[Book] Latest Development Trends of High-Speed and High-Frequency Compatible Materials (No. 2089BOD)

- Towards 5G/Beyond 5G -
■Table of Contents
Chapter 1: Development Status of 5G and Prospects for Beyond 5G
Chapter 2: Low Dielectric and Low Transmission Loss of High-Frequency Substrate Materials
Chapter 3: Adhesion and Joining Technologies of Resin/Copper in High-Frequency Substrates
Chapter 4: Development Trends of Electronic Components and Modules for 5G
Chapter 5: Development Trends of Electromagnetic Wave Absorption and Shielding Materials for 5G
Chapter 6: Design of Antennas for 5G and Radio Wave Propagation Technologies
Chapter 7: Measurement and Evaluation Technologies for Millimeter Wave High-Frequency Circuits and Materials
Chapter 8: Development Trends of Optical Devices for Beyond 5G/6G
--------------------------
●Published: February 26, 2021 ●Authors: 62 ●Format: A4 size, 653 pages
Hardcover edition: Price: 88,000 yen (tax included) ISBN: 978-4-86104-865-4
↓↓ The hardcover edition is out of print ↓↓
On-demand edition available for sale
Price: 44,000 yen (tax included) ISBN: 978-4-86104-950-7
After receiving your order, we will perform simple printing and binding.
--------------------------

Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration
Related Links
Technical Information Association site