[Book] Latest Development Trends in High-Speed and High-Frequency Compatible Materials (2089BOD)
2089BOD High-speed and High-frequency Components
[Specialized Books] "Development of Low Dielectric Constant and Low Dielectric Loss Materials," "Millimeter Wave Compatible Electromagnetic Wave Absorbing and Shielding Materials," "Design of Antennas for 5G."
■ Points of this Book 【High-Frequency Substrate Materials】 - Characteristics and development of various substrate materials such as epoxy, polyimide, liquid crystal polymer, and fluorine - Development of new resins for 5G that achieve both "high heat resistance and low dielectric properties" - Surface modification and bonding techniques that enhance the adhesion between copper and resin without compromising smoothness 【5G Antennas】 - Antenna design technology for 5G smartphones - Reflectors and area construction applying metamaterial/metasurface technology - Antenna RF front-end modules that realize Massive MIMO in the high SHF band 【Electronic Components for 5G/Beyond 5G】 - Characteristics and technological trends of ceramic capacitors required for 5G - Technological trends and high-frequency advancements of SAW filters for 5G - Research and development trends of compound semiconductor devices for terahertz wireless communication 【Electromagnetic Wave Absorption and Shielding Materials】 - Design methods for wave absorbers and wave shields compatible with 5G millimeter waves - Applications of ceramics and carbon materials for wave absorption and shielding materials for millimeter waves 【Development and Integration Technology of Optical Devices】 - Development and integration technology of optical waveguides, optical modulators, and optical transceivers - Optical connection components and optical connection technology aimed at achieving co-packaging
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■Table of Contents Chapter 1: Development Status of 5G and Prospects for Beyond 5G Chapter 2: Low Dielectric and Low Transmission Loss of High-Frequency Substrate Materials Chapter 3: Adhesion and Joining Technologies of Resin/Copper in High-Frequency Substrates Chapter 4: Development Trends of Electronic Components and Modules for 5G Chapter 5: Development Trends of Electromagnetic Wave Absorption and Shielding Materials for 5G Chapter 6: Design of Antennas and Radio Wave Propagation Technologies for 5G Chapter 7: Measurement and Evaluation Technologies for Millimeter-Wave High-Frequency Circuits and Materials Chapter 8: Development Trends of Optical Devices for Beyond 5G/6G －－－－－－－－－－－－－－－－－－－－－－－－－－ ●Publication Date: February 26, 2021 ●Authors: 62 people ●Format: A4 size, 653 pages Hardcover Edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-865-4 ↓↓ The hardcover edition is out of print ↓↓ On-Demand Edition Available Price: 44,000 yen (tax included) ISBN: 978-4-86104-950-7 After receiving your order, we will perform simple printing and binding. －－－－－－－－－－－－－－－－－－－－－－－－－－
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