Insulating adhesive film for high-frequency, high-speed transmission FPC and rigid circuit boards

Thin films and high-insulation adhesive films that respond to the high-frequency, thin, and compact demands of semiconductors and passive components.

The "High Frequency and High-Speed Transmission FPC and Rigid Circuit Board Insulating Adhesive Film" is a product of Namix, which conducts research, development, manufacturing, and sales of electrochemical materials under the trademark "Adfrema." It features a thin-layer insulation with low dielectric constant and low dielectric loss tangent, making it optimal for high-frequency characteristics in the GHz range. It has excellent filling properties for uneven surfaces at low temperature and low pressure, and it can exhibit high adhesion and high heat resistance as an unreacted thermosetting resin film. In addition to being used as an interlayer insulating material and build-up material for FPCs, it is also suitable for MEMS structural materials and process materials, and it is compatible with laser and plating processing. 【Features】 - Low dielectric constant and low dielectric loss tangent - Thin-layer insulation: 5 to 30 µm thick - Excellent filling properties for uneven surfaces at low temperature and low pressure - Thermosetting resin film - Suitable for laser and plating processing *For more details, please refer to the PDF document or feel free to contact us.

others