High-purity insulating materials for the purpose of sealing semiconductor chips!
The 'Pre-supply Type Underfill Material (NCP)' is a pre-supply type paste underfill material. After applying it to the substrate or interposer, the chip is thermocompression bonded (TCB) and sealed. This material is capable of improving productivity and controlling fillet width (compatible with KOZ). [Features] ■ Insulating material for encapsulating semiconductor chips ■ Pre-supply type paste ■ Improved productivity ■ Capable of controlling fillet width *For more details, please refer to the PDF document or feel free to contact us.
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For more details, please refer to the PDF document or feel free to contact us.
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【Usage】 ■Sealing of semiconductor chips *For more details, please refer to the PDF document or feel free to contact us.
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Namix Corporation is a company engaged in the research, development, manufacturing, and sales of electrochemical materials. By refining the material technology cultivated since its founding and strengthening the development of new technologies, we propose products that realize our customers' potential demands.