【TTL】High-Precision Flexible Printed Circuit Board【For Miniaturization and High Density of Electronic Devices!】Formation of ultra-fine circuits through the fusion of MSAP technology and via filling technology!
Ultra-fine lines, high density, and high-resolution flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!
For modularization in medical devices and next-generation communication systems!
The miniaturization and enhancement of electronic devices are progressing, and with that, there is a demand for finer circuit formation.
【Features of MSAP Technology】
■ Circuit formation through electroplating allows for high-precision fine wiring
■ Excellent rectangularity of wiring cross-section contributes to reduced transmission loss
■ Superior for high-frequency substrates/IC mounting
By merging these two processing technologies, we have realized "ultra-fine line high-density FPC."
#UltraFineLines #HighDensity #FPC #FlexibleSubstrate #FlexiblePrintedCircuitBoard

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