4-layer flexible printed circuit board (FPC) using LCP material! Introducing our manufacturing achievements with a product size of 1300mm.
We would like to introduce our company's substrate manufacturing achievements. We have produced ultra-long multilayer LCP substrates with a product size of 1300mm. Our features include pattern exposure, drilling, lamination, copper plating, coverlay thermal pressing, and gold plating, all compatible with the 1300mm size. This is a 4-layer flexible substrate made from LCP material, outputting a 175μ exposure film in the standard size of 1350×250mm. 【Basic Specifications】 ■ Material: LCP/0.1t×3 4-layer Cu outer layer 9/9 (plating 35)μ - inner layer 9/9μ ■ Processes: Lamination, drilling, copper plating, etching, coverlay 25/35μ both, electroless Ni2-AuF (0.03)μ, manual processing of outer shape ■ Substrate Size: 1300×59 ■ Others: Minimum L/S=140/130μ Flying checker not available *For more details, please refer to the PDF document or feel free to contact us.
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Print Electronics Laboratory has over 40 years of experience in the printed circuit board industry and is a comprehensive manufacturer capable of handling design, manufacturing, and assembly all in one. Particularly, we excel in producing "large" and "long" boards, which are unmatched by other companies, allowing us to manufacture a wide variety of printed circuit boards, including rigid boards, flexible boards, and microfabricated boards. We can accommodate customer needs from prototyping to mass production. Five reasons to choose Print Electronics Laboratory: ● Trust and quality backed by 50 years of manufacturing experience ● Ability to meet "all needs" due to experience in manufacturing 10,000 types of boards ● Capability to handle large, long, FPC, and flex-rigid boards ● Numerous manufacturing achievements for boards that other companies cannot produce ● Cost reduction and quality improvement possible through specification discussions with our technical sales team
