Last Updated： Aggregation Period:Jul 23, 2025～Aug 19, 2025
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Fiber Orientation Distribution 3D Image Analysis Software ExFact Analysis Fiber Case Studies
ExFact ForFiber is a three-dimensional image analysis software. For example, it is recommended for analyses such as the following: - Structural analysis of glass fibers, chemical fibers, etc. - Evaluating the internal structure of fuel cells - Researching thin fiber-like materials such as wires
By executing simulations of a 3D multi-body system and predicting its dynamic response, we optimize the performance of movable products.
Altair MotionSolve is an integrated solution for the analysis and optimization of multi-body systems. MotionSolve provides powerful modeling, analysis, visualization, and optimization capabilities for simulating complex systems, contributing to understanding and improving product performance through the execution of kinematic analysis, dynamic analysis, static analysis, quasi-static analysis, linear analysis, and vibration analysis.
"Particle-PLUS" is a plasma and rarefied fluid analysis software that specializes in magnetron sputtering devices using the particle method.
"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - It can perform advanced physical model analyses such as CCP and external circuit models. - It specializes in plasma simulations in low-pressure gases, where fluid modeling is challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis of complex models. - As a strength of our in-house developed software, it can perform standard CCP and magnetron sputtering calculations, as well as customization to fit customer devices. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.
Analysis of gas flow under low pressure conditions. Analysis software compatible with rarefied gases (rarefied fluids).
**Features** - By adopting an unstructured mesh, it is possible to compute the exact shape of complex real devices. - High parallel efficiency allows for quick computation results even for large-scale shapes. - Since it employs a particle method, unlike fluid models, it can obtain a converged solution even with poor quality computational grids. - With comprehensive technical support, even those new to simulation or busy with experiments can reliably achieve results. **Supports Various Cases** - Simulation of rarefied gas flow in a vacuum chamber. - Simulation of thin film generation in semiconductor manufacturing. - Chemical vapor deposition (CVD), organic light-emitting diode (OLED), molecular beam epitaxy (MBE). - Film deposition simulations involving chemical reactions like CVD. **Outputs Various Calculation Results** - Calculation of chemical reactions. - Calculation of chemical reactions from Arrhenius-type reaction data. - Calculation of dissociation, recombination, and molecular (atomic) exchange reactions. - Multiple reaction equations can be set up on the GUI. *For more details, please refer to the catalog or feel free to contact us.*
![[Example] 'Particle-PLUS' Cylindrical Magnetron Device](https://image.www.ipros.com/public/product/image/e7c/2000505519/IPROS89051470833042551499.png?w=280&h=280)
An example of "Particle-PLUS" analysis of magnetron sputtering using a cylindrical target, which is one method for forming a strong film on the inside of a long cylinder.
"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.
![[Example] Particle-PLUS Opposing Target Sputter](https://image.www.ipros.com/public/product/image/e9b/2000513668/IPROS23162634189120626847.png?w=280&h=280)
Introduction of analysis examples using "Particle-PLUS": "Opposing Target Sputtering"
"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations of low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.
![[Example] Particle-PLUS 2 Frequency CCP](https://image.www.ipros.com/public/product/image/f09/2000513669/IPROS24703150742825763228.png?w=280&h=280)
Introduction of analysis examples using "Particle-PLUS" Particle-PLUS also allows for the calculation of overlapping two-frequency CCP.
"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations using fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's device is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *Please feel free to contact us for more details.
![[Example] "Particle-PLUS" Counter Target Sputtering](https://image.www.ipros.com/public/product/image/19d/2000545489/IPROS56615479397902732461.png?w=280&h=280)
Introduction of Particle-PLUS Analysis Case: "Simulation Case of Al Thin Film Fabrication Using Face-to-Face Target"
"Particle-PLUS" is a simulation software suitable for research, development, and manufacturing of devices and materials using plasma. - It specializes in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can quickly obtain results without the need for full device simulations. - It excels in plasma simulations for low-pressure gases, where calculations with fluid models are challenging. - It supports both 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various applications ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *Please feel free to contact us for more details.
![[Example] Mass analysis of the "Particle-PLUS" ion beam.](https://image.www.ipros.com/public/product/image/bc3/2000549609/IPROS12022605723456097496.png?w=280&h=280)
Introduction to Particle-PLUS Analysis Examples: "Ion Beam Mass Analysis and Electrostatic Acceleration" Simulation Case Study
"Particle-PLUS" is a simulation software suitable for the research, development, and manufacturing of devices and materials using plasma. - It excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - It specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - It supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive coupled plasma (CCP) - Dielectric barrier discharge (DBD) - Electrophoresis, etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us.
![[Example] "Particle-PLUS" RF Magnetron Sputtering](https://image.www.ipros.com/public/product/image/47f/2000679579/IPROS73831867780680859745.jpeg?w=280&h=280)
Introduction to Particle-PLUS Analysis Case: "RF Magnetron Sputtering Analysis" Simulation Case
This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates and other parameters at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, it can obtain results quickly without the need for full device simulations. - Specializes in plasma simulations for low-pressure gases, where fluid modeling is difficult. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing efficient analysis even for complex models. - As a strength of our in-house developed software, customization to fit customer devices is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.
![[Case Study] Particle-PLUS: RF Magnetron for Dielectric Targets](https://image.www.ipros.com/public/product/image/fa2/2000679587/IPROS13482455899988853210.jpeg?w=280&h=280)
Particle-PLUS Analysis Case Introduction: "RF Magnetron Sputtering Analysis of Dielectric Targets" Simulation Case
This is an analysis case of RF magnetron sputtering, which is one of the film deposition methods using process plasma. Particle-PLUS specializes in plasma analysis within vacuum chambers and can perform simulations of deposition rates and more at high speed. ◇ Features of 'Particle-PLUS' - Excels in low-pressure plasma analysis. - By combining axisymmetric models with mirror-symmetric boundary conditions, results can be obtained quickly without the need for full device simulations. - Specializes in plasma simulations in low-pressure gases, where calculations with fluid models are challenging. - Supports 2D (two-dimensional) and 3D (three-dimensional) analyses, allowing for efficient analysis of complex models. - As a strength of our in-house developed software, customization to fit the customer's equipment is also possible. ◆ Various calculation results can be output ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Density distribution/temperature distribution/velocity distribution of neutral gas and more. *Please feel free to contact us for more details.
"Particle-PLUS" is a plasma and rarefied fluid analysis software that excels in ICP and CCP analysis using particle methods.
"Particle-PLUS" is software suitable for research and development of devices using plasma, compatible with ICP and CCP. - Excels in simulations of low-pressure gases where fluid modeling is challenging. - Calculation functions for inductive heating for ICP simulations. - Advanced physical model analysis such as CCP and external circuit models. - Capable of simultaneously simulating ICP and CCP. - Supports 2D and 3D, efficiently analyzing even complex models. - As a strength of our in-house developed software, customization to fit customer devices is possible. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD), etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us at sales@wavefront.co.jp.
Analysis of gas flow under low-pressure conditions. Analysis software compatible with rarefied gases (rarefied fluids).
**Features** - By adopting an unstructured mesh, it is possible to compute the exact shape of complex real devices. - High parallel efficiency allows for quick computation results even for large-scale shapes. - Since it employs a particle method, unlike fluid models, it can achieve a converged solution even with poor-quality computational grids. - With comprehensive technical support, even those new to simulation or busy with experiments can reliably obtain results. **Supports Various Cases** - Simulation of rarefied gas flow in a vacuum chamber. - Simulation of thin film generation in semiconductor manufacturing. - Chemical vapor deposition (CVD), organic light-emitting diode (OLED), molecular beam epitaxy (MBE). - Film deposition simulations that include chemical reactions like CVD. **Outputs Various Calculation Results** - Calculation of chemical reactions. - Calculation of chemical reactions from Arrhenius-type reaction data. - Calculations of dissociation, recombination, and molecular (atomic) exchange reactions. - Multiple reaction equations can be set up on the GUI. *For more details, please refer to the catalog or feel free to contact us.*
"Particle-PLUS" is a plasma and rarefied fluid analysis software that is also skilled in 2-frequency CCP analysis using the particle method.
"Particle-PLUS" is a simulation software suitable for research and development of devices using plasma, compatible with CCP. - Excels in plasma simulation for low-pressure gases, where fluid modeling is challenging. - Advanced physical model analysis, including CCP and external circuit models. - Supports 2D and 3D, efficiently analyzing even complex models. - As a strength of our in-house developed software, it offers standard functions for CCP and magnetron sputtering calculations, as well as customization to fit customer devices. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitive Coupled Plasma (CCP) - Dielectric Barrier Discharge (DBD), etc. ◆ Outputs various calculation results ◆ - Potential distribution - Electron and ion density distribution/temperature distribution/generation distribution - Particle flux and energy flux to the walls - Energy spectrum of electrons and ions at the walls - Neutral gas density distribution/temperature distribution/velocity distribution, etc. *For more details, please feel free to contact us at information@wavefront.co.jp.
"Particle-PLUS" is a plasma and rarefied fluid analysis software that excels in 2-frequency CCP analysis using the particle method.
"Particle-PLUS" is a simulation software suitable for research and development of devices and equipment using plasma, compatible with CCP. - Excels in simulating low-pressure gases where fluid models are difficult to compute. - Advanced physical model analysis including CCP and external circuit models. - Supports 2D (two-dimensional) and 3D (three-dimensional) analysis, efficiently handling complex models. - As a strength of our in-house developed software, it not only includes standard functions for CCP and magnetron sputtering calculations but also allows customization to fit customer equipment. ◆ Supports various cases ◆ - Magnetron sputtering - PVD, plasma CVD - Capacitively coupled plasma (CCP) - Dielectric barrier discharge (DBD), etc. ◆ Outputs various calculation results ◆ - Potential distribution - Density distribution/temperature distribution/generation distribution of electrons and ions - Particle flux and energy flux to the wall - Energy spectrum of electrons and ions at the wall - Density distribution/temperature distribution/velocity distribution of neutral gas, etc. *For more details, please feel free to contact us at information@wavefront.co.jp.
