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  6. Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)

Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)

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last updated:Apr 22, 2024

太洋テクノレックス 本社 和歌山
太洋テクノレックス 本社 和歌山
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From high-frequency applications to the design, production, evaluation testing, and analysis reports of flexible printed circuit boards with various characteristics!

We support the evaluation of high-frequency characteristics of materials under development. Our company has the know-how to handle everything from short-term prototypes to mass production of FPCs. We can provide optimal proposals tailored to the needs of material manufacturers, flexible printed circuit board manufacturers, and various equipment manufacturers. We assist in evaluating various characteristics of newly developed materials that are being improved daily.

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高周波向け材料評価サービス_看板.png

Material Evaluation Services: FPC, MPI, PTFE (Flexible Substrate)

高周波向け材料評価サービス_看板.png
高周波向け材料評価サービス_看板.png

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- CCL conversion of the substrate (high-temperature press capability) - Simulation design to production (MSAP possible) - Evaluation measurement of test samples and report submission

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Evaluation tests for new substrate materials from substrate manufacturers, etc.

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High-frequency FPC material evaluation services "MSAP," "high-temperature pressing," "environmental testing," "PTFE," "LCP," "COP," "impedance measurement," and others.

High-frequency FPC material evaluation services "MSAP," "high-temperature pressing," "environmental testing," "PTFE," "LCP," "COP," "impedance measurement," and others.

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Multilayer FPC (Multilayer Flexible Printed Circuit Board)

Multilayer FPC (Multilayer Flexible Printed Circuit Board)

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"Until FPC is completed..." The manufacturing process has become a document.

"Until FPC is completed..." The manufacturing process has become a document.

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High-frequency compatible FPC

High-frequency compatible FPC

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FPC and Processing Specification Sheet (Standard Type)

FPC and Processing Specification Sheet (Standard Type)

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【NEW!】Ultra-fine wire high-density FPC

【NEW!】Ultra-fine wire high-density FPC

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Everything You Need to Know About FPC in One Book! *Includes Glossary*

Everything You Need to Know About FPC in One Book! *Includes Glossary*

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News about this product(1)

【TTL】High-Precision Flexible Printed Circuit Board【For Miniaturization and High Density of Electronic Devices!】Formation of ultra-fine circuits through the fusion of MSAP technology and via filling technology!

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Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques! For modularization in medical devices and next-generation communication systems! The miniaturization and enhancement of electronic devices are progressing, and with that, there is a demand for finer circuit formation. 【Features of MSAP Technology】 ■ Circuit formation through electroplating allows for high-precision fine wiring ■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss ■ Superior for high-frequency substrates/IC mounting By merging these two processing technologies, we have realized "ultra-fine line high-density FPC." #UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard

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太洋テクノレックス

太洋テクノレックス 本社 和歌山

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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced variants, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while we are advancing further miniaturization and high density technically, we are also undertaking new initiatives such as bump-type and electroplating with special materials. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in mass production sites for FPC and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs in the future. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*

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