Analysis software(3d) - List of Manufacturers, Suppliers, Companies and Products

Last Updated: Aggregation Period:Jul 23, 2025~Aug 19, 2025
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Analysis software Product List

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Supports ICP: Analysis Software 'Particle-PLUS'

"Particle-PLUS" is a plasma and rarefied fluid analysis software that excels in ICP and CCP analysis using particle methods.

"Particle-PLUS" is software suitable for research and development of devices using plasma, compatible with ICP and CCP. - Excels in simulations of low-pressure gases where fluid modeling is challenging - Calculation functions for inductive heating for ICP simulations - Advanced physical model analysis such as CCP and external circuit models - Capable of simultaneously simulating ICP and CCP - Supports 2D and 3D, efficiently analyzing complex models - As a strength of our in-house developed software, customization to fit customer devices is possible ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD), etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more *For more details, please feel free to contact us. sales@wavefront.co.jp

  • Scientific Calculation and Simulation Software
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[Case] 'Particle-PLUS' RF Magnetron Sputtering

An example of the 'Particle-PLUS' analysis of RF magnetron sputtering, which is one of the film formation methods for dielectric films using process plasma.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in plasma analysis within vacuum chambers and can perform simulations of film deposition rates at high speed. - It excels in low-pressure plasma analysis. - It is proficient in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - It supports 2D and 3D, allowing for efficient analysis even with complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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[Example] 'Particle-PLUS' DC Magnetron Sputter

A case study of the DC magnetron sputtering method using process plasma, known as 'Particle-PLUS'.

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - It excels in plasma analysis within vacuum chambers, enabling high-speed simulations of film deposition rates and more. - It is proficient in plasma simulations in low-pressure gases, where calculations using fluid models are challenging. - It supports 2D and 3D, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *For more details, please feel free to contact us.

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[Example] Particle-PLUS AC Magnetron Sputtering

Introduction of analysis examples using "Particle-PLUS": "AC Magnetron Sputtering Simulation"

"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need to simulate the entire device. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.

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[Case Study] Plasma Analysis of "Particle-PLUS" Dual Frequency CCP

Introduction to Particle-PLUS Analysis Case: "Plasma Analysis of Dual Frequency CCP" Simulation Case

This is a case study on plasma analysis of CCP (Capacitively Coupled Plasma) devices. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform high-speed simulations even when multiple electrodes are present or when applying overlapping frequencies. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, efficiently handling complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

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[Example] Cleaning Process by Particle-PLUS: CCP

Introduction of Particle-PLUS Analysis Case: "Cleaning Process by CCP" Simulation Case

This is an analysis case regarding CCP (Capacitively Coupled Plasma) etching, which is one of the representative dry etching methods. Particle-PLUS specializes in plasma analysis within vacuum chambers and can quickly simulate etching rates and other parameters. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is challenging. - Supports both 2D and 3D analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *For more details, please feel free to contact us.

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Heat Transfer Fluid Analysis Software WindPerfectDX

Have you ever seen the wind? 【For the architecture and civil engineering industry】 Heat transfer fluid analysis software WindPerfectDX

●WindPerfectDX2012 Edition2 Released! The software has been reborn as a tool that can solve problems in the fields of architecture and civil engineering, ranging from simple to complex and large-scale, with easy operations for airflow and temperature. ―――――― ◆Features 1. Wind environment and external airflow simulation 2. Heat island simulation 3. Natural ventilation simulation 4. Wind load simulation (planned for release) 5. Other simulations (rainproofing and snowproofing issues, performance verification of cool bits, and other thermal fluid-related problems) ―――――― <Simple interface, 3D CAD data import function, and diverse result visualization features> - With an easy-to-use interface, built-in various data, and excellent 3D graphics visualization capabilities, it is widely usable from beginners in analysis to heavy users of CFD. - By incorporating CAD data import and CFD parts functions, it strongly supports simulation operations in BIM. - Equipped with numerous convenient functions for various analyses, such as wind damage rank evaluation, radiation calculation, PMV evaluation, condensation judgment, heat island, parameter evaluation, and heat balance check for airflow and heat.

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Fiber Orientation Image Analysis Software ExFactAnalysisFiber

Fiber Orientation Distribution 3D Image Analysis Software ExFact Analysis Fiber

"ExFact Analysis for Fiber" is a three-dimensional image analysis software that evaluates the three-dimensional structure and morphology of elongated fibers, such as those found in textiles, fuel cells, and wires, when imaged using techniques like X-ray CT. By using imaging technologies such as X-ray CT, confocal laser microscopy, and TEM tomography to capture industrial products and materials, it can continuously output cross-sectional images and construct three-dimensional representations. By vectorizing these three-dimensional images and describing their complex structures, it allows for statistical evaluation and analysis of the morphology and distribution of particles and voids, as well as the orientation of fibers, from various perspectives. 【Features】 ■ Continuously outputs cross-sectional images and constructs three-dimensional representations ■ Statistically evaluates and analyzes the morphology and distribution of particles and voids, as well as the orientation of fibers from various perspectives *For more details, please refer to the catalog or feel free to contact us.

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  • Non-destructive testing
  • Structural Survey

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Example: Warpage Countermeasures for Connectors in Injection Molding

By collaborating with 3D TIMON, we automatically adjust the thickness of the solid element model, thereby suppressing warping deformation.

Here is an example of minimizing warpage by changing the thickness of solid elements. The analysis was conducted using the "Basis Vector Method," which modifies the shape by moving the nodes of the finite element model without using CAD. Several patterns (basis vectors) of the desired shape were prepared from the initial model and combined. As a result of the optimization, the sum of squares of warpage improved by 33% to 4.9480e-004 compared to the initial shape, and the maximum warpage (mm) improved by 12% to 3.8607e-002. [Case Overview] ■ Optimization Conditions - Design Variables: Thickness A, B - Sampling: Initially LHS 20 points, Approximate optimal solution + 10 recommended points - Approximate Model: CRBF (Convolutional RBF) ■ Analysis: Basis Vector Method *For more details, please refer to the PDF document or feel free to contact us.

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Welding analysis software SYSWELD/VisualAssembly

Provides means for preliminary examination through analysis and process evaluation for various challenges.

SYSWELD/VisualAssembly is a welding analysis solution that makes it possible to predict the quality of welds, including product strength and durability. It reproduces the physical phenomena caused by welding and heat treatment, such as heat input conditions and material properties, and analyzes and predicts the stresses, strains, and overall deformations that occur in the weld area while considering phase transformations. Additionally, a specialized analysis method focused on predicting welding deformations is available, allowing for the examination of optimal welding processes in the early stages of development with "Visual Assembly." By appropriately selecting analysis methods corresponding to the model, efficient analysis can be conducted. 【Features】 ■ Optimal solutions tailored to specific applications ■ User-friendly, excellent GUI, and powerful input/output interfaces ■ Compatible with ESI's integrated GUI platform, Visual Environment *For more details, please refer to the PDF materials or feel free to contact us.

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Hyperspectral Data Principal Component Analysis Software Evince

Hyperspectral data principal component analysis software evince <Trial version available>

Evince is the ultimate software for analyzing hyperspectral and multispectral images. By using multivariate modeling techniques, it allows for the investigation, analysis, and understanding of the chemical information hidden in hyperspectral images and data. The user-friendly graphical interface enables visualization of data in a wide variety of ways, making data exploration quick and effective. Data Processing - Automatic unfolding of 3D image data hypercubes - Principal Component Analysis (PCA) - Partial Least Squares Regression (PLS) - PLS Discriminant Analysis (PLS-DA) - SIMCA modeling - Object-based analysis; – Spectral characteristics – Structural parameters such as shape and size – Particle distribution - Spectral preprocessing; – Standard Normal Variate (SNV) Savitzky-Golay smoothing and derivative multiplicative signal correction (MSC)

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General-purpose acoustic analysis system "Actran" *Free case study collection available!

Sound simulation in 3D detailed models is now possible! Analyze radiated sound and noise generated from various structures! Large-scale acoustic analysis is also possible.

"Actran" is a general-purpose tool for acoustic analysis. By selecting the optimal solver (Finite Element Method, Finite Volume Method, Statistical Energy Analysis) according to the target, it enables analysis tailored to objectives (accuracy, cost) and development phases. It also allows for understanding the sound propagation mechanism through animation and auditory prediction using sound playback functionality. 【Features】 ■ Supports both structural vibration sound and fluid sound ■ Coupled calculations between flow, structural vibration, and sound ■ Compatible with not only FEM (Finite Element Method) but also SEA (Statistical Energy Analysis) ■ Includes thermal and simplified CFD functions, considering the effects of background differences on sound propagation. ■ Large-scale acoustic analysis with hundreds of millions of degrees of freedom, essential for high-frequency analysis beyond the audible range ■ Supports three fluid sound sources (Lighthill, Mohring, pressure fluctuations on structural surfaces) ■ Supports random sound fields. Acoustic transmission loss analysis using diffuse boundary conditions is also possible. ■ Capable of both frequency response and time history response analysis ■ Analysis using experimental data is also possible ■ Optimization through automated continuous execution of parameter studies *For more details, please refer to the PDF materials or feel free to contact us.

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3DEXPERIENCE SIMULIA <buckling, special elements, etc.>

We also ensure consistency with the user interface used by design engineers!

"3DEXPERIENCE SIMULIA" is an enhanced version of "Generative Part Structural Analysis" that includes multiple analyses for static, frequency, and buckling analysis. It is a product tailored to the needs of analysis specialists, while also ensuring consistency with the user interface used by design engineers. With "SIMULIA," designers can perform advanced analyses themselves, allowing for repeated cycles of design, analysis, and redesign to improve quality. 【Features】 ■ Equipped with multiple analyses for static, frequency, and buckling analysis ■ Ensures consistency with the user interface used by design engineers ■ Improves product performance and reduces physical prototypes ■ Allows designers to perform advanced analyses themselves ■ Enables repeated cycles of design, analysis, and redesign to enhance quality *For more details, please refer to the PDF document or feel free to contact us.

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3DEXPERIENCE SIMULIA <Nonlinear Analysis>

Provides advanced contact features! Models the nonlinear elasticity of material plasticity and superelastic materials.

The "3DEXPERIENCE SIMULIA" extends the capabilities of "CATIA V5 Analysis," enabling more advanced simulations that include nonlinear effects. It primarily models the plasticity of materials such as metals and the nonlinear elasticity of hyperelastic materials like rubber. In "Nonlinear Structural Analysis," it also offers more advanced contact features, such as automatic creation of contact surfaces based on the proximity of geometries. 【Features】 ■ Enables more advanced simulations that include nonlinear effects (such as large displacements and material nonlinearity) ■ Primarily models the plasticity of materials such as metals and the nonlinear elasticity of hyperelastic materials like rubber ■ Provides more advanced contact features, including automatic creation of contact surfaces based on the proximity of geometries *For more details, please refer to the PDF document or feel free to contact us.

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3DEXPERIENCE SIMULIA <Contact Condition Definition>

Accurately represent the interactions and connections of components! Designers can perform advanced analysis themselves.

"3DEXPERIENCE SIMULIA" improves product performance through virtual testing before creating physical prototypes, reduces the need for material prototypes, and drives technological innovation. It expands the capabilities of "Generative Part Structural Analysis," enabling analysis of assemblies and individual parts. In assembly analysis, it accurately represents the interactions and connections between parts, allowing for more realistic and precise simulations. 【Features】 - Enables analysis of assemblies and individual parts - In assembly analysis, accurately represents the interactions and connections between parts for more realistic and precise simulations - Allows designers to perform advanced analyses themselves - Enables repeated design, analysis, and redesign to improve quality *For more details, please refer to the PDF materials or feel free to contact us.

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