Strain measurement of power module package resin.

Measuring the strain behavior of sealing resin under thermal cycling using a strain gauge!

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, one mounted on a circuit board and the other not mounted. In the mounted module, a slight delay in temperature change was observed, which correspondingly resulted in a delayed change in strain. This is believed to be due to the slower heat transfer to the module when it is mounted. 【Test Overview】 ■ Strain Gauge Used - Foil strain gauge for composite materials: compatible linear expansion coefficient 1x10^-6, base 15x5mm ■ Test Conditions - Hold at -40℃ for 3 hours → 15℃/min → hold at 80℃ for 3 hours * 5 cycles * For more details, please download the PDF or feel free to contact us.

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