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  6. Strain measurement of power module package resin.

Strain measurement of power module package resin.

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last updated:Jun 05, 2025

アイテス
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Measuring the strain behavior of sealing resin under thermal cycling using a strain gauge!

We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, one mounted on a circuit board and the other not mounted. In the mounted module, a slight delay in temperature change was observed, which correspondingly resulted in a delayed change in strain. This is believed to be due to the slower heat transfer to the module when it is mounted. 【Test Overview】 ■ Strain Gauge Used - Foil strain gauge for composite materials: compatible linear expansion coefficient 1x10^-6, base 15x5mm ■ Test Conditions - Hold at -40℃ for 3 hours → 15℃/min → hold at 80℃ for 3 hours * 5 cycles * For more details, please download the PDF or feel free to contact us.

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Strain

Strain measurement of power module package resin.

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Strain measurement.png
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Strain measurement of power module package resin.

Strain measurement of power module package resin.

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Total solutions for the reliability of semiconductor products.

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Analysis of the assembly joint of the implementation components

Analysis of the assembly joint of the implementation components

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The state of analysis techniques, starting with defect analysis of joints, adhesion, and implementation parts.

The state of analysis techniques, starting with defect analysis of joints, adhesion, and implementation parts.

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Environmental testing in a high-power constant temperature and humidity chamber.

Environmental testing in a high-power constant temperature and humidity chamber.

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Power cycle testing and characteristic evaluation

Power cycle testing and characteristic evaluation

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Observation of temporal changes associated with reliability testing.

Observation of temporal changes associated with reliability testing.

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Power semiconductor analysis services

Power semiconductor analysis services

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The relationship between materials and heat - Introduction to thermal analysis

The relationship between materials and heat - Introduction to thermal analysis

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Strain measurement in thermal shock testing

Strain measurement in thermal shock testing

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Measurement of moisture absorption distortion

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Strain measurement of power module package resin.

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We would like to present the results of strain measurements conducted by attaching strain gauges and thermometers to the surfaces of power modules, one mounted on a circuit board and the other not mounted. In the mounted module, a slight delay in temperature change was observed, which correspondingly resulted in a slower change in strain. This is believed to be due to the delayed transfer of heat to the module when it is mounted. [Test Overview] ■ Strain Gauge Used - Foil strain gauge for composite materials: Suitable linear expansion coefficient 1x10^-6, base 15x5mm ■ Test Conditions - Hold at -40℃ for 3 hours → 15℃/min → Hold at 80℃ for 3 hours * 5 cycles

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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