High-purity insulating materials for the purpose of sealing semiconductor chips!
The "Underfill for Flip Chip" is a chip coating that is injected and sealed using a capillary flow type in the implementation technology where the circuit surface of an IC chip with metal bump electrodes is directly electrically connected to the mounting substrate side. It is one of the bare chip mounting methods and can accommodate flip chip technology, which is advancing in various applications including CPUs and graphic LSIs. 【Features】 ■ One of the bare chip mounting methods ■ Insulating material that seals semiconductor chips ■ Capillary flow type *For more details, please refer to the catalog or feel free to contact us.
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basic information
【Lineup】 ■U8443-14: Low viscosity, narrow pitch compatible ■U8410-73C: Pb-free bump compatible, Low-K compatible, narrow pitch compatible ■U8410-73CF3: Pb-free bump, CuP compatible, Low-K compatible, narrow pitch compatible ■U8410-99: Pb-free bump compatible, Low-K compatible ■U8410-302: Pb-free bump, CuP compatible, Low-K compatible ■U8410-314: Low viscosity, narrow pitch compatible ■U8439-1: Large IC compatible, Low-K compatible ■U8439-105: Large IC compatible, Low-K compatible, narrow pitch compatible *For more details, please refer to the catalog or feel free to contact us.
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【Usage】 ■Sealing of semiconductor chips *For more details, please refer to the catalog or feel free to contact us.
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Company information
Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential demands.