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  6. Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

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last updated:Apr 22, 2024

太洋テクノレックス 本社 和歌山
太洋テクノレックス 本社 和歌山
  • Official site

We will manufacture multi-layer flexible substrates (3 to 6 layers) entirely from polyimide. Please look forward to our quick delivery response! (Multi-layer boards, FPC)

Taiyo Industry supports everything from prototyping to mass production. - Achieves high density through pad-on-bead technology. - Supports 400μm pitch BGA. - Improved design flexibility with high-density multilayer structures. - Also supports impedance management. For more detailed information, please feel free to contact our representative. #Flex #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard #CircuitBoard #PrintedCircuitBoard #HighFrequency #Impedance

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Multilayer FPC (multilayer substrate, multilayer flexible printed circuit board)

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多層FPC?.png

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Multilayer FPC (Multilayer Flexible Printed Circuit Board)

Multilayer FPC (Multilayer Flexible Printed Circuit Board)

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FFC Flexible Flat Cable

FFC Flexible Flat Cable

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【NEW!】Ultra-fine wire high-density FPC

【NEW!】Ultra-fine wire high-density FPC

TECHNICAL
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"Until FPC is completed..." The manufacturing process has become a document.

"Until FPC is completed..." The manufacturing process has become a document.

TECHNICAL
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Types and Examples of High-Performance FPCs

Types and Examples of High-Performance FPCs

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Everything You Need to Know About FPC in One Book! *Includes Glossary*

Everything You Need to Know About FPC in One Book! *Includes Glossary*

TECHNICAL
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News about this product(6)

【TTL】High-Precision Flexible Printed Circuit Board【For Miniaturization and High Density of Electronic Devices!】Formation of ultra-fine circuits through the fusion of MSAP technology and via filling technology!

  • Product news

Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques! For modularization in medical devices and next-generation communication systems! The miniaturization and enhancement of electronic devices are progressing, and with that, there is a demand for finer circuit formation. 【Features of MSAP Technology】 ■ Circuit formation through electroplating allows for high-precision fine wiring ■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss ■ Superior for high-frequency substrates/IC mounting By merging these two processing technologies, we have realized "ultra-fine line high-density FPC." #UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard

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【TTL】"Until FPC is completed..." ● The manufacturing process of Taiyo Technorex has been documented.

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This is a very popular document. It explains the general manufacturing process of FPC in our company in an easy-to-understand manner using animation. Please take a look. 【Business Overview】 ■ Electronic Circuit Board Business - Design and production of flexible printed circuit boards - Assembly of printed circuit boards, etc. ■ Test System Business - Development and manufacturing of circuit board power-on testing systems - Development and manufacturing of final appearance inspection systems for circuit boards, etc. ■ Industrial Machinery System (Trading Company) Business - Design and manufacturing of robot FA systems and automation systems, etc. ■ Mirror Polishing Machine Business (Mirak Co., Ltd.) - Manufacturing of mirror polishing machines and grinding machines, etc.

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Corporate Overall Ranking

【TAIYO】Corporate Ranking Overall 4th! "Full support from FPC design, prototyping, and mass production to board power-on testing, appearance inspection systems, and FA automation! TAIYO FPC SOLUTIONS!"

  • Company news

【Aggregation Period】April 5, 2023 - April 11, 2023 ★Company Ranking (Out of a total of 44,072 points)  ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ 4th place: Taiyo Kogyo Co., Ltd. - Wakayama 【Thank You】 Thank you very much for the many accesses. 【Company Overview】 Taiyo Kogyo Co., Ltd. operates in the fields of prototype development of flexible printed circuit boards (FPC) and inspection equipment for circuit boards. FPCs are fundamentally related to the structure of hardware, requiring both high precision quality and shortened development periods. On the other hand, the circuit board inspection systems mainly include electrical inspection systems and final appearance inspection systems, which are also adopted in mass production sites for FPCs and package/module type circuit boards. 【Business Description】 ■ Electronic Circuit Board Business - Design and manufacturing of flexible printed circuit boards - Assembly of printed circuit boards, etc. ■ Test System Business - Development and manufacturing of circuit board electrical inspection systems - Development and manufacturing of final appearance inspection systems, etc. ■ Industrial Machinery System (Trading Company) Business - Design and manufacturing of robot FA systems and automation systems, etc. ■ Mirror Polishing Machine Business (Mirak Co., Ltd.) - Manufacturing of mirror polishing machines and grinding machines, etc.

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Press Release 1

[TAIYO] Announcement regarding capital investment in the electronic circuit board business "Announcement on the establishment of a production system for high-density wiring boards and high-frequency boards in the electronic circuit board business"

  • IRnews

We would like to inform you about the establishment of a new production system for high-density wiring boards and high-frequency boards in our main business, the electronic substrate business, as detailed in the attached document. We expect that this initiative will contribute to the expansion of our business in the future; however, this capital investment has already been incorporated into our plans, and there will be no changes to our performance forecast for the fiscal year ending December 2023. Should any matters arise that require disclosure regarding this matter, we will disclose them appropriately.

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太洋テクノレックス

太洋テクノレックス 本社 和歌山

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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced variants, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while we are advancing further miniaturization and high density technically, we are also undertaking new initiatives such as bump-type and electroplating with special materials. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in mass production sites for FPC and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs in the future. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*

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