KAKUGATA | Square Silicone Substrate for Advanced Packaging
Addressing the challenges of warping and fine wiring in the PLP process, as well as the thermal issues of the package, by leveraging the properties of silicon.
"Large panelization and miniaturization. Have you given up on achieving both?" Mitsubishi Material's "KAKUGATA" is a square silicon substrate that supports sizes up to 600×600mm. Leveraging the low thermal expansion, high rigidity, and high thermal conductivity derived from silicon, as well as the high flatness and low TTV close to that of wafers, it contributes to improving process challenges associated with the scaling up and miniaturization of FO-PLP and 2.xD packages. Furthermore, by accommodating large panel sizes up to 600×600mm, it also contributes to the enlargement of package sizes and increased productivity. We propose its use for advanced package organic interposer forming carrier substrates, large core substrates, and silicon interposer applications. For more details, please check the Mitsubishi Material official website and consult us through the inquiry form.
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basic information
- Square silicon substrates compatible with sizes up to 600×600mm - High rigidity suppresses warping, enabling stable production of large panels - High thermal stability reduces die shift - Low surface roughness specification suitable for forming fine organic interposers (Sa<0.2nm) - Improvement of thermal issues through compatibility with silicon dies due to high thermal conductivity and thermal expansion characteristics derived from silicon - Compatible with FO-PLP and 2.xD advanced package applications - Contributes to the increase in package size and productivity through large panels
Price information
Please contact us through the official Mitsubishi Materials website.
Delivery Time
※The delivery date may vary depending on the quantity, so please contact us through the Mitsubishi Materials official website.
Applications/Examples of results
■Organic Interposer Formation Carrier Substrate - Suppresses warping of large panels - Contributes to reduced die shift - Improves fine RDL formation ■Core Substrate - Reduces warping and cracking risks - Contributes to increased thermal design flexibility - Aids in scaling up ■Silicon Interposer - Supports high-density connection design - Contributes to enhanced heat dissipation - Aids in scaling up the interposer
Detailed information
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●KAKUGATA
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High flatness and low TTV.
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●Support for large panels
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●Benefits of Implementation: - Improved yield - Stabilization of processes - Increased productivity
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●Examples of Use ・Carrier substrate for RDL formation ・Core substrate ・Silicon interposer
Company information
Advanced Products Division provides a wide range of high-performance materials and devices to customers worldwide. Our product portfolio includes semiconductor-related materials such as low-alpha solder and anti-reflective coatings for photoresists, as well as other high-quality products for precision assembly applications. In the field of environmental technologies, we are also driving the development of innovative and practical products that contribute to the realization of a sustainable next-generation society. Our portfolio includes infrared heat-shielding coatings for automotive and architectural applications, temperature sensors that enhance the performance and safety of electric vehicles (xEV), and lightning protection components that improve the reliability of social infrastructure. Furthermore, our advanced assembly materials, featuring high heat resistance, low electrical resistance, and excellent thermal conductivity, have earned strong recognition both in Japan and overseas. These products are expected to serve as key drivers of our future growth.
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