Feature article: "Latest Trends in BGA Assembly Board Inspection - Hybrid Testing of Flying Probe Testers and JTAG Testing" has ranked in the overall ranking of the Manufacturing Catalog.

We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

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We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

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It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

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It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

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This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

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―― Is attendance management becoming a "burden" without you realizing it? A seminar to quickly learn about common issues and their solutions ―― We will be holding our attendance management web seminar in October, which takes place several times a year! The content is new, so whether you have participated in our webinars before or not, please feel free to join us. Date and Time: October 15 (Wednesday) 13:00- October 22 (Wednesday) 11:00- *Both days will cover the same content *Please check the link below for registration. In this seminar, we will recreate common situations in the workplace in a short drama format for easy understanding, and introduce specific solutions to each issue. This content is especially recommended for those who think, "I'm not struggling now, but I want to know information for the future." Common workplace "situations" can be a trigger for improvement. We will clearly present the challenges and countermeasures of attendance management. Recommended for: ❏ Those who take a long time to compile monthly attendance ❏ Those who tend to postpone compliance with legal revisions ❏ Those who currently have no major complaints but want to know hints for improvement ❏ Those who want to refer to initiatives and examples from other companies

On Monday, September 22, the Japan Meteorological Agency announced its three-month forecast for October to December. Due to the continued influence of conditions similar to the La Niña phenomenon until around December, the westerly winds are expected to flow more to the north than usual from October to early November, making it likely that warm air will cover the entire country. From late November to December, the westerly winds are expected to meander southward near Japan, and there may be periods when the winter pressure pattern strengthens. In December, the region is likely to be affected by cold air, and temperatures in western and eastern Japan are expected to be around or lower than the average for the season. For more details, please visit our website.

PTC Japan will support the CAR and DRIVER team, a car magazine founded in 1978, which will participate in the 36th "Media Challenge Roadster Endurance Race" held at Fuji Speedway on Saturday, October 4, 2025, continuing from last year.

PTC announced today the release of an AI assistant that supports Arena's Product Lifecycle Management (PLM) and Quality Management System (QMS). The Arena AI Assistant provides context-specific expertise and optimal operational methods in a conversational format in real-time for tasks related to Product Lifecycle Management (PLM) and Quality Management (QMS). This enables user teams to realize value in a shorter amount of time.

The seventh installment of the beginner-friendly 3D CAD Creo Parametric tutorial series focuses on features suitable for designs using frames, such as aluminum and sheet metal. It allows for easy realization of 3D solid structures.