High-purity insulating materials for the purpose of sealing semiconductor chips!
The "Dam & Fill Material" is an insulating material primarily used for wire bonding implementations such as CSP/BGA, which forms sharp dams and performs sealing through smooth filling between wires. It has excellent moldability and is a highly reliable material that achieves reduced warpage of the package. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Sharp dam shape ■ Excellent moldability ■ Achieves reduced warpage of the package ■ High reliability *For more details, please refer to the PDF document or feel free to contact us.
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basic information
【Lineup】 ■ Chip Coat G8345D: Sharp dam shape ■ Chip Coat G8345D-37: Sharp dam shape, fine filler ■ Chip Coat G8345-6: Low warpage, high fluidity ■ Chip Coat G8345-29: Low warpage, fine filler *For more details, please refer to the PDF document or feel free to contact us.
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【Application】 ■Sealing of semiconductor chips *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential demands.
