Analysis(se) - List of Manufacturers, Suppliers, Companies and Products

Last Updated： Aggregation Period:Sep 17, 2025～Oct 14, 2025
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Analysis Product List

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Analysis of airflow around the cooling tower

Analysis of airflow around the cooling tower

Reproducing the thermal flow conditions around cooling towers with unknown characteristics and behaviors!

Thermal fluid equipment related to building facilities often has many unknown characteristics and behaviors. Cooling towers are one such example, but by precisely setting the structure, flow conditions, and thermal conditions of each cell of the cooling tower, it is possible to reproduce the thermal flow state quite accurately. In this analysis, we conducted a cooling tower thermal flow analysis considering external winds to examine the impact of multiple cooling towers with different specifications on the temperature distribution of the heated air released from each cell in relation to the airflow conditions around high-rise buildings. For more details, please download the catalog.

  • Scientific Calculation and Simulation Software
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Analysis of the assembly joint of the component.

Analysis of the assembly joint of the component.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

  • Other analytical equipment

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Failure analysis of power devices

Failure analysis of power devices

We will identify and observe the defective areas of power devices such as diodes, MOS-FETs, and IGBTs.

We perform optimal preprocessing for power devices such as diodes, MOS FETs, and IGBTs of all sizes and shapes, and identify and observe defective areas through backside IR-OBIRCH analysis and backside emission analysis. ■ Preprocessing for Analysis - Backside Polishing - Supports various sample forms. Si chip size: 200um to 15mm square ■ Defective Area Identification - Backside IR-OBIRCH Analysis / Backside Emission Analysis - IR-OBIRCH Analysis: Supports up to 100mA/10V and 100uA/25V Emission Analysis: Supports up to 2kV * Covers a wide range of defect characteristics such as low-resistance shorts, micro-leaks, and high-voltage breakdown failures. ■ Pinpoint Cross-Section Observation of Leak Areas - SEM/TEM - Select SEM or TEM observation based on the predicted defects, allowing for pinpoint physical observation and elemental analysis of leak defect areas.

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AI Image Analysis OPTiM AI Camera Enterprise

AI Image Analysis OPTiM AI Camera Enterprise

Screen images/system configurations and various implementation examples as reference materials are included!

The document titled "OPTiM AI Camera Enterprise Proposal" introduces a service that uses AI and cameras to perform analysis as a substitute for the "human eye." It includes screen images/system configurations, detailed information on unlimited usage packs and optional features, as well as various case studies as reference materials. Please take a moment to read it. [Contents (excerpt)] ■ What is OPTiM AI Camera Enterprise ■ Detailed information by function (unlimited usage pack) ■ Detailed information by function (optional features) ■ Reference materials *For more details, please refer to the PDF document or feel free to contact us.

  • Other services and technologies

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Easy skeletal analysis with hardware included: "VisionPoseNano"

Easy skeletal analysis with hardware included: "VisionPoseNano"

Ideal for research and verification of skeletal information! An easy-to-use posture estimation AI engine with included hardware.

"VisionPose Nano" is a posture estimation AI engine that can detect skeletal information using only a web camera. It can detect a total of 30 skeletal points, including 25 joint points of the body and 5 facial parts, in 2D coordinates. The acquired data can also be exported in CSV format. Please format the exported data for analysis and other uses. ■ Features - Skeletal detection is possible with camera footage, both in video and still images. - Provided with hardware, achieving low cost and space-saving. - No complicated setup or installation required. - Detection points include 30 key points, and skeletal information can be easily exported in CSV format. ■ Included Applications - Posture measurement app "PoseMeasure" - VP Analyzer - BodyAndColor *For more details, please download the PDF or feel free to contact us.

  • Scientific Calculation and Simulation Software

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Analysis of Damage to Agricultural Ponds during Earthquakes

Analysis of Damage to Agricultural Ponds during Earthquakes

Support for the safety assessment of agricultural ponds with a wide range of technologies!

In the seismic performance assessment of agricultural reservoirs, various analyses are required according to the methods established by each municipality. In applied technology, we conduct seismic performance assessments using traditional methods such as seepage flow analysis and sliding stability analysis (simplified Newmark method), in addition to the recently utilized detailed Newmark-D method. We offer proposals for analysis methods tailored to the characteristics of the target area and facilities, so please feel free to contact us.

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GOOSEC

GOOSEC

It is possible to defend against online skimming in real time.

"GOOSEC" is software designed to combat online skimming. By detecting and preventing online skimming, it protects against the leakage of credit card information and personal data entered on e-commerce sites. Additionally, by using crawlers, it can detect where tampering occurs that leads users to fake payment pages, and by notifying the administrators of e-commerce sites, it minimizes potential damage. [Services] ■ Real-time defense and detection of online skimming damage ■ Skimming detection features using crawlers tailored to the characteristics of e-commerce sites ■ Countermeasures to disable detection scripts *For more details, please download the PDF or feel free to contact us.

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Analysis of electronic components and materials using TEM.

Analysis of electronic components and materials using TEM.

TEM (Transmission Electron Microscope) meets a wide range of requirements for observing failure sites of electronic components, length measurements, elemental analysis, crystal structure analysis, and material evaluation.

TEM can perform not only high-magnification observation but also elemental analysis using EDS and EELS, as well as analysis of crystal structure, surface orientation, lattice constants, and more through electron diffraction.

  • Other analytical equipment

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Narrowing down defective areas using the EBAC (Absorption Current) method.

Narrowing down defective areas using the EBAC (Absorption Current) method.

"SEM images" and "absorption current images (current sensing)" etc.! It identifies open defects in wiring and areas with high resistance defects.

Our company provides analysis and reliability evaluation services. In the "Narrowing Down Defective Areas Using the EBAC (Absorbed Current) Method," we identify open defects and high-resistance areas in wiring using the EBAC method with a nano-probe and high-sensitivity amplifier. By sensing the absorbed current as voltage, we can obtain a contrast based on the resistance voltage drop within the wiring, allowing us to detect high-resistance defects in TEGs such as via chains. [Analysis Examples Using the EBAC Method] ■ SEM Images ■ Overlaid Images ■ Absorbed Current Images (Current Sensing) ■ Absorbed Current Images (Voltage Sensing) *For more details, please refer to the PDF document or feel free to contact us.

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Analysis of defects in overseas manufactured displays

Analysis of defects in overseas manufactured displays

Numerous achievements in defect analysis! Detailed analysis is possible, from confirming phenomena to inferring the mechanisms of defect occurrence.

Our company conducts "failure analysis of overseas manufactured displays." We can perform detailed analyses, from confirming phenomena to hypothesizing the failure mechanisms and narrowing down the production processes that caused the issues. We carry out lighting observations, panel disassembly, and optical microscope observations tailored to the failure symptoms. If it is necessary to narrow down the defective areas and conduct detailed analysis, we will propose appropriate methods. 【Examples of detailed analysis (partial)】 ■ Cross-sectional observation of wiring ■ Foreign matter analysis ■ Liquid crystal component analysis ■ Electrical characteristic measurement *Additional costs will be incurred. *For more details, please refer to the PDF document or feel free to contact us.

  • Other PCs and OA equipment

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Analysis of good LCD panels

Analysis of good LCD panels

Check the quality status of LCD components and products! We will analyze the structures of the LCD panel using our analytical methods and expertise!

At AITES, we conduct quality analysis of LCD components/products, confirming the quality status of products based on our expertise in LCD technology. The target panels include SEG-LCD, AM-LCD (a-Si TFT / LTPS TFT), OLED for automotive, monitors, mobile devices, and more. We perform quality analysis using our analytical methods on the various structures of liquid crystal panels. 【Analysis Details (Excerpt)】 <Reliability/Lighting Tests> ■ Classification - Reliability Testing - Lighting Inspection ■ Analytical Methods - Oven Drive Testing - Visual Inspection *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Finite Element Analysis (FEA) application "LISA"

Finite Element Analysis (FEA) application "LISA"

User-friendly finite element analysis package for Windows!

"LISA" is a user-friendly finite element analysis (FEA) application equipped with features such as pre/post processing, solvers, and interfaces. It is designed for not only engineers and students who are beginners in finite element analysis but also for experienced users. It includes integrated features such as a modeler, a multi-threaded solver, and a graphical post-processor. [About Licensing] ■Business/Corporate Single User ■Business/Corporate Multiple Users (max 3) *For more details, please refer to the PDF materials or feel free to contact us.

  • Company：B7
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  • Other Software

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Power semiconductor analysis service

Power semiconductor analysis service

We will handle everything from the evaluation of the diffusion layer to physical analysis/chemical analysis for the faulty area!

At Aites Co., Ltd., we offer analysis services for power semiconductors. Since our separation and independence from the Quality Assurance Department of IBM Japan's Yasu Office in 1993, we have cultivated our own unique analysis and analytical techniques. We can handle not only Si semiconductors but also the trending wide bandgap semiconductors. 【Features】 - OBIRCH analysis supports not only Si but also SiC and GaN devices. - FIB processing is possible from either side. - Visualization of the depletion layer formed at the PN junction. - Elemental analysis such as EDS and EELS is also supported. *For more details, please refer to the PDF document or feel free to contact us.

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