Ultrasonic microscope observation of semiconductor packages

Ultrasonic microscope observation of transistors! It is possible to check the delamination conditions at various locations even at the same focus.

We would like to introduce the ultrasonic microscope observation of semiconductor packages that we conduct. Due to storage conditions and mounting conditions, delamination can occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be confirmed from the appearance. By using an ultrasonic microscope, we can clearly capture the internal structure of the package and contribute to reliability evaluation. 【Features】 ■ Ultrasonic microscope observation from the chip side - By changing the focal position, areas that were previously not visible can be seen, even with the same sample. ■ Ultrasonic microscope observation from the die pad side - Delamination conditions can be confirmed at various locations, even with the same focus. *For more details, please download the PDF or feel free to contact us.

• Analysis and prediction system

The "HA-T Series" is an energy-saving automatic door sensor that opens only for those who want to enter, whether on a busy street or in a narrow passageway. The automatic door opens simply by bringing your hand close, addressing hygiene concerns even in facilities used by a large number of people. Depending on the application and installation location, you can choose between "Non-vision Mount Type/HA-T401" and "Non-vision Built-in Type/HA-T520." 【Recommended for such places!】 ☑ Entrance facing a busy passageway ☑ Presence of counters or signs near the door ☑ Buildings facing narrow passageways ☑ Buildings that prioritize aesthetics ☑ Hospitals and facilities that consider hygiene ☑ Large facilities with many doors 【Features】 ● Adaptable to various door types with four detection spot settings ● Reduces unnecessary opening and closing to minimize power consumption, contributing to energy-saving effects ● Equipped with a light touch function, allowing the door to open and close simply by waving your hand, ensuring hygiene ● Can also be used as a wide detection range non-vision infrared sensor ◎ For more details, please download the materials or contact us.

Our seminar, “Back-Office DX in the Era of Digital Salary Payments,” was featured on HAB News Squash (Hokuriku Asahi Broadcasting) This seminar was co-hosted by Kort Valuta Inc. and Schult Social Insurance & Labor Consultant Office, and was held on January 19, 2026, for companies based in Ishikawa Prefecture https://www.hab.co.jp/news/article/202601217724.php As cashless payments continue to expand, digital salary payments are gaining attention across Japan. The coverage highlights current challenges faced by regional SMEs, including limited information and know-how, as well as key considerations and benefits for implementation. ▶️The seminar video featured in the news is now available on YouTube https://www.youtube.com/watch?v=GlHcFSTrFHM

Our company will release the 10.1-inch Windows tablet "TW2A-NF9LTA" equipped with an NFC reader/writer in March 2026. This product is a business-oriented model that comes standard with a dedicated OS for specific applications, "Windows 11 IoT Enterprise LTSC 2024 (64bit)," which enables long-term stable operation. With the built-in NFC reader, users can simply hold their IC cards, including My Number cards (and My Number health insurance cards), for identity verification without the need for an external card reader. It supports a wide range of business scenarios utilizing NFC, such as access control, attendance management, and cashless payment terminals in restaurants. Additionally, as a tablet for business use, it is equipped with features and specifications that are in high demand during operation. It includes our original business efficiency app "NFC Optimizer for Windows," our proprietary "Battery Protection Mode" for safe operation during AC constant power supply, and a feature that allows the product's power to be turned ON/OFF in conjunction with the power breaker, all achievable without incurring development costs for dedicated software, only requiring costs for the kitting process.

We will introduce the ultrasonic microscopy observation of semiconductor packages that we conduct. Due to storage conditions and mounting conditions, delamination may occur between the metal parts (die pad) and the package resin in semiconductor packages. Delamination inside the package is a defect that significantly affects product quality, but it cannot be detected from the appearance. By using ultrasonic microscopy, we can clearly capture the internal structure of the package and contribute to reliability evaluation.

Here is an example of observing the adhesive condition through a metal plate using an ultrasonic microscope. An ultrasonic microscope can confirm internal information that cannot be seen from the outside, as long as the ultrasonic waves can pass through. We observed the condition of the adhesive remaining on the metal plate from the metal side in a sample where the chip came off after reliability testing. Please refer to the PDF document for details and results of the observation.