substrate Product List and Ranking from 24 Manufacturers, Suppliers and Companies | IPROS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

substrate Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. モリシン工業 本社 Gifu//Building materials, supplies and fixtures manufacturers
  2. サクサテクノ Tokyo//Building materials, supplies and fixtures manufacturers
  3. 三和電子サーキット Osaka//others
  4. 4 瀬戸チップ工業 Aichi//Trading company/Wholesale
  5. 5 カネテック 東日本営業部　東京営業所 Tokyo//Building materials, supplies and fixtures manufacturers
Go to Company Ranking

substrate Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Vacuum chuck (standard type hole diameter φ0.5 and above) モリシン工業 本社
  2. Piezoelectric Buzzer (DC) 'ESZ-25C/ESZ-26B' サクサテクノ
  3. Super antibacterial ball 瀬戸チップ工業
  4. Vacuum chuck (made of honeycomb panel) [ultra-fine hole type φ0.03mm] モリシン工業 本社
  5. 4 Ceramic balls for crushing 伊藤製作所

substrate Product List

31～54 item / All 54 items

Displayed results
[Data] Shirutoku Report No. 13 # Characteristic Impedance

[Data] Shirutoku Report No. 13 # Characteristic Impedance

The concept of distributed constant circuits is becoming necessary! An explanation of characteristic impedance and substrate design.

★★Shirutoku Report: Useful Information You Should Know★★ In this report, we will introduce the "characteristic impedance (wiring impedance)" of printed circuit boards. With the recent increase in the speed of digital signals, the design of digital circuit boards now requires the concept of distributed constant circuits rather than lumped constant circuits, making it necessary to consider the characteristic impedance of the board in the design. So, how do we determine the characteristic impedance of a printed circuit board? [Contents] ■ Characteristic Impedance of Printed Circuit Boards *For more details, please refer to the PDF document or feel free to contact us.*

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Vacuum chuck (made of aluminum honeycomb panel)

Vacuum chuck (made of aluminum honeycomb panel)

By converting conventional vacuum chucks, such as porous types, into aluminum honeycomb panels, significant cost reductions can be achieved!

Morishin's adsorption aluminum honeycomb panels have a simpler structure compared to conventional adsorption panels (such as porous or cast products), and they allow for cost reduction through lightweight materials, making them a very popular product. We can manufacture a wide range of sizes from approximately 100mm x 100mm to about 2000mm x 4000mm, and it is also possible to set multiple adsorption areas on a single adsorption panel. We can accommodate everything from custom-made products starting from one piece to mass-produced items, so please feel free to contact us. For requests for quotes, inquiries about products, or to request catalogs, case studies, or cut samples, please visit our website (http://www.morishin.com/). You can view the PDF data of the case studies from the "Download" section.

  • Aluminum alloy door
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Media support ceramic ball

Media support ceramic ball

Achieve high cost performance!

We handle ceramic balls with various characteristics. You can view a wide range of sizes and achievements in our catalog.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Tohoku University Technology: Metal / ceramic composite material: T16-100

Tohoku University Technology: Metal / ceramic composite material: T16-100

Possible to produce high laser absorption metal powder with finely dispersed ceramic on the surface, and metal/ceramic composite material having complex shape!

Metal and ceramic repel each other when mixing due to their positive surface charge. So since they are dispersed away, the composite can not be formed. The conventional technology uses a binder composed mainly of polyvinyl alcohol to glue metal and ceramic. This is then sintered in order to make a composite powder. 　However, the binder reduces the functionality due to compositional change (specifically, mechanical property deterioration, optical absorbance decrease, etc.) and handling during production is difficult. 　This invention is able to easily make ceramic / metal composite by using carbon nanotube (CNT). Application of various powder to bulk material is expected, such as sintered material and composite material by 3D printer. It is also possible to create a pure composite of metal / CNT, and this technology is expected to improve the antioxidation property of the base metal material.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Tohoku University Technology: Oxide ceramics – carbon composite and its manufacturing process: T15-104

Tohoku University Technology: Oxide ceramics – carbon composite and its manufacturing process: T15-104

Manufacturing Li4Ti5O12-carbon composite by using microwave at low cost!

Ceramics – carbon composite having multi-function is developed in the recent years. However, the composite is heated at high temperature for a long time during the manufacturing process so the particles are sintering between them and the Li4Ti5O12 nano particles able to generate high power cannot be obtained. Moreover, the synthesis method is complex and uses expensive raw materials so the manufacturing cost is high. 　This invention can provide oxide ceramics – carbon composite and its manufacturing process with reduced cost. This invention manufacturing process is to mix raw material of oxide ceramics made by LiO2 and TiO2 with carbon and fire with microwave in order to create Li4Ti5O12 carbon composite. As result, Li4Ti5O12 crystalline particle which is an oxide ceramics having particle diameter lower than 250nm; and oxide ceramics – carbon composite having above mentionned carbon bond on the crystal plane (111) and (200) of the oxide ceramics – carbon composite were obtained.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
High-speed signal, high-density substrate 'IVH substrate'

High-speed signal, high-density substrate 'IVH substrate'

Supports IVH substrates from 4 layers to 20 layers! Component mounting on the surface of the IVH section is also possible.

We would like to introduce our high-speed signal and high-density substrate, the "IVH substrate." By using the IVH structure, we can achieve high density tailored to our customers' needs. Additionally, we can accommodate low dielectric materials for high-frequency applications. Please feel free to consult us when needed. 【Features】 ■ Supports IVH substrates from 4 layers to 20 layers ■ High density tailored to customer needs ■ Component mounting on the surface of the IVH part is possible, compatible with chip-on-hole ■ Impedance control is possible ■ Can accommodate low dielectric materials for high-frequency applications *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Bonded substrate

Bonded substrate

Miniaturization of devices, heat dissipation applications, and printed circuit boards tailored to individual product implementations!

Our company is capable of providing printed circuit boards with special structures tailored to your requirements, thanks to our unique three-layer substrates and the bonding structures of materials and copper foil. Applications include device substrates and substrates with bonded structures of metals (such as copper foil and aluminum) or materials. Printed circuit boards for devices require structures that accommodate miniaturization, heat dissipation, and the specific implementation needs of individual products. 【Applications】 ■ Device substrates ■ Substrates with bonded structures of metals (such as copper foil and aluminum) or materials *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
End face electrode substrate "End face through-hole substrate"

End face electrode substrate "End face through-hole substrate"

Cutting the through holes at the edge of the substrate with contour processing! Suitable for mounting holes and power supply units, etc.

The "end face through-hole substrate" is created by cutting the through-holes at the edge of the substrate using contour processing. In conventional end face through-holes, copper burrs were generated during cutting, but thanks to our unique process, we can provide end face through-holes without burrs even with router processing. Please feel free to contact us when you need our services. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter substrates ■ Module substrates, etc. *For more details, please refer to the PDF materials or feel free to contact us.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

End face electrode substrate "Narrow Pitch End Face Through Hole Substrate"

We can also accommodate a pitch of 0.6mm and a hole diameter of φ0.15mm! We provide through holes with burr-free end faces.

We would like to introduce our "Narrow Pitch Edge Through-Hole Board." Thanks to our unique process, we can form edge through-holes with a narrow pitch. We can provide edge through-holes without burrs, regardless of the cutting method used, even for copper burrs generated during cutting. 【Applications】 ■ Mounting holes ■ Power supply units ■ Converter boards ■ Module boards, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
End face electrode substrate "Partial etching through-hole substrate"

End face electrode substrate "Partial etching through-hole substrate"

Only the copper in the cut section of the through hole is removed by etching! We can accommodate board thicknesses from 0.04 to 0.3 mm.

We would like to introduce our "Partial Etching Through-Hole Substrate." In printed circuit boards used as substrate for devices, after component mounting, through-holes may be diced and used as soldering electrodes. However, cutting the copper plating of the through-holes inevitably leads to burr formation. Our company enables the production of cut through-hole substrates without burrs by selectively etching away only the copper at the cut portions of the through-holes. [Applications] ■ Substrate boards for devices with through-hole electrodes, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
CAD design and prototype implementation

CAD design and prototype implementation

We provide support from CAD design of printed circuit boards and various analyses to prototype implementation.

We would like to introduce our "Pattern Design (CAD Design) and Prototype Implementation." By conducting transmission line analysis, it is possible to implement countermeasures from the design stage. Additionally, "Prototype Implementation" allows for the direct output of the bill of materials from CAD, enabling the arrangement of components and other tasks in parallel with PCB design and manufacturing, thereby reducing the total lead time. 【CAD Software】 Zuken: CR-8000/Design Force, CR-5000/Board Designer, CR-5000/PWS Cadence: Allegro X Designer, OrCAD(R) PCB Designer Professional 【Analysis Software Used】 ■ SI Analysis - Siemens: Hyper Lynx SI - Cadence: Allegro PCB SI ■ EMI Countermeasures and PI Analysis - NEC: DEMITASNX *For more details, please refer to the PDF document or feel free to contact us.

  • Drawing, tracing, CAD
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

[Thin Plate Bending Circuit Board] A substrate with a thickness of 0.1mm or less can be used by bending!

Using FR-4 material with a thickness of 0.1mm or less, it can be bent and used like a flexible circuit board. Initial costs can be addressed at a low price.

Our "Thin Plate Bending Circuit Board" uses glass epoxy substrates (FR-4) with a thickness of 0.1mm or less, making it suitable for applications that require several bending actions during bending and assembly. Thanks to router processing, there is no need for coverlay processing molds or outline processing molds. This helps keep initial costs low from prototyping to mass production, allowing for inexpensive product manufacturing. It is suitable for circuit boards that require component mounting and bending, and can be used in industrial equipment, LED lighting, and wearable devices (such as VR headsets and controllers). 【Features】 ■ Ideal for applications that require several bending actions during bending and assembly ■ More cost-effective for products and initial costs compared to flexible circuit boards (compared to our offerings) ■ No need for coverlay processing molds or outline processing molds ■ Capable of handling small to medium production volumes *For more details, please refer to the documentation. Feel free to contact us with any inquiries. *Documentation for special circuit boards other than thin plate bending circuit boards is also available for download.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Substrate "HIGH POWER LED PWB"

Substrate "HIGH POWER LED PWB"

Covers a wide range from near ultraviolet 360 to 740 nm! Uses light-resistant white ink!

The "HIGH POWER LED PWB" is a product of Shirato Print Wiring Manufacturing Co., Ltd., which engages in the manufacturing of various printed circuit boards, circuit design of printed circuit boards, and assembly of electronic components. It has excellent light resistance, showing no degradation even after 2000 hours of exposure to deep ultraviolet light at 254nm. Due to its inorganic materials, it can withstand temperatures above 350°C. The base material can be selected from aluminum or copper. 【Features】 ■ The COB mounting section has an insulation withstand voltage of 2kV at 80μm ■ White ink with light resistance and reflectivity of over 90% ■ Covers a wide range in the near-ultraviolet region from 360 to 740nm ■ Withstands temperatures above 350°C due to inorganic materials ■ Patent pending *For more details, please request materials or view the PDF data available for download.

  • Safety and consumables
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Precision vice and vacuum chuck

Precision vice and vacuum chuck

A lineup of high-precision finishing ultra-precision machining vices and vacuum generators with built-in pressure reducing valves and check valves!

Super Tool offers "Precision Vices and Vacuum Chucks." We have a wide range of products including high-precision finishing ultra-precision machining vices such as "SPV30H" and "SPV165H," as well as vacuum chucks like "SVA2025" and "SVA2540" that do not require a dedicated vacuum pump. Additionally, the vacuum generator "SVAG12" features an adjustable air pressure type that can be used with the factory's compressor. 【Product Lineup】 ■ Precision Vices - SPV 30H - SPV 80H - SPV120H - SPV165H, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • Prime movers, torque converters, hydraulic equipment, generators
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Planning/Design

Planning/Design

Japtech will continue to evolve in response to the ever-changing needs of its customers.

Our company actively participates in the development proposals for pachinko machines, which require diverse gameplay and production, as well as in planning and development projects, creating new products with free-thinking ideas. We quickly capture various information and consistently leverage unique ideas and concepts for groundbreaking product development. The design work that produces hit products is carried out in 2D and 3D using advanced computers. *For more details, please feel free to contact us.

  • others
  • Drawing, tracing, CAD
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
The technological capabilities of the Republic.

The technological capabilities of the Republic.

Craftsmanship is essential for making ceramic parts! Introducing processing techniques and equipment.

We would like to introduce the processing technologies and equipment owned by Kyowa Gai Co., Ltd. We possess "screw processing technology," as well as "manual lathe processing technology," "press processing technology," and "extrusion molding technology." We have refined our techniques to accommodate lighter and smaller sizes, and we can now handle sizes down to 1mm. Additionally, our equipment includes "shuttle kilns (L.P.G)," "electric kilns," "quick delivery firing kilns," and "hydraulic molding presses." 【Processing Technologies】 ■ Screw processing technology ■ Manual lathe processing technology ■ Press processing technology ■ Extrusion molding technology *For more details, please refer to the PDF document or feel free to contact us.

  • Wiring devices
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Piezoelectric buzzer (DC) 'ESZ-11-A/ESZ-11N-A'

Piezoelectric buzzer (DC) 'ESZ-11-A/ESZ-11N-A'

[Piezoelectric Type] Compliant with RoHS2! It is a non-contact type that generates sound by vibrating through an electronic circuit.

The "ESZ-11-A/ESZ-11N-A" is a compact, high-volume, low-current, and long-life buzzer. It is a non-contact type that generates sound by adhering a piezoelectric element to a metal diaphragm and vibrating it with an electronic circuit. Additionally, the "ESZ-11N-A" can be mounted to panels and other surfaces using the body nut. 【Features】 ■ Compact, high-volume, low-current, and long-life ■ Non-contact type that generates sound by adhering a piezoelectric element to a metal diaphragm and vibrating it with an electronic circuit ■ Can be mounted to panels and other surfaces using the body nut (ESZ-11N-A) ■ Compliant with RoHS2 *For more details, please refer to the PDF document or feel free to contact us.

  • Emergency alarm system
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Circuit board assembly and modification services

Circuit board assembly and modification services

If you are having trouble with circuit board assembly, please leave it to us.

We accept high-quality, short lead-time, and low-cost PCB assembly and modification for any substrate, including flexible, aluminum, ceramic, and copper. For prototype PCBs, we can accommodate components in any packaging, such as loose parts, sticks, and trays. We have a variety of CR components in different sizes and values in stock, and we can also handle mass production. Please feel free to contact us with your requests. 【For concerns like these】 ■ I want components assembled on a PCB with a special shape or material. ■ I want modification lines added to the PCB. ■ I need a quick delivery for a prototype. ■ I want to remove components from an assembled PCB and install different ones. ■ I have been turned away by other companies. ■ I am having trouble obtaining components. *For more details, please feel free to contact us.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
Lower price compared to ceramic and metal material products! Porous PE vacuum chuck.

Lower price compared to ceramic and metal material products! Porous PE vacuum chuck.

It is not only highly wear-resistant but also soft, making it difficult to put stress on the adsorbed work! Low price: 170,000 yen for a 200mm square.

We would like to introduce the "Porous PE Vacuum Chuck" that we handle. It is low-cost compared to ceramic and metal material products, and when clogging occurs in the porous material, it can be easily replaced with a spare part. Additionally, when using porous materials with an average pore diameter of less than 5μm, partial adsorption is possible, and it is not only excellent in wear resistance but also soft, making it difficult to apply stress to the workpiece being adsorbed. 【Features】 ■ Low-cost compared to ceramic and metal material products: 170,000 yen for 200*200 size ■ Approximately 80% lighter than ceramic and metal material products ■ Easy replacement with a spare part when clogging occurs in the porous material ■ Partial adsorption is possible when using porous materials with an average pore diameter of less than 5μm ■ Excellent wear resistance and softness make it difficult to apply stress to the workpiece being adsorbed *For more details, please refer to the PDF document or feel free to contact us.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration
World GaN Substrate Market Research Report 2022-2031

World GaN Substrate Market Research Report 2022-2031

Global GaN Substrate Market 2022-2031: Industry Analysis, Size, Share, Growth, Trends, Forecast

The market research report by Transparency Market Research conducts an investigation and analysis of the global GaN substrate market, organizing content such as the introduction, executive summary, market trends, analysis of related industries and key indicators, analysis by type (sapphire substrates, Si substrates, GaN substrates, diamond substrates), analysis by size (2-inch, 4-inch, 6-inch, 8-inch), analysis by application (transistors, RF devices, lasers, LEDs, others), analysis by end-user (IT & communications, consumer electronics, automotive, aerospace & defense, others), regional analysis (North America, Europe, Asia-Pacific, Middle East & Africa, South America), competitive assessment, and company information.

  • others
  • substrate

Added to bookmarks

Bookmarks list

Bookmark has been removed

Bookmarks list

You can't add any more bookmarks

By registering as a member, you can increase the number of bookmarks you can save and organize them with labels.

Free membership registration

Related Categories of substrate

COPYRIGHT © 2001-2026 IPROS CORPORATION ALL RIGHTS RESERVED.