Substrate(fpc) - メーカー・企業と製品の一覧

更新日： 集計期間:Jan 07, 2026～Feb 03, 2026
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Substrateの製品一覧

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Printed circuit board "Flexible substrate"

Printed circuit board "Flexible substrate"

Fine pattern formation and support for high-density wiring compatible with small-diameter vias is also possible!

"Flexible printed circuit boards" are printed wiring boards formed on a flexible insulating film that can be significantly deformed, such as by bending. They excel in flexibility and bending characteristics, allowing for wiring in movable parts and three-dimensional wiring. Our company offers products that meet various needs, including single-sided FPC, double-sided FPC, and others. 【Features】 ■ Excellent bending and flexural properties ■ Ability to bend freely ■ Capable of wiring in movable parts and three-dimensional wiring ■ Supports fine pattern formation and high-density wiring compatible with small-diameter vias *For more details, please refer to the PDF document or feel free to contact us.

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  • Substrate

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Fine flexible circuit board

Fine flexible circuit board

Achieving fine pattern processing using methods such as etching and additive techniques!

FPC (Flexible Printed Circuit) boards are circuit boards with copper electrodes patterned on a polyimide film as the base material. Since the base substrate does not use organic materials such as adhesives, it can be used in high-temperature environments. Additionally, Howa Sangyo Co., Ltd. has achieved fine pattern processing that was not possible with conventional FPC boards using methods such as etching and additive processes. Fine patterning of less than 50μm is possible. Depending on the specifications, connection bumps can be formed on the pattern or the back side. Furthermore, by combining laser processing and plating technology, through-hole conduction processing on both sides is possible. For more details, please contact us or refer to the catalog.

  • glue
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  • Substrate

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Classic one-plate type! Stable electrical testing with motor drive!

Classic one-plate type! Stable electrical testing with motor drive!

The basic form of the electrical inspection system! It is used for electrical inspection of various substrates. (Rigid substrates, FPC, PCB, continuity testing, insulation testing, four-terminal testing)

This is a standard electric testing system of the one-plate type. With over 35 years of proven track record, the reliable TY-CHECKER series! (Continuity, insulation, four-terminal, micro-short, spark testing) Please feel free to consult us about various specifications. 【Features】 ■ Maximum inspection size: 550×340mm ■ Equipped with a micrometer adjustment mechanism for the lower jig. ■ Designed with safety considerations for both the working side and the back side. #CircuitBoardInspection #PowerOnTesting #ElectricalTesting #Open #Short #FourTerminal #Inspection

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Various aspects of printed circuit boards. If you are having difficulty realizing them, please feel free to consult us.

Various aspects of printed circuit boards. If you are having difficulty realizing them, please feel free to consult us.

We propose a manufacturing method that can realize our customers' requests with our 54 years of know-how and experience!

We accept "printed circuit board manufacturing" at our company. If you are having difficulty realizing your project, please feel free to consult with us. 【Features】 ■ Materials that combine both flexible and rigid substrate materials ■ Other materials can also be procured or supplied ■ Production can start from just one piece, with options for specifying the delivery destination, advancing production, board specifications, partial processing, etc. ■ If you want to reduce costs, need specific processing, want to test processing with supplied materials, or have inquiries about specifications or manufacturing methods before production, we are here to help. ■ We have equipment capable of handling large and long items, allowing for comprehensive in-house production. *For more details, please refer to the PDF document or feel free to contact us.

  • Digital Signage
  • Anemometer
  • Other PCs and OA equipment
  • Substrate

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Printed circuit board "multilayer flexible printed circuit board (multilayer FPC)"

Printed circuit board "multilayer flexible printed circuit board (multilayer FPC)"

Space-saving can be achieved! A multilayer flexible substrate that can reduce manufacturing costs.

Multilayer flexible circuit boards help save space! When wiring in a tight space, it can become densely packed. By using multilayer flexible circuit boards, it is possible to arrange components while maintaining a certain degree of flexibility and thinness. We are available for consultations even from the decision-making stage, so please feel free to contact us★ 【Features】 ○ Reduction in soldering points ○ Elimination of wiring errors ○ Improved reliability ○ Labor-saving in processing and assembly ○ Reduction in manufacturing costs For more details, please contact us or download the catalog.

  • Digital Signage
  • Anemometer
  • Air compressors, blowers and pumps
  • Substrate

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Printed Circuit Board Business Products and Services

Printed Circuit Board Business Products and Services

Improved performance in heat dissipation, dust resistance, and water resistance! Ensures the reliability of the mounted circuit board.

At Yoho Electronics, we achieve high product quality and reduced lead times through a consistent production system, unique manufacturing technologies, and quality control measures. The supported substrates include double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), and ceramic boards. By molding (resin encapsulation) the assembled boards, we enhance performance in heat dissipation, dust resistance, and drip resistance, ensuring the reliability of the assembled boards. In addition to molding, we can also accommodate substrate coating. 【Products and Services】 <Supported Substrates> ■ Double-sided boards, high multilayer boards, aluminum boards, paper phenolic boards, flexible boards (FPC boards), ceramic boards, etc. *For more details, please refer to the PDF materials or feel free to contact us.

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  • Substrate

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Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine line high-density FPC (high-precision flexible printed circuit board)

Ultra-fine lines, high density, and high-definition flexible printed circuit boards have made it possible to form ultra-fine circuits through the fusion of MSAP technology and via filling techniques!

The miniaturization and high functionality of electronic devices are advancing, and along with this, there is a demand for finer circuit formation. One method for forming wiring by etching copper foil (subtractive method) and a high-resolution circuit formation method is to form wiring by plating on ultra-thin copper foil (semi-additive method). The method we are introducing this time is one of the semi-additive methods, called "MSAP (Modified Semi Additive Process)." By using the MSAP method, it has become possible to achieve ultra-fine lines and high-density pattern formation, which is difficult with the subtractive method. Additionally, by combining it with the "via filling technology," which fills through-hole holes with copper plating, it becomes possible to create wiring on the through-holes, further increasing wiring density. **Features of the MSAP Method:** - Circuit formation through plating deposition enables high-precision fine wiring. - Excellent rectangularity of wiring cross-section contributes to reduced transmission loss. - Superior for high-frequency substrates/IC mounting. By merging these two processing technologies, we have realized "ultra-fine high-density FPC." #FlexibleSubstrate #Substrate #HighResolutionSubstrate #Flex #FlexiblePrintedCircuitBoard

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Overseas Production "Overseas Small and Medium Lot Mass Production"

Overseas Production "Overseas Small and Medium Lot Mass Production"

Secure reliable QCD with small to medium lot products from trial production! Smoothly transition to overseas production!

We provide high-quality printed circuit boards at low cost. Data checks and shipping inspections are supported in Japan. You can also leave overseas assembly and component procurement to us. Additionally, the Gerber data for board manufacturing, including version control, is stored at our headquarters in Japan. 【Overseas Business Content】 ○ Mass production of printed circuit boards (5m2 and up) ○ Small to medium lot and prototype boards ○ Assembly of mass production boards ○ Procurement of assembled components ○ Other electronic component-related products For more details, please contact us or download the catalog.

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[Data] Shirutoku Report No. 23 #BGA Circuit Board Design

[Data] Shirutoku Report No. 23 #BGA Circuit Board Design

Particularly frequent requests! Circuit board design for small, high-density implementations used in IoT devices and wearable devices!

★★Shirutoku Report: Useful Information You Should Know★★ In WTI's circuit board design, we handle various types of board designs, including large-scale circuit boards, multilayer wiring boards, high-density mounting boards, and flexible printed circuits (FPC). One of the most requested designs is for small, high-density mounting boards used in IoT devices and wearable devices. To reduce the size of products and lower board costs, it is common to adopt BGA packages for microcontrollers and FPGAs. This report discusses 'BGA Board Design.' We encourage you to read it. [Contents] ■ About BGA Board Design *For more details, please refer to the PDF document or feel free to contact us.*

  • Electrical Equipment Testing
  • Facility Design
  • Substrate

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Sanwa Electronic Circuit Co., Ltd. Business Introduction

Sanwa Electronic Circuit Co., Ltd. Business Introduction

We will take on and respond to all kinds of special substrates.

Sanwa Electronic Circuit Co., Ltd. was founded in 1955 as Sanwa Electric Manufacturing Co., Ltd. and has consistently produced printed circuit boards for over half a century. Currently, with the dramatic evolution of electronic devices, printed circuit boards are required to fulfill new roles beyond their traditional electrical functions, including thermodynamic, optical, and structural roles, necessitating different perspectives and ideas in manufacturing. To swiftly respond to these customer needs, we integrated our group companies involved in printed circuit boards in 2004 and have since embarked on a new journey as Sanwa Electronic Circuit Co., Ltd. This integration has consolidated the development, production, and sales capabilities cultivated over many years by our group companies, establishing a system that can comprehensively meet QCD (Quality, Cost, Delivery) requirements while maintaining and developing a production system that leverages the unique characteristics of each factory, resulting in a rich variety of product specifications and a flexible production system capable of accommodating all lot sizes. Moving forward, we will focus on strengthening our proposal-based sales capabilities and enhancing the development, production technology, and production management necessary to realize this. For more details, please contact us or download our catalog.

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Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

Long-length multi-layer flexible substrate [Substrate manufacturing achievements]

4-layer flexible printed circuit board (FPC) using LCP material! Introducing our manufacturing achievements with a product size of 1300mm.

We would like to introduce our company's substrate manufacturing achievements. We have produced ultra-long multilayer LCP substrates with a product size of 1300mm. Our features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible substrate made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Processes: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Substrate Size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.

  • Digital Signage
  • Anemometer
  • Other PCs and OA equipment
  • Substrate

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PCIe crossover adapter board

PCIe crossover adapter board

PCIe host-device conversion adapter board compatible with various FPGA evaluation boards from Intel/Xilinx.

The 【AB16-PCIeXOVR】 is a conversion adapter board for host-device communication that supports 1/4/8-lane PCIe (PCI-Express) and can be applied to evaluation boards from Intel/Xilinx that implement the PCIe interface. The adapter board features 8-lane PCIe sockets on both the component side and the solder side, directly connecting the transmit and receive signals lane by lane to function as host side/device side. This adapter is ideal for developing FPGA applications that implement PCIe host side functionality. Additionally, this adapter is required when evaluating the NVMe-IP core from DesignGateway.

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FMC USB3.0 adapter board

FMC USB3.0 adapter board

USB 3.0 IP Core Adapter Board for Xilinx FPGA Evaluation Board

The 【AB07-USB3FMC】 is an FMC mezzanine card designed to connect with Xilinx evaluation boards featuring FMC-LPC (Low Pin Count) or FMC-HPC (High Pin Count) connectors, allowing for the real-world evaluation of the USB3.0-IP developed by DesignGateway. This demo board can be used for evaluating both the device-side IP core (product model number: USB3D-IPxxx) and the host-side IP core (product model number: USB3H-IPxxx). By combining the Xilinx core evaluation board with this demo board and using the evaluation bit file, it becomes possible to verify the operation of USB3.0 SuperSpeed transfers in your hands. * Please note that the FMC interface voltage of this demo board is fixed at 2.5V, so it cannot be used with Xilinx evaluation boards that cannot be set to 2.5V (such as VC709). * This product is a user-limited product for the DG USB3.0 IP core.

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