Observation of adhesive conditions through a metal plate using an ultrasonic microscope.

If it is something that ultrasound can penetrate, you can check internal information that cannot be confirmed from the appearance!

Here is an introduction to a case study observing the adhesive condition through a metal plate using an ultrasonic microscope. The ultrasonic microscope can reveal internal information that cannot be confirmed from the exterior, as long as the ultrasonic waves can pass through the material. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details on the observations and results. [Case Overview] - Observation of the adhesive layer between the metal and the chip - Observation of the adhesion condition between the metal and the adhesive *For more details, please download the PDF or feel free to contact us.

• Analysis and prediction system

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Our company will release the 10.1-inch Windows tablet "TW2A-NF9LTA" equipped with an NFC reader/writer in March 2026. This product is a business-oriented model that comes standard with a dedicated OS for specific applications, "Windows 11 IoT Enterprise LTSC 2024 (64bit)," which enables long-term stable operation. With the built-in NFC reader, users can simply hold their IC cards, including My Number cards (and My Number health insurance cards), for identity verification without the need for an external card reader. It supports a wide range of business scenarios utilizing NFC, such as access control, attendance management, and cashless payment terminals in restaurants. Additionally, as a tablet for business use, it is equipped with features and specifications that are in high demand during operation. It includes our original business efficiency app "NFC Optimizer for Windows," our proprietary "Battery Protection Mode" for safe operation during AC constant power supply, and a feature that allows the product's power to be turned ON/OFF in conjunction with the power breaker, all achievable without incurring development costs for dedicated software, only requiring costs for the kitting process.

We will introduce the ultrasonic microscopy observation of semiconductor packages that we conduct. Due to storage conditions and mounting conditions, delamination may occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be detected from the appearance. By using ultrasonic microscopy, we can clearly capture the internal structure of the package and contribute to reliability evaluation.

Here is an example of observing the adhesive condition through a metal plate using an ultrasonic microscope. An ultrasonic microscope can confirm internal information that cannot be seen from the outside, as long as the ultrasonic waves can pass through. We observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip came off after reliability testing. Please refer to the PDF document for details and results of the observation.