from here. We encourage everyone to take a look.

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Related catalog(6)

[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

TECHNICAL
  • E-book viewing
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Flying Probe Tester APT-2400F

Flying Probe Tester APT-2400F

PRODUCT
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Dual Side Flying Probe Tester APT-2600FD

Dual Side Flying Probe Tester APT-2600FD

PRODUCT
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Latest trends in hybrid inspection systems combining JTAG testing and flying probe testers.

Latest trends in hybrid inspection systems combining JTAG testing and flying probe testers.

TECHNICAL
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  • Catalog download

Contact this catalog

Hybrid inspection system combining JTAG testing and flying probe testers.

Hybrid inspection system combining JTAG testing and flying probe testers.

TECHNICAL
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Company Profile Takaya Corporation

Company Profile Takaya Corporation

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Information and Communications
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Survival Strategies for Construction Companies: A Complete Guide Seminar on Business Model Transformation

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  • SEMINAR_EVENT

The housing industry is currently facing a significant turning point due to factors such as population decline, a reduction in demand for new construction, and intensified price competition. This seminar will clearly explain the "business model transformation strategies" necessary for construction companies to survive and continue to grow in such a challenging environment. We will introduce specific approaches that can be immediately applied on-site, along with a roadmap to success.

Feb 12, 2026

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■ Announcement of "2025 Attack Fair in Meiko"! ■ 【July 23, 2025 (Wednesday) to July 24, 2025 (Thursday)】

  • NEW
  • SEMINAR_EVENT

Nitto Kohki will hold the "2025 Attack Fair in Meiko" for two days from July 23 (Wednesday) to July 24 (Thursday), 2025, at the "Kowa Seminar Plaza 2F Training Room No. 12 (inside Kowa Sports Land)." The Attack Fair is an exhibition where you can actually "see, touch, and operate" Nitto Kohki's products. Additionally, there will be wonderful souvenirs for attendees and many fun activities prepared. We look forward to welcoming everyone!

Feb 12, 2026

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At the "HCJ2026 International Hotel and Restaurant Show," we will showcase NFC-enabled business tablets focused on improving employee efficiency @ Tokyo Big Sight from February 17 to February 20, 2026.

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  • SEMINAR_EVENT

ODS Corporation, a manufacturer of business information terminals (headquartered in Chiyoda-ku, Tokyo, President: Kiyoshi Sunanaga), in collaboration with Magconn Corporation (headquartered in Kokubunji City, Tokyo, President: Satoshi Inoue), will showcase its business tablets at the "HCJ2026 International Hotel and Restaurant Show" to be held at Tokyo Big Sight from February 17 (Tuesday) to 20 (Friday), 2026. We will present the Android model "TA2C-NF8" equipped with an NFC reader/writer, which can be utilized in restaurants and hotels, as well as the Windows model "TW2A-NF9LTA" with an NFC reader/writer, which will be unveiled for the first time at this exhibition and is scheduled for release in March. By combining these products with Magconn's charging system, which allows for stable charging with a one-touch magnetic attachment, we aim to propose improvements in operational efficiency and the creation of new business opportunities utilizing NFC solutions.

Feb 10, 2026

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February 18 - February 19 | Osaka | Practical Solution Fair 2026

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  • SEMINAR_EVENT

The Practical Solution Fair is one of Japan's largest IT comprehensive exhibitions, hosted by Otsuka Shokai, held once a year. This year's theme is "Expanding with AI! Complete DX." The venue will showcase the latest business efficiency tools utilizing AI, and Paperlogic will exhibit "Electronic Contracts" and "Construction Document DX Pocket." ■ Date February 18, 2026 (Wednesday) 10:00 AM - 5:00 PM (last entry) February 19, 2026 (Thursday) 9:30 AM - 5:00 PM (last entry) Applications for attendance are accepted until 5 PM on each day. ■ Venue Grand Cube Osaka (Osaka Prefectural International Conference Hall): 5-3-51 Nakanoshima, Kita Ward, Osaka City, Osaka Prefecture ■ Participation method: Free, registration required https://it-event.otsuka-shokai.co.jp/osaka/ ▼ For details on the Tokyo venue, click here https://note.com/paperlogic/n/nb096d59149dc

Feb 09, 2026

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We will be exhibiting at JAPAN SHOP 2026.

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We will be exhibiting at "JAPAN SHOP 2026," which will be held at Tokyo Big Sight from March 3 (Tuesday) to March 6 (Friday), 2026.

Feb 09, 2026

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