Multi-target sputtering device [MiniLab-125] compatible with Φ8" SiC coating, equipped with a 1000℃ heater stage! Compact size!

Multi-Target Multi-Sputtering Device (Compatible with Φ8inch Substrates)
- Simultaneous deposition of three components + one component Pulse DC sputtering
- Flexible arrangement of RF500W and DC850W power supplies to three target cathodes (Source1, 2, 3)
- Equipped with a 5KW Pulse DC power supply → used with a dedicated cathode (4)
- Substrate heating stage Max 800℃ (SiC coated heater can achieve Max 1000℃)
- MFC x 3 systems (Ar, O2, N2) for reactive sputtering
- Main chamber RIE etching stage RF300W
- LL chamber <30W low power controlled soft etching
- Unique "Soft-Etching" technology reduces substrate damage through substrate bias
- Touch panel or Windows PC operation: all operations can be performed via touch panel/PC without dispersing control
- Equipment installation dimensions: 1,960(W) x 1,100(D) x 1,700(H) mm
- Multi-chamber type can also be manufactured.
● Mixed specifications for resistance heating deposition, organic material deposition, EB deposition, PECVD, etc. are also possible.
![Multi-Parallel Sputtering Device [MiniLab-S125]](https://image.www.ipros.com/public/news/image/1/053/100513/IPROS09263764224142550225.jpeg?w=280&h=280)

Inquiry about this news
Contact Us OnlineMore Details & Registration
Details & Registration
Related Links
◉ Supports sputtering, deposition (resistive heating, organic, EB), annealing, plasma etching, etc. ◉
Modular design allows flexible combinations of components (source hybrid type, multi-chamber also possible)
◉ Compact, space-saving design (width 1,200 x depth 560mm)
◉ Excellent operability: intuitive interface, all operations can be centrally managed via a touch panel without dispersion.