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  6. Special Feature Article Published in the Electronics Packaging Technology Journal

Special Feature Article Published in the Electronics Packaging Technology Journal

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last updated:Nov 19, 2024

タカヤ
タカヤ
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We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view it here.

Featured Content ■ Latest Trends in BGA Implementation Board Inspection Hybrid Inspection of Flying Probe Testers and JTAG Testing Andor System Support Co., Ltd. / Masazumi Taniguchi Takaya Co., Ltd. / Kohei Yanagida Overview BGA (Ball Grid Array) components have become widely used in various electronic devices, ranging from consumer products to industrial equipment, and more recently, automotive devices. However, a reliable method for inspecting boards with BGA components (hereafter referred to as BGA implementation boards) has not been established. This is because every inspection method has its advantages and disadvantages, and it is impossible to conduct a complete test using only one inspection method. Therefore, inspecting BGA implementation boards has become a challenge for many companies. In this article, we will introduce the latest technological trends in hybrid inspection that combines flying probe testers and JTAG (Joint Test Action Group) boundary scan as one solution to this issue. 1. Introduction 2. Inspection and Challenges of BGA Implementation Boards 3. Possibilities of Electrical Testing 4. In-Circuit Testing 5. JTAG Boundary Scan Testing 6. Hybrid Testing 7. Conclusion

    Measurement and Inspection
IPROS4492474389424957610.jpg

Special Feature Article Published in the Electronics Packaging Technology Journal

IPROS4492474389424957610.jpg
IPROS4492474389424957610.jpg
  • Related Link - https://www.takaya.co.jp/fa/news/other/ept202307re…

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Benefits arising from mutual complementarity - Significant improvement in test coverage - Improved test throughput - Possible reduction in implementation area of digital circuit regions in board design (TP reduction) - More accurate fault diagnosis possible - Onboard programming or FPGA writing possible

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Feature Article: Latest Trends in BGA Implementation Board Inspection - Hybrid Testing with Flying Probe Testers and JTAG Testing

Feature Article: Latest Trends in BGA Implementation Board Inspection - Hybrid Testing with Flying Probe Testers and JTAG Testing

TECHNICAL
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Collaboration between in-circuit testing and boundary scan testing

Collaboration between in-circuit testing and boundary scan testing

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Dual-Side Flying Probe Tester APT-1600FD

Dual-Side Flying Probe Tester APT-1600FD

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Flying Probe Tester APT-1340J/APT-1400F-SL

Flying Probe Tester APT-1340J/APT-1400F-SL

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Dual Side Flying Probe Tester APT-2600FD

Dual Side Flying Probe Tester APT-2600FD

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Flying Probe Tester APT-2400F

Flying Probe Tester APT-2400F

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We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)

  • Seminar・Event

Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results in electronics packaging technology. Starting in 2023, a hybrid format of on-site participation and online attendance has been implemented, attracting around 700 participants, primarily from industry and academia involved in electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)

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We will be exhibiting a poster at the 29th Okayama Research Park Research and Exhibition Presentation.

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The "29th Okayama Research Park Research and Exhibition Presentation" will be held with the aim of presenting and disseminating research results related to the "Okayama Research Park." A poster exhibition titled "Latest Trends in Hybrid Testing Systems Combining JTAG Testing and Flying Probe Testers" will be featured. Companies, universities, and institutions interested in industry-academia-government collaboration are warmly invited to participate. Poster exhibitions related to research seeds (Industry-Academia Collaboration Model Booth + 8 fields) 《Fields》 ○ Precision Processing and Machinery ○ Materials Technology ○ Semiconductors ○ AI, IoT, and Robotics ○ Medical, Bio, and Food ○ Environment, Chemistry, and Energy ○ Measurement and Inspection ○ Others ■ Organizer Okayama Prefecture, Okayama Prefectural Industrial Promotion Foundation ■ Support Okayama University, Okayama Prefectural University, Okayama University of Science, Kibi International University, Kawasaki Medical University, Kawasaki University of Medical Welfare, Shujitsu University and Shujitsu Junior College, Notre Dame Seishin University, Tsuyama National College of Technology, China Vocational Ability Development University, IPU International Pacific University, Okayama Research Park Incubation Center (ORIC)

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Feature article: "Latest Trends in BGA Assembly Board Inspection - Hybrid Testing of Flying Probe Testers and JTAG Testing" has ranked in the overall ranking of the Manufacturing Catalog.

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Our company's information has entered the TOP 100 in the Ipros ranking. --- 【Aggregation Period】 August 16, 2023 - August 22, 2023 ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ ■ Ipros Manufacturing ━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━━ ★ Catalog Ranking (out of 226,377 items)  ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ ̄ 44th place: Featured Article: Latest Trends in BGA Mounted Circuit Board Inspection - Hybrid Testing with Flying Probe Tester and JTAG Testing --- Thank you very much to everyone who viewed it.

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タカヤ

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Information and Communications

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Founded in 1894 as a textile company, Takaya Textile expanded and established its electronics division in 1966, starting the assembly of transistor radios. Today, in addition to contract manufacturing services (EMS) related to electronic devices, the company actively manufactures and sells various electronics, including in-circuit testers (printed circuit board inspection devices) and RFID (a technology that enables information exchange through short-range wireless communication from tags containing IC information), as well as IT consulting and system solutions, both domestically and internationally. We continue to evolve as a corporate group that contributes to societal development, with textiles and electronics as our dual pillars.

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