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  6. Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

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last updated:Dec 07, 2023

宇部エクシモ
宇部エクシモ
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Ultra-thin, lightweight heat dissipation substrate without adhesive type! It can be processed in three dimensions, allowing for the production of substrates in various shapes!

Ube Eximo's "Yupisel H" is a heat dissipation substrate material based on polyimide. By utilizing the high insulation breakdown characteristics of polyimide and reducing the thickness of the insulation layer, high heat dissipation can be achieved. It is characterized by its ability to be processed in three dimensions, making it suitable for LEDs and power modules. 【Features】 ■ It is an ultra-thin and super-lightweight heat dissipation substrate material. ■ Three-dimensional processing is possible, allowing for the creation of substrates in various shapes. ■ Roll processing is possible due to a unique continuous manufacturing method. ■ It does not use halogens. ■ It contains no ceramic fillers, resulting in good machinability. ■ It is suitable for chip-on-board (COB) mounting of bare chips. *For more details, please request materials or view the PDF data available for download.

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Heat dissipation substrate material "Yupicel H" [An ultra-thin and super lightweight heat dissipation substrate material!]

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【General Characteristics】 ■ Peel Strength ・Normal Condition: 1.5N/mm ・85℃/85%RH, 1000 hours: 1.5N/mm ■ Insulation Breakdown Voltage: Measured value at 25μmt 7.0kV ■ Flame Resistance: UL94 measured value V-O *For more details, please refer to the PDF document or feel free to contact us.

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【Applications】 ■ For LED heat dissipation ・LED backlight units ・LED lighting and automotive LED units ■ Power module type ・Inverters ・Power supply units *For more details, please refer to the PDF document or feel free to contact us.

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Polyimide metal-based heat dissipation substrate material "Yupicel H"

Polyimide metal-based heat dissipation substrate material "Yupicel H"

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Ube Eximo (renamed on October 1, 2013; formerly Ube Nitto Kasei) has been a member of the Ube Industries Group since its establishment in 1966, delivering a variety of products to the world. Our lineup includes essential materials for optical communication cables, which are indispensable for broadband communication, as well as electronic materials such as spacers for liquid crystal displays and flexible copper-clad laminates. We also offer FRP products that are highly regarded in the agriculture, fisheries, and construction sectors, plastic cardboard widely used across various industries, and high-strength polypropylene fibers that are crucial for improving the performance of secondary batteries. Our products are said to have such a high level of recognition that there are few who are unaware of them in their respective fields. The source of our ability to create these products lies in our unwavering commitment to responding to our customers' desires for "what would be nice to have" through continuous improvement of our technical capabilities and relentless research and development. We intend to continue this spirit without wavering and to focus on creating new value utilizing our unique technologies.

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