Mitsubishi Materials Corporation List of News Articles

Mitsubishi Materials Corporation has developed one of the world's largest square-shaped silicon substrates, the "Square Silicon Substrate," which achieves high flatness and low surface roughness. Next-generation semiconductor packages utilizing chiplet technology, which has been gaining attention in recent years, are being scaled up to approximately 100mm square. In the manufacturing process of semiconductor packages, using conventional φ300mm silicon wafers as carrier substrates for placing semiconductor chips in Wafer-Level Packages (WLP) presents a challenge, as the small area and circular shape of the wafers make it difficult to efficiently fit packages onto the wafer substrate. To address this challenge, our company has developed a large-area square-shaped "Square Silicon Substrate" by combining the casting technology for large silicon ingots that our group has cultivated over the years with our unique processing technology. The "Square Silicon Substrate" contributes to improving productivity in the semiconductor field by being utilized as a carrier substrate in semiconductor manufacturing processes and as an interposer material for semiconductor packages.