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  6. [Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy

[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy

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last updated:Jan 22, 2026

アイテス
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If it is something that ultrasound can penetrate, you can check internal information that cannot be confirmed from the appearance!

Here is an introduction to a case study observing the adhesive condition through a metal plate using an ultrasonic microscope. The ultrasonic microscope can reveal internal information that cannot be confirmed from the exterior, as long as the ultrasonic waves can pass through the material. After reliability testing, we observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip had come off. Please refer to the PDF document for details on the observations and results. [Case Overview] - Observation of the adhesive layer between the metal and the chip - Observation of the adhesion condition between the metal and the adhesive *For more details, please download the PDF or feel free to contact us.

    Analysis and prediction system
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[Analysis Case Study] Observation of Adhesion State Through Metal Plates Using Ultrasonic Microscopy

SAT image_metal plate.png
SAT image_metal plate.png
  • Related Link - https://www.ites.co.jp/

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Observation of adhesive conditions through a metal plate using an ultrasonic microscope.

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Observation of adhesive conditions through a metal plate using an ultrasonic microscope.

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Here is an example of observing the adhesive condition through a metal plate using an ultrasonic microscope. An ultrasonic microscope can confirm internal information that cannot be seen from the outside, as long as the ultrasonic waves can pass through. We observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip came off after reliability testing. Please refer to the PDF document for details and results of the observation.

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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