List of Measurement and Inspection products
- classification:Measurement and Inspection
181~195 item / All 949 items
Since the construction-generated soil will be recycled on-site, the disposal costs for leftover soil and the costs for new purchases will be significantly reduced. 【Disaster Prevention】
- Special Construction Method
The Noto Reconstruction Office of the Ministry of Land, Infrastructure, Transport and Tourism has featured our 3D printer in the Nikkei newspaper.
The official X account of the Noto Reconstruction Office of the Ministry of Land, Infrastructure, Transport and Tourism and the Nihon Keizai Shimbun have published that our 3D printer has been adopted for the reconstruction of Noto. The official X account of the Noto Reconstruction Office introduces the use of our products in the restoration work of the Noto Expressway. Additionally, the Nihon Keizai Shimbun mentions that structures made with our products are being used for the restoration of roads damaged by the Noto Peninsula earthquake, and that the construction period can be shortened by about two weeks, so please take a look.
Contributing to the second stage of public infrastructure! Bringing public infrastructure development to the ground. A robust outdoor storage tank for hazardous materials capable of responding to the ...
- Water Treatment
[Free test available] Devices that "create wind" and "measure wind." They can easily generate an appropriate amount of wind and accurately measure the wind blowing from existing equipment or being dra...
- Measurement and Inspection
[Free Test Available] Simple efficiency evaluation of heat exchangers and determination of appropriate air volume for control panels.
- Measurement and Inspection
- Air compressors, blowers and pumps
[Free test available] You can easily conduct characteristic investigations such as evaluating the breathability of masks and measuring the pressure loss of filters.
- Measurement and Inspection
- Air compressors, blowers and pumps
Supports multi-variety, small-lot production! Under the manufacturing management with a proven track record for M Electric, high-quality manufacturing is possible. *Introduction materials are currentl...
- Measurement and Inspection
Simultaneously measure with 3 units! A pressure checker with easy-to-understand digital measurement results.
- Measurement and Inspection
Measurement by push! A detector checker capable of simultaneous inspection of 5 units.
- Measurement and Inspection
Thorough "entry and exit management security" on the cloud using a 3D facial recognition system! Integration with existing entry and exit management systems (API integration) is also possible.
- Security Sensor Systems
- Measurement and Inspection
By integrating the new facial recognition device with the cloud, it enables personal authentication and temperature measurement! It can be implemented with a monthly fee.
- Security Sensor Systems
- Measurement and Inspection
The Takaya APT series is a board inspection device capable of industry-leading ultra-fast in-circuit testing.
- Measurement and Inspection
Send kerosene remaining amount once a day! By automatically measuring the kerosene level, we reduce the waste of refueling operations.
- Measurement and Inspection
End-to-end constant monitoring and visualization of corporate networks that mix high-speed IP networks and local 5G, maximizing DX results through improved communication quality.
- Measurement and Inspection
We have received permission to publish the feature article that appeared in the only domestic magazine specializing in implementation technology, "Electronics Implementation Technology." You can view ...
- Measurement and Inspection
We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)
Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results in electronics packaging technology. Starting in 2023, a hybrid format of on-site participation and online attendance has been implemented, attracting around 700 participants, primarily from industry and academia involved in electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)
We have presented a joint research report with Ehime University.
- Measurement and Inspection
We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)
Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results in electronics packaging technology. Starting in 2023, a hybrid format of on-site participation and online attendance has been implemented, attracting around 700 participants, primarily from industry and academia involved in electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)
We will create new value through the mutual complementarity of ICT and BST.
- Measurement and Inspection
We will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference. (Takushoku University Bunkyo Campus)
Takaya Corporation will exhibit a corporate booth at the 39th Electronics Packaging Society Spring Conference, which will be held from March 11 (Tuesday) to March 13 (Thursday), 2025, at the Bunkyo Campus of Takushoku University. This conference is held annually under the management of the Japan Electronics Packaging Society, providing a platform for the presentation and exchange of the latest research and development results in electronics packaging technology. Starting in 2023, a hybrid format of on-site participation and online attendance has been implemented, attracting around 700 participants, primarily from industry and academia involved in electronics packaging technology. When you visit, please be sure to stop by Takaya's booth. (Registration and payment of participation fees are required for attendance.)