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  6. Crystal analysis by EBSD: Intermetallic compounds in solder joints

Crystal analysis by EBSD: Intermetallic compounds in solder joints

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last updated:Jul 31, 2020

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We will introduce an example of crystal analysis of intermetallic compounds at solder joints.

SEM images, phase maps, and IQ maps of Cu6Sn5 highlighted for each crystal grain, as well as IQ maps of Cu6Sn5 highlighting the grain boundary rotation angles, were used to analyze the crystals using the EBSD method. Compounds such as Cu6Sn5 and Ag4Sn are growing at the Cu pad/solder interface, and the distribution of crystal sizes and crystal inclination angles can be shown through histograms. Additionally, by highlighting on the map, the features that appear in the graph can be visualized. [Overview] ■ Crystal analysis using the EBSD method - SEM images - Phase maps - IQ maps of Cu6Sn5 (highlighted for each crystal grain) - IQ maps of Cu6Sn5 (highlighting the grain boundary rotation angles) *For more details, please refer to the PDF document or feel free to contact us.

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Crystal analysis by EBSD: Intermetallic compounds in solder joints

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Crystal analysis by EBSD: Intermetallic compounds in solder joints.

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Example of analysis of compounds at the SAC solder and Ni pad interface.

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Example of analysis of compounds at the interface between SAC solder and Ni pads.

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We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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