[Book] High Heat-Resistant Materials for Next-Generation Power Devices (No. 2260)
2260 Power Device
[Available for preview] ~ Substrate, Joining, Sealing, Cooling Technologies ~
Book Title: Development of High Heat-Resistant and High Heat-Dissipating Materials for Next-Generation Power Devices and Thermal Countermeasures －－－－－－－－－－－－－－－－－－－－－ ◎ Thorough explanation of Si, SiC, GaN, gallium oxide, required characteristics in automotive environments, and implementation examples! ◎ Detailed guidelines for designing TIMs and heat dissipation sheets that balance "thermal characteristics" and "operational reliability"! －－－－－－－－－－－－－－－－－－－－－ ■ This book includes the following information: - Improving the heat resistance of resins and measures against material expansion - Composite materials of thermally conductive fillers and resins - Development trends of resin substrates, ceramic substrates, and metal substrate materials - Countermeasures for failures such as warping, delamination, and breakage caused by inter-material stress due to linear expansion coefficients - Response to high-temperature operation above 300°C and low-temperature operation below freezing - Balancing thermal conductivity, mechanical properties, electrical insulation properties, and strength reliability - Improvement of thermal fatigue characteristics against repeated stress due to heat resistance and differences in linear expansion, and crack countermeasures - Suppression of electromigration and electrochemical migration - Ensuring moisture resistance, oxidation resistance, heat resistance, and long-term reliability of metal sintered materials
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- Lowering the temperature and shortening the time of the bonding process - Improvement of heat resistance, high thermal conductivity, corrosion resistance, and low stress response - High flexibility thermal conductive materials, durability of TIM, and long-term reliability assurance －－－－－－－－－－－－－－－－－－－－－ ■ Table of Contents Chapter 1: Trends in the Development and Device Applications of Power Semiconductors Chapter 2: Design of Heat-Resistant and Heat-Dispersing Substrate Materials and Improvement of Reliability Chapter 3: Design of Bonding Materials and Technologies and High-Temperature Connection Reliability Chapter 4: Design of Sealing Materials and Response to High-Temperature Operation Chapter 5: Design of Heat-Resistant and Heat-Dispersing Resins and Expansion Mitigation Materials Chapter 6: Design of Cooling Components, Development of Cooling Technologies, and Implementation Technologies Chapter 7: Thermal Design of Power Devices and High Heat Resistance, High Heat Dissipation Packaging Technologies Chapter 8: Reliability and Thermal Characteristics Evaluation of Power Devices －－－－－－－－－－－－－－－－－－－－－ ● Publication Date: August 30, 2024 ● Format: A4, 569 pages ● Authors: 60 individuals ● ISBN: 978-4-86798-030-9 －－－－－－－－－－－－－－－－－－－－－
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