Feature article: "Latest Trends in BGA Assembly Board Inspection - Hybrid Testing of Flying Probe Testers and JTAG Testing" has ranked in the overall ranking of the Manufacturing Catalog.

We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

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We will create new value through the mutual complementarity of ICT and BST.

In-circuit testing with flying probe testers excels at inspecting the electrical characteristics of implemented electronic components in analog circuits. However, components that cannot be probed make electrical testing difficult, and functional testing of digital circuits is challenging. On the other hand, boundary scan testing allows for quick interconnection testing between LSI pins and on-board programming for FPGAs, but it can only test digital circuits around ICs that comply with the boundary scan standard, and it also requires dedicated fixtures for connections. At Takaya Corporation, we possess technology that uses flying probes instead of fixtures that connect 4 to 5 scan-compatible pins and measuring instruments required for boundary scan testing. This allows for boundary scan testing even when the counterpart of a boundary scan-compliant IC is a non-boundary scan-compliant IC or passive components (such as connectors), by enabling the flying probe to function as a virtual boundary scan cell. With a single flying probe tester, it is possible to conduct comprehensive testing of both digital and analog circuits, thereby significantly enhancing testing efficiency compared to before.

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It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry.

We have completely revamped the platform compared to the conventional model, increasing the probe movement speed by up to 50% and dramatically improving contact position accuracy. Our new high-precision, wide-range measurement system, along with the groundbreaking 4-head 6-flying probe mechanism, significantly reduces inspection costs and enhances quality in the assembly process, regardless of substrate variety or production volume. ★You can bring your own substrates for evaluation tests at our demo rooms in Okayama headquarters and Tokyo branch★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

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It is a board inspection device capable of ultra-fast in-circuit testing at a top-class level in the industry. (Supported board size for inspection: up to 985×610)

The APT-1340J maintains its basic performance while expanding the compatible board size to W635×D610mm. Additionally, by adding an optional split inspection function, it can inspect long boards up to W985×D610mm. It can accommodate components with a height of 60mm and board weights of up to 10kg, making it suitable for inspecting boards used in automotive, aerospace, and medical devices, as well as power supply boards and probe cards, which are larger and heavier. ★You can bring your boards to our demonstration room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests, including creating inspection programs, inspecting actual boards, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below. *For product information, please download the PDF or feel free to contact us.*

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This is a flagship model that arranges probe heads above and below, enabling simultaneous in-circuit testing of both sides of the substrate.

Four probes are arranged on the top side of the substrate and two on the bottom side. Each probe can move freely and at high speed, achieving an astonishing inspection speed that is world-class in standard. By using the upper and lower flying probes simultaneously, a combination inspection of up to six probes allows for simultaneous contact inspection at both points on the top and bottom sides of the substrate. This significantly expands the inspection range and further accelerates inspection time. It is equipped with a wealth of features and boasts world-class standards in speed and positioning accuracy. ★You can bring your substrate to our demo room at our Okayama headquarters for evaluation testing★ We can conduct a series of tests including the creation of inspection programs, inspections using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

• Measurement and Inspection

The probe heads are arranged above and below, allowing for simultaneous in-circuit testing of both sides of the substrate. (Supported substrate size for inspection: up to 985×610)

The simultaneous use of upper and lower flying probes allows for a combination inspection of up to 6 probes, enabling the inspection of components that can make contact at both points on the top and bottom of the substrate. This model boasts world-class standards in speed and positioning accuracy while expanding the compatible substrate size to W635×D610mm. Additionally, by adding an optional split inspection function, it can also inspect long substrates up to W985×D610mm. It can accommodate component heights of up to 60mm and substrate weights of up to 10kg, making it suitable for inspecting substrates used in automotive, aerospace, and medical devices, as well as power boards and probe cards, which are larger and heavier. ★Evaluation tests can be conducted by bringing in substrates to the demo room at our Okayama headquarters★ A complete testing process is possible, including the creation of inspection programs, testing using actual substrates, and summarizing evaluation results. If you are interested, please apply through the 'Contact Us' section below.

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Hotron's "HA Series" is a high-performance doorway monitoring sensor. Even for high doors of 4.0m, it ensures safety while proposing an open and inviting entrance with its doorway monitoring function. 【Surface-Mounted Type HA-400】 ○ Safe and comfortable passage is achievable even with high doors, from lightweight doors to large commercial facilities and office buildings. ○ Maximum installation height of 4.0m! It features a high-density area function with 60 detection spots. 【Recessed Type HA-520】 ○ With a flat finish that does not compromise the aesthetics of the building, it ensures a wide area for safe and comfortable passage. ○ Easy replacement from older models of our own, enhancing sensor performance! 【Lower Surface-Mounted Type HA-430】 ○ With a design that minimizes protrusion and presence, it enables safe and comfortable passage even with high doors. ○ Detailed detection areas can be set while maintaining high density according to the site conditions. 【Ceiling-Mounted Type HA-260】 ○ An industry-first pull-down method provides a flat finish for ceiling-mounted sensors that do not compromise the aesthetics of the building. ○ The detection area achieves a wide coverage with high density of 72 detection spots! ◎ For more details, please contact us or download the catalog.

In facilities operating nurse call systems, we have made bed exit sensors wireless, allowing them to notify in conjunction with the nurse call system. By simply connecting the mat sensor "Foldable Thin Matt-kun," the body movement call "Ugo-kun," and the wheelchair body movement call "Ayumi-chan" to the transmitter HB-RS, you can make the bed exit sensor wireless. The infrared sensor "Just Place Pole-kun" has the transmitter HB-RS built-in. This helps prevent accidents caused by falls, slips, or wandering, contributing to the efficiency of medical operations. 【Features】 ○ Wireless conversion by simply connecting existing sensors to the transmitter HB-WSK. ○ Bed exit sensors notify wirelessly in conjunction with the nurse call system. ○ Up to 5 transmitters can be registered with one receiver. ○ The communication distance between the transmitter and receiver is approximately 10 meters. ◎ For more details, please contact us or download the catalog.

On February 24 (Tuesday), the Japan Meteorological Agency announced its three-month forecast for March to May. In the vicinity of Japan, the upper-level westerlies are expected to flow more to the north than usual, making it likely to be covered by warm air. As a result, above-average temperatures are predicted for March and April in regions excluding Okinawa and Amami, and nationwide in May. With an increase in warm days, there may also be days when it feels hot enough to sweat during the daytime. On sunny days, ultraviolet rays are likely to be strong, so please take precautions such as wearing hats and using sunscreen. For more details, please visit our website.

We held the "2nd World Model and Its Surroundings" online, hosted by our company. This time, Mr. Ishii presented the latest paper by LeCun, the proponent of the world model, and our representative, Mr. Omasa, presented the DiWA model. After the presentations, various questions were raised by the participants, leading to discussions on the architecture of the world model, the latest trends, and the potential applications of the world model in 3D representation and future predictions.

Grace Solar looks forward to meeting you at the PV EXPO Solar Power Exhibition, which will be held at Tokyo Big Sight from March 17 (Tuesday) to March 19 (Thursday), 2026. Grace Solar will present a comprehensive solar mounting solution optimized for Japan's diverse terrain and project requirements, exploring the future of Japan's green energy alongside leaders in the global energy industry. Venue: Tokyo Big Sight Date: March 17 (Tuesday) to March 19 (Thursday), 2026 Booth Number: E13-22