Strain measurement of power module package resin.

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, one mounted on a circuit board and the other not mounted.
In the mounted module, a slight delay in temperature change was observed, which correspondingly resulted in a slower change in strain.
This is believed to be due to the delayed transfer of heat to the module when it is mounted.
[Test Overview]
■ Strain Gauge Used
- Foil strain gauge for composite materials: Suitable linear expansion coefficient 1x10^-6, base 15x5mm
■ Test Conditions
- Hold at -40℃ for 3 hours → 15℃/min → Hold at 80℃ for 3 hours
* 5 cycles

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