Total coordination of product development is possible! A service that allows you to outsource the design and evaluation analysis of LSI packages.
Introducing a service that allows you to outsource the design and evaluation analysis of LSI packages, which "protect" semiconductor chips from external environments and "transmit" electrical signals to substrates. Rather than just providing a report on evaluation analysis results, we utilize WTI's proprietary "LSI package design technology," "simulation technology," and "evaluation analysis technology" to estimate the causes of failures and propose optimal structures based on simulations. 【Features】 ■ We propose suitable analysis methods and steps from our company. ■ We conduct not only the reporting of evaluation analysis results but also the estimation of failure causes. ■ We suggest analyses aimed at narrowing down the production processes and optimizing structures based on the analysis results. *For more details, please refer to the PDF document or feel free to contact us.
Inquire About This Product
basic information
【Available Evaluation and Analysis Items】 ■ Time Domain Reflectometry Measurement ■ Dimensional Measurement ■ Heated Surface Shape Measurement ■ Ultrasonic Deep Injury Observation ■ Scanning Electron Microscope Observation ■ Energy Dispersive X-ray Analysis ■ X-ray Observation ■ Cross-sectional Observation ■ Pull Share Strength Measurement ■ Reliability Evaluation *For more details, please refer to the PDF document or feel free to contact us.
Price range
Delivery Time
Applications/Examples of results
For more details, please refer to the PDF document or feel free to contact us.
catalog（1）
Download All Catalogs![LSI Package Design / Evaluation Analysis Contracted Services [Brochure]](https://image.www.ipros.com/public/catalog/image/01/4d0/491383/IPROS85229487335721060931.jpeg?w=120&h=170)
Company information
As a development and design company, we promote the development, design, and evaluation of semiconductor peripheral circuits and application products through simulation technology.