ナミックス List of Products and Services

With the increasing density and integration of devices, high thermal conductivity materials are in demand. Additionally, Pb solder materials have not yet been established. Therefore, by using MO technology, we have developed a high thermal conductivity die attach that allows for low-temperature sintering. A thermal conductivity of 170 W/mK has been achieved, and the brittleness of the Ag sintered body has been improved through reinforcement with resin. We have samples available for provision, so please contact us for consultation. 【Features】 ■ Uses MO technology ■ Enables low-temperature sintering ■ Thermal conductivity of 170 W/mK ■ Sample provision available *For more details, please refer to the PDF document or feel free to contact us.

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The "Diatatch Agent" is a thermosetting conductive material that is versatile for applications such as die bonding for bare chips, adhesive for LEDs, bonding electrodes and lead wires, and high thermal conductivity. Our trademark "Unimec" is a conductive material that can be treated at low temperatures, consisting of a thermosetting resin primarily based on epoxy resin, with specially processed in-house conductive powder uniformly dispersed. By developing and blending conductive powders, we can manufacture products with various characteristics. 【Features】 ■ Versatile applications ■ Thermosetting conductive material ■ Can be treated at low temperatures *For more details, please refer to the PDF document or feel free to contact us.

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The "Passive Component Terminal Electrode Material" is a thermally sintered conductive material tailored for the terminal electrodes of surface-mounted passive components such as chip resistors, MLCCs, and chip inductors. We are promoting the lead-free transition of our products. Our trademark "Himec" is a sintered conductive paste in which metal particles (Ag, Cu, Ni) and inorganic additives are dispersed in a vehicle, adjusted for paste characteristics according to the type of substrate, processing conditions, and application methods. 【Features】 ■ Material for terminal electrodes ■ Thermally sintered ■ Promotes lead-free transition *For more details, please refer to the PDF document or feel free to contact us.

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The "Passive Component Internal Electrode Material" is a thermally sintered conductive material tailored for the internal electrodes of surface-mounted passive components such as MLCCs and chip inductors. Our trademark "Himec" is a sintered conductive paste that disperses metal particles (Ag, Cu, Ni) and inorganic additives in a vehicle, adjusted for paste characteristics according to the type of substrate, processing conditions, and application methods. 【Features】 ■ Thermally sintered ■ Low resistance ■ High printing accuracy ■ Various shrinkage rates *For more details, please refer to the PDF document or feel free to contact us.

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"Surface Mount Adhesive" is a thermosetting conductive adhesive that can be processed at low temperatures compatible with lead-free mounting and has high-temperature solder reflow resistance. Our trademark "Unimec" is a conductive material that can be processed at low temperatures, consisting of a thermosetting resin primarily based on epoxy resin, with specially treated in-house processed conductive powder uniformly dispersed. The development and blending of conductive powders enable the production of products with various characteristics. 【Features】 ■ Low temperature processing possible ■ Thermosetting conductive material ■ Compatible with lead-free mounting ■ High-temperature solder reflow resistance *For more details, please refer to the PDF document or feel free to contact us.

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The "Passive Component Terminal Electrode Agent" is a thermosetting conductive material suitable for application processes such as printing and dipping, used as terminal electrode material for surface-mounted components like chip resistors, MLCCs, and tantalum capacitors. Our trademark "Unimec" is a low-temperature processable conductive material that uniformly disperses specially treated in-house processed conductive powder in a thermosetting resin primarily based on epoxy resin. The development and blending of conductive powders enable the manufacture of products with various characteristics. 【Features】 ■ Low-temperature processable ■ Thermosetting conductive material ■ Ideal for application processes such as printing and dipping *For more details, please refer to the PDF document or feel free to contact us.

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"Die Attach Adhesive" is one of the methods for mounting bare chips, where the circuit side of an IC chip with a metal bump electrode is adhered to the opposite side of the mounting substrate using a dispensing type insulating material for the mounting technology. [Features] - Insulating material for encapsulating semiconductor chips - One of the methods for bare chip mounting - Dispensing type *For more details, please refer to the PDF document or feel free to contact us.

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The "Dam & Fill Material" is an insulating material primarily used for wire bonding implementations such as CSP/BGA, which forms sharp dams and performs sealing through smooth filling between wires. It has excellent moldability and is a highly reliable material that achieves reduced warpage of the package. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Sharp dam shape ■ Excellent moldability ■ Achieves reduced warpage of the package ■ High reliability *For more details, please refer to the PDF document or feel free to contact us.

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The "Low-Temperature Curing Adhesive" is a product of Namix, a trademark of "Chipcoat," which engages in the research, development, manufacturing, and sales of electrochemical materials. This product is designed for high-precision bonding and fixing, as well as for bonding components with low heat resistance, and it is an insulating adhesive that can cure at temperatures below 100°C. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Low-temperature curing type *For more details, please refer to the PDF document or feel free to contact us.

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The "adhesive for camera modules" is an insulating adhesive that allows for a process with minimal shrinkage due to UV curing. It is intended for bonding and fixing that require high positional accuracy, as well as for bonding materials with low heat resistance. 【Features】 ■ Insulating material for encapsulating semiconductor chips ■ Curing by UV irradiation ■ Low-temperature curing ■ High reliability *For more details, please refer to the PDF document or feel free to contact us.

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The 'Pre-supply Type Underfill Material (NCP)' is a pre-supply type paste underfill material. After applying it to the substrate or interposer, the chip is thermocompression bonded (TCB) and sealed. This material is capable of improving productivity and controlling fillet width (compatible with KOZ). [Features] ■ Insulating material for encapsulating semiconductor chips ■ Pre-supply type paste ■ Improved productivity ■ Capable of controlling fillet width *For more details, please refer to the PDF document or feel free to contact us.

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The "CSP/BGA board-level underfill material" is a reinforcement material designed to improve shock resistance and heat cycle durability when secondary mounting packaged bare chips onto a motherboard. It is a capillary flow type material that is injected and sealed, characterized by high reliability and high productivity. 【Features】 ■ Insulating material for injecting and sealing semiconductor chips ■ Capillary flow type ■ Excellent injectability for narrow gaps ■ High reliability, high productivity, and high moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

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The "Underfill for Chipon Film" is one type of bare chip mounting, where the circuit side of an IC chip with metal bump electrodes is directly electrically connected to the mounting substrate. It is a chip coat that is injected and sealed using a capillary flow type. Among insulating materials, it has good injectability into narrow gaps and excellent moisture resistance, and it is a material compatible with flexible substrates primarily used in mounting substrates such as LCD drivers. 【Features】 ■ One type of bare chip mounting ■ Insulating material for sealing semiconductor chips ■ Capillary flow type ■ Excellent injectability into narrow gaps ■ Excellent moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

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The "Adfurema" adhesive film (for machinery and measuring instruments) is a registered trademark of Namix, which conducts research, development, manufacturing, and sales of electrochemical materials. This thin-layer insulating adhesive film is suitable for high-precision bonding in various materials and shapes, and is a thermosetting resin film in an unreacted state that allows for flow control. [Features] - Ideal for high-precision bonding - Low-temperature curing - Film thickness: 40, 80µm *For more details, please refer to the PDF document or feel free to contact us.

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The "Insulating Encapsulating Film for Semiconductors" is a product of Namix, a company engaged in the research, development, manufacturing, and sales of electrochemical materials, under the trademark "Adflemma." It is a pre-supply type film underfill material that is laminated onto a substrate or interposer, followed by thermal compression bonding (TCB) of the chip, and then encapsulated. This material is capable of improving productivity and controlling fillet width (compatible with KOZ), and it can also be supplied to wafers. 【Features】 ■ Pre-supply type film ■ Improved productivity ■ Capable of fillet width control ■ Can be supplied to wafers *For more details, please refer to the PDF document or feel free to contact us.

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The "High-Performance Insulating Adhesive Film for Electronic Components and Modules" is a product of Namix, a company engaged in the research, development, manufacturing, and sales of electrochemical materials, under the trademark "Adofrema." It features a thin-layer insulation with low dielectric constant and low dielectric loss tangent, making it optimal for GHz band high-frequency characteristics. It has excellent filling properties for uneven surfaces at low temperature and low pressure, and it is a thermosetting resin film in an unreacted state that can achieve high adhesion, high heat resistance, and high reliability. It is applicable to electronic components for RF modules that require miniaturization and low profile. 【Features】 ■ Low dielectric constant and low dielectric loss tangent ■ Thin-layer insulation: 5–30µm thickness ■ Excellent filling properties for uneven surfaces at low temperature and low pressure ■ Thermosetting resin film ■ Applicable to electronic components for RF modules *For more details, please request materials or view the PDF data available for download.

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The "High Frequency and High-Speed Transmission FPC and Rigid Circuit Board Insulating Adhesive Film" is a product of Namix, which conducts research, development, manufacturing, and sales of electrochemical materials under the trademark "Adfrema." It features a thin-layer insulation with low dielectric constant and low dielectric loss tangent, making it optimal for high-frequency characteristics in the GHz range. It has excellent filling properties for uneven surfaces at low temperature and low pressure, and it can exhibit high adhesion and high heat resistance as an unreacted thermosetting resin film. In addition to being used as an interlayer insulating material and build-up material for FPCs, it is also suitable for MEMS structural materials and process materials, and it is compatible with laser and plating processing. 【Features】 - Low dielectric constant and low dielectric loss tangent - Thin-layer insulation: 5 to 30 µm thick - Excellent filling properties for uneven surfaces at low temperature and low pressure - Thermosetting resin film - Suitable for laser and plating processing *For more details, please refer to the PDF document or feel free to contact us.

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The "Coating Agent for Chip Resistor Protection" is a product of Namix, which conducts research, development, manufacturing, and sales of electrochemical materials under the trademark "Overcoat." It is an insulating material for the protective coat (G2) of chip resistor elements, offering excellent printability and moisture resistance. 【Features】 ■ Insulating material for the protective coat of chip resistor elements ■ Excellent printability and moisture resistance *For more details, please refer to the PDF document or feel free to contact us.

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The "Underfill for Flip Chip" is a chip coating that is injected and sealed using a capillary flow type in the implementation technology where the circuit surface of an IC chip with metal bump electrodes is directly electrically connected to the mounting substrate side. It is one of the bare chip mounting methods and can accommodate flip chip technology, which is advancing in various applications including CPUs and graphic LSIs. 【Features】 ■ One of the bare chip mounting methods ■ Insulating material that seals semiconductor chips ■ Capillary flow type *For more details, please refer to the catalog or feel free to contact us.

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