List of Electrical Equipment Testing products
- classification：Electrical Equipment Testing
136～180 item / All 272 items
Solving road flooding! It also demonstrates its effectiveness against sudden heavy rain.
- Road construction
[Catalog Renewal] Increased the number of construction photos for the "Neplus Method" and "Kanetsuke Catalog."
In February 2020, Kitamura Concrete Industry Co., Ltd. renewed the "Neplus Method Catalog" and the "Kanzuke Catalog." We have increased the number of construction photos compared to the previous catalogs, so please make use of them. 【Contents (Excerpt)】 <Neplus Method Catalog> ■ Construction Types - Soundproof Type - Slit Type - Buried Type - Circular Drainage Type <Kanzuke Catalog> ■ Features ■ Construction Examples
Flux cleaning for electronic circuits and components! A cleaning system that enhances not only high quality but also ecology and economy.
- Safety and consumables
- Electrical Equipment Testing
Equipped with Bluetooth functionality, allowing for easy transfer of measurement data.
- Electrical Equipment Testing
Achieve powerful deodorization and disinfection! Solve all your tank problems at once!
- Drainage and ventilation equipment
- others
- Electrical Equipment Testing
R&D small tabletop spin coater. Lightweight coater for MAX 2 inches. Built-in vacuum pump. Machine and equipment settings are easy to operate.
- Electrical Equipment Testing
We will set various operational methods, investigate appropriate operational methods in advance, and make proposals!
- Electrical Equipment Testing
We propose the optimal performance testing equipment tailored to your needs!
- Electrical Equipment Testing
We provide one-stop support for the introduction and operation of equipment and devices for various purposes. We are committed to solving our customers' challenges!
- Solar power generation equipment
- DC Power Supply
- Electrical Equipment Testing
Providing further peace of mind and safety to the power system! We are fully committed to solving our customers' challenges.
- maintenance
- Other Management Services
- Electrical Equipment Testing
Transitional thermal measurement possible power cycle testing, with a customized luminescence/OBIRCH analysis device, where a skilled team thoroughly evaluates and analyzes power devices!
- Electrical Equipment Testing
An electronic breaker that significantly reduces the basic electricity charge.
- Electrical Equipment Testing
[Minimum and Lightweight Class, Easy Operation Settings] Ideal for business trips and travel, this lightweight handheld type is easy to carry. Body weight: 3.3 kg.
- Electrical Equipment Testing
![[Example of analysis using EBSD] Hi...](https://image.www.ipros.com/public/product/image/a89/2000533387/IPROS76289936861552503680.png?w=280&h=280){kind=small}
Observe the crystal structure with EBSD! Data can be obtained for each metal.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Visualize the features that appeared in the graph! You can check the distribution of crystal sizes and the orientation of crystal orientations.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
The EBSD method allows for the estimation of crystal states and residual stresses! Here is an example of BGA analysis.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of crystal analysis of intermetallic compounds at solder joints.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
![[Example of Analysis by EBSD] Chip](https://image.www.ipros.com/public/product/image/9e0/2000533345/IPROS08836877231324882336.png?w=280&h=280){kind=small}
I will introduce an example of analysis using EBSD where orientation was observed in the Al wiring.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
![[Example of analysis using EBSD] Sc...](https://image.www.ipros.com/public/product/image/d61/2000533368/IPROS90868083247351914914.png?w=280&h=280){kind=small}
We will introduce an example of analysis using EBSD for screws (Cu2Zn).
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
I will introduce an example of analysis using EBSD for pipes (austenite).
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
![[Example of analysis using EBSD] Vi...](https://image.www.ipros.com/public/product/image/530/2000533380/IPROS80267660547364406939.png?w=280&h=280){kind=small}
The EBSD method allows for the estimation of crystal size distribution and residual stress.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Changes in crystal orientation and crystal grain size can be analyzed! We introduce the EBSD (Electron Backscatter Diffraction) method.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Observe the changes before and after compression on the copper plate! You can compare the half-life of the crystal grain size before and after compression.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
We will introduce an example of analyzing EBSD patterns (Kikuchi patterns) at gold wire bond joints.
- Electrical Equipment Testing
- Other analytical equipment
Example of analysis of compounds at the interface between SAC solder and Ni pads.
We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.
Introducing our various products for the increasingly diverse electrical equipment!
- Electrical Equipment Testing
- Other measuring instruments
- DC Power Supply
![[Example] Load Test of Emergency Ge...](https://image.www.ipros.com/public/product/image/52a/2000515414/IPROS01138079036674309996.png?w=280&h=280){kind=small}
Become a reliable generator during disasters! We will introduce examples of load testing for emergency generators.
- maintenance
- Electrical Equipment Testing
- Other construction services
KYORITSU: Pursuing maximum measurement speed on-site!
- Other measuring instruments
- Electrical Equipment Testing
![[Data] Expiration date of the elect...](https://image.www.ipros.com/public/product/image/cda/2000383315/IPROS60934538573601931848.jpeg?w=280&h=280){kind=small}
Introducing how to check the expiration date of proof electric meters (sub-meters) and a Q&A!
- Power distribution and control panels
- Electrical Equipment Testing
Simulate with effective values using temperature controllers and more! Effective for sequence checks on-site!
- Other security systems
- Electrical Equipment Testing
We manufacture testing equipment related products such as brake control devices.
- Electrical Equipment Testing
- others
It is a portable TDR cable diagnostic device that inspects cables up to 6000 meters on an 11-level scale.
- Electrical Equipment Testing
Voltage-resistant transformer for the IP-R series
- Electrical Equipment Testing
Voltage-resistant transformer for IP-R1500 and ORT-50MP.
- Electrical Equipment Testing
This is a phase sequence checker capable of checking the phase sequence of a three-phase circuit and live line check using an electrostatic induction voltage clip.
- Electrical Equipment Testing
![Clam Proger "LR5051" [Rental]](https://image.www.ipros.com/public/default/object/noimage_l.gif?w=280&h=280){kind=small}
It is a compact logger that easily records load current with a clamp.
- Electrical Equipment Testing
![ELB-GR Relay Tester "LB-6" [Rental]](https://image.www.ipros.com/public/product/image/b6c/2000463672/IPROS56041104988072101714.jpeg?w=280&h=280){kind=small}
The ELB is a practical type that supports 400V under live conditions and 200V (100V power supply) during a power outage.
- Electrical Equipment Testing
A multifunctional and easy-to-use multi-relay tester that supports high voltage and special high voltage relays.
- Electrical Equipment Testing
A multi-relay tester that achieves multifunctionality and operability while significantly reducing size and weight compared to the IP-R2000.
- Electrical Equipment Testing
![Voltage Tester "HST-20N" [Rental]](https://image.www.ipros.com/public/product/image/4f9/2000463664/IPROS10005244648803294829.jpeg?w=280&h=280){kind=small}
A lightweight dual-purpose voltage tester for AC and DC. Operating voltage range: AC/DC: supports up to 3k-25kV.
- Electrical Equipment Testing
![Battery Tester "BT3554-11" [Rental]](https://image.www.ipros.com/public/product/image/22d/2000463674/IPROS03406336031673730984.jpeg?w=280&h=280){kind=small}
This is a tester for diagnosing the degradation of secondary batteries primarily based on lead-acid batteries.
- Electrical Equipment Testing
A multifunctional and high-precision calibrator capable of calibration and evaluation of industrial process equipment and various electronic devices.
- Electrical Equipment Testing
A multifunctional phase detector with voltage detection function for standalone use and phase sequence function when used in combination.
- Electrical Equipment Testing
It is a voltage tester that detects DC voltage remaining in high and low voltage circuits and cables, and is also used for insulation resistance testing of high voltage equipment, making it a versatil...
- Electrical Equipment Testing
It is an analysis device that monitors and records abnormalities in electrical energy, allowing for the swift investigation of causes when abnormalities occur.
- Electrical Equipment Testing
It is a 4.5-digit handheld type digital multimeter.
- Electrical Equipment Testing