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  4. We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)
SEMINAR_EVENT
  • Dec 23, 2024
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Dec 23, 2024

We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)

タカヤ タカヤ
Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results in electronics packaging technology. Starting in 2023, a hybrid format of on-site participation and online attendance has been implemented, attracting around 700 participants, primarily from industry and academia involved in electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)
Date and time Tuesday, Mar 11, 2025 ~ Thursday, Mar 13, 2025
Capital Shizuoka University Bunkyo Campus & Online Hybrid Event 〒112-8585 3-4-14 Kohinata, Bunkyo-ku, Tokyo
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Flying Probe Tester APT-2400F / 2600FD

[39th NePCON Japan Domestic Debut] Supports inspection of high-density printed circuit boards with industry-leading accuracy! New model of flying probe tester.

Takaya Corporation announces the new model of its flying probe tester, "APT-2400F/APT-2600FD series," which reliably detects various defects in printed circuit boards through ultra-fast inspection. Equipped with cutting-edge inspection technology that can check fine component placements and connections with high precision, it ensures that even minor defects and risks are not overlooked, strongly supporting product quality improvement. Additionally, thanks to our unique control mechanisms and sensing technology, reliable inspections can be achieved even in fluctuating environments, contributing to quality management by reducing recall risks. Furthermore, the user-friendly interface allows anyone to operate it intuitively, helping to alleviate burdens in workplaces where labor shortages are becoming serious, while still ensuring high inspection accuracy and contributing to increased productivity. *For more details, please download the PDF document or feel free to contact us.*

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Flying Probe Tester APT-2400F

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototyping to mass production!

The APT-2400F boasts industry-leading probing accuracy capable of inspecting high-density mounted circuit boards, and through its unique control mechanisms and sensing technology, it achieves highly reliable electrical testing in all environments. It is the next-generation flying probe tester. We accept evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch, where you can bring in your circuit boards. We can conduct a series of tests including the creation of inspection programs, testing with actual circuit boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Flying Probe Tester APT-2400F-SL

Equipped with a high-performance measurement system and a variety of functions, it contributes to quality improvement from prototype to mass production!

The APT-2400F-SL is a large model that retains the basic performance of the APT-2400F while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate component heights of 60mm on the top and 120mm on the bottom, and can handle board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch, where you can bring your boards for testing. A complete testing process is possible, including the creation of inspection programs, inspection using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Dual Side Flying Probe Tester APT-2600FD

A new innovation in substrate manufacturing. Achieving improved production efficiency and inspection accuracy!

The APT-2600FD is a next-generation dual-side flying probe tester that can perform combination testing with up to 6 probes using both upper and lower flying probes simultaneously. It improves test coverage while reducing the risk of product damage due to board flipping operations, significantly shortening inspection time. Equipped with a high-performance measurement system and a variety of features, it contributes to quality improvement from prototype to mass production. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring in your boards. A complete testing process is possible, including the creation of inspection programs, testing using actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Dual Side Flying Probe Tester APT-2600FD-SL

A new innovation in substrate manufacturing. Achieving improved production efficiency and inspection accuracy!

The APT-2600FD-SL is a large model that maintains the basic performance of the APT-2600FD while expanding the compatible board size to W635×D610mm. Furthermore, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of up to 60mm and board weights of up to 15kg, making it suitable for inspecting large and heavy boards such as those used in automotive, aerospace, medical devices, power supply boards, and probe cards. We accept evaluation tests at our demonstration rooms in Okayama headquarters and Tokyo branch, where you can bring your boards for testing. A complete flow of testing is possible, including the creation of inspection programs, testing with actual boards, and summarizing evaluation results. *For more details, please feel free to contact us.

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Integration with boundary scan testing using a flying probe tester.

We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

  • Measurement and Inspection

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Special Feature Article Published in the Electronics Packaging Technology Journal

We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

  • Measurement and Inspection

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Accelerating the inspection of flying probe testers using deep reinforcement learning.

We have presented a joint research report with Ehime University.

Takaya Corporation is conducting joint research with the Graduate School of Science and Engineering at Ehime University on accelerating inspections of flying probe testers using deep reinforcement learning. At the Ehime University booth during the JPCA Show 2023 / 2023 Microelectronics Show held at Tokyo Big Sight from May 31 (Wednesday) to June 2 (Friday), the report on this research was displayed and introduced. You can download and view the report that was exhibited on that day from here. We encourage everyone to take a look.

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Related catalog(6)

[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

[Press Release] Takaya Corporation Announces New Models of Flying Probe Tester "APT-2400F/APT-2600FD Series"

TECHNICAL
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Flying Probe Tester APT-2400F

Flying Probe Tester APT-2400F

PRODUCT
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Dual Side Flying Probe Tester APT-2600FD

Dual Side Flying Probe Tester APT-2600FD

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Latest trends in hybrid inspection systems combining JTAG testing and flying probe testers.

Latest trends in hybrid inspection systems combining JTAG testing and flying probe testers.

TECHNICAL
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Hybrid inspection system combining JTAG testing and flying probe testers.

Hybrid inspection system combining JTAG testing and flying probe testers.

TECHNICAL
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Company Profile Takaya Corporation

Company Profile Takaya Corporation

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Information and Communications
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Automobile and Technology Exhibition 2026 YOKOHAMA

Notice of Participation in the 2026 Yokohama Automotive Technology Exhibition

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Sekisui Filler Co., Ltd. will be exhibiting at the "Automotive Technology Exhibition 2026 YOKOHAMA" held at PACIFICO YOKOHAMA from May 27. (Booth number 285, within the Sekisui Chemical booth) 【Exhibited Products】 Mobility G - Re-sealable gasket HM (EV Seal 500) - Interior materials (Thermonex/Swiftlock) - Battery protection materials (EV Protect 4006SFR, etc.) Electronics / Car Electronics - Adhesives for camera modules - Adhesives for displays - Conformal coating agents - Optical adhesives We sincerely look forward to your visit.

May 15, 2026

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Notice of Participation in "AXIA EXPO 2026" from June 3 (Wednesday) to June 5 (Friday), 2026.

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Palmholtz Co., Ltd. will be exhibiting at the "AXIA EXPO 2026" held at Aichi Sky Expo (Aichi Prefectural International Exhibition Center). Our company possesses unique new technologies that transform oil palm trunks (Oil Palm Trunk = OPT), which have been treated as unused resources due to their lack of strength and value as building materials, into wood-based products such as building materials and furniture. The oil palm, which produces a large amount of edible oil, leaves the trunks unused and discarded after the oil is extracted. It is estimated that the amount of discarded trunks is 20 million tons per year in both Malaysia and Indonesia. This project involves peeling and drying the unused oil palm trunks to create veneer, which is then layered and compressed under high temperature and pressure to manufacture and sell exterior materials. We showcased a bench as a reference exhibit at the Malaysia Pavilion during the 2025 Osaka Expo. We sincerely look forward to your visit.

May 15, 2026

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[5/20 Presentation] At the interim report meeting for the Tokyo Metropolitan Government's "Decarbonization Support Project in the Supply Chain for the Creation of a Green Product Market," a case study on the use of plastic formwork "Daiko Panel" was presented.

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Kawasaki Corporation (Headquarters: Tokyo) is pleased to announce that it will participate in the interim report meeting for the Tokyo Metropolitan Government's "Decarbonization Support Project in the Supply Chain for the Creation of a Green Products Market," which will be held on May 20, 2026. At this meeting, we will present the CO2 reduction effects of our environmentally friendly plastic formwork "Daiko Panel," which we have conceived, developed, manufactured, and sold, along with our initiatives towards greening, including related auxiliary materials. [Overview of the Presentation] Theme: Utilizing CFP to enhance CO2 reduction of "Daiko Panel" and promote greening throughout the entire supply chain. Main Content: Introducing initiatives aimed at CO2 reduction, referencing the background of our application for this project and the CFP calculation results for "Daiko Panel" and its auxiliary materials. [Presentation Date and Time] Interim report meeting: May 20, 2026 (Wednesday) from 15:00 to 17:00 Details of the interim report meeting and the Tokyo Metropolitan Government's project: Decarbonization support in the supply chain for the creation of a green products market https://www.cfp-sc.metro.tokyo.lg.jp/

May 15, 2026

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Notice of Participation in the 8th International Construction and Surveying Exhibition (CSPI2026) from June 17 (Wednesday) to June 20 (Saturday), 2026.

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Rentama Co., Ltd. will be exhibiting at the "8th International Construction and Surveying Exhibition (CSPI2026)" held at Makuhari Messe. A wide range of cutting-edge products, technologies, and services from the evolving industries of construction machinery, heavy equipment, attachments, construction DX, and i-Construction will be gathered in one place. This is one of the largest exhibitions in Japan for professionals in the construction and surveying industries to gather for business discussions, advanced information gathering, and problem-solving. This is a valuable opportunity to see KEMROC products up close. We understand you may be busy, but we invite you to stop by our booth. We look forward to meeting everyone.

May 15, 2026

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Notice of Participation in 'FOOMA JAPAN 2026' from June 2 (Tuesday) to June 5 (Friday), 2026.

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TESSHA Corporation will be exhibiting at 'FOOMA JAPAN 2026' held at Tokyo Big Sight. This exhibition covers various fields of food manufacturing and is one of the largest comprehensive food manufacturing exhibitions in the world, where advanced technologies and knowledge come together. We plan to showcase our "Small Catalytic Deodorization Device SCU-1EH type." We look forward to your visit.

May 15, 2026

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