Cross-sectional observation of substrate-mounted components (1) to (6)

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metal microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Parts and Materials

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and problems not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point and a helpful resource for our customers in resolving issues. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other Software

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

With our advanced technology, we can also create cross-sections of highly challenging samples!

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation quite challenging. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing examples of aluminum welding observations. Internal observations through X-ray fluoroscopy and CT scans provide clearer insights after cross-section preparation!

Here is a case study of the observation of aluminum spot welds. Internal observation using X-ray radiography revealed voids within the weld, and internal observation using X-ray CT confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching, we were able to observe the condition of the weld more clearly. 【Summary】 ■ Internal observation using X-ray radiography - Conducted non-destructive testing and X-ray radiographic observation - Voids were observed within the weld ■ Internal observation using X-ray CT - Conducted non-destructive testing and X-ray CT observation - Confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section tailored to the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing a case study on the cross-section preparation of large samples (65mm × 28mm) and the observation of their internal structures!

We present an observation case of a large sample (expansion valve) measuring 65mm × 28mm. This sample uses magnetic materials, and due to distortion in the images during SEM observation, we primarily conducted observations using an optical microscope. From the appearance and X-ray radiographic observation, it was found that there are some areas that are not visible in the X-ray. 【Overview】 ■ Appearance and X-ray radiographic observation ■ Cross-sectional observation using an optical microscope *For more details, please refer to the PDF document or feel free to contact us.

• others

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within acceptable standards. The evaluation criteria after the solder durability test can be individually established based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• others

Three types of Pb-free soldered products are subjected to reliability tests! We will introduce the main objectives of each test and the results of cross-sectional observations.

We would like to introduce the cross-sectional observation of Pb-free solder after the reliability tests conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints, such as monitoring crack propagation, the TC test, which allows for cross-sectional observation after each cycle, is recommended. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

[To the owners of parking lots and parking lot construction companies] "I am worried about the possibility of colliding with pedestrians when exiting the parking lot..." Among vehicle entrances to parking lots, stores, residences, and factories, those particularly facing sidewalks or roadways are expected to pose risks of dangerous incidents such as pedestrian collisions and vehicle-to-vehicle accidents. To alleviate such concerns, Hotron proposes a [Vehicle Exit Warning Sensor] that detects vehicle departures at various sites and alerts the surrounding area with LED lights and buzzers. The system consists of a simple configuration of "Sensor" + "Controller" + "Switching Power Supply (24V)" + "LED Rotating Light." *When using the exit warning system, we kindly ask that you arrange for the switching power supply (24V), LED rotating light, control panel, circuit breaker, etc. Since it can be retrofitted, it can also be used for existing parking lot entrances. [Contents Included] ○ Exit Warning System Configuration ○ Comparison Table of Exit Warning Sensors ○ Four Modes ○ Wide Range of Applications ○ Customer Feedback ○ Appearance Diagram / Specifications ◎ For more details, please contact us or download the catalog.

In recent times, there has been a growing interest in infection control measures and facility hygiene management. Our company offers non-contact sensor products that are recommended for commercial facilities, food factories, and nursing and caregiving facilities. 【Sensors for Automatic Doors】 ● Light Touch Sensor HA-T401 … When you wave your hand in front of the automatic door, the sensor detects the movement and opens or closes the door. This is recommended for making doors with touch switches non-contact. ● Hand Wave Sensor PF-R5, PF-U2, DHS-1 … Opens and closes the automatic door by waving your hand in front of the sensor. ● Foot Switch PF-01S/01D/03S/05 … Opens and closes the automatic door by placing your foot in the opening. 【Access Control System】 ● Face Recognition + Unmanned Temperature Measurement DS Series … Allows for face recognition along with mask detection and body temperature measurement simultaneously. ● Automatic Disinfectant Spray Dispenser PHW-03B … Automatically sprays disinfectant when you wave your hand in front of the sensor. 【Nursing and Care Sensors】 ● Infrared Bed Exit Sensor "Just Place It Pole-kun" … This bed exit sensor is installed next to the bed and notifies via nurse call when the subject enters the detection range. ◎ For more details, please download the catalog or contact us.

As the new year begins, I would like to extend my heartfelt congratulations on your continued prosperity. I sincerely appreciate your exceptional support throughout the year. This is the STJ Group (Santec Telecom Japan, STJ Rentec). Now, I am pleased to announce that we will be opening our "Transceiver & Smartphone Rental Shop" simultaneously at three locations nationwide on January 26 (Monday)! ■ List of Services to be Offered - Same-day pickup/return of rental equipment - Usage explanations and demonstrations of rental equipment - Wireless solution consultation desk - Mobile BPO service counter As a special promotion to celebrate the opening of the rental shop, we are currently running a special price campaign for rental equipment pickup at the shop! For more details, please contact us!

This is the Agricultural Division of Sumitomo Forestry Greenery Co., Ltd. In our division, we manufacture and sell potting soil for agricultural, horticultural, and greening purposes. In the future, we would like to regularly introduce our products through the Nōsan Girl Letter.

We would like to inform you about our participation in the IT Trend EXPO 2026 Spring. 《Exhibition Information》 With the concept of "New encounters will change the way we work tomorrow," one of the largest online exhibitions in the industry will be held. NTT TechnoCross will be exhibiting in the Human Resources Comprehensive category. We have prepared numerous discussions and sessions featuring special guests who are active on television, allowing even those who are usually busy to efficiently gather information on products and services related to IT and DX. Additionally, the first 10,000 participants will receive a 500 yen Amazon gift card. Please be sure to register early. 《Exhibition Overview》 March 3 (Tuesday) to March 7 (Saturday), 2026, online (free: pre-registration required) 《Participation Registration》 https://it.expo.it-trend.jp/key/opl7kgdj *Please register (free) by clicking "Receive Ticket / Proceed to Participation Registration" at the above URL.