[Example of analysis using EBSD] Screw

We will introduce an example of the analysis of compounds formed at the interface between Sn-Ag-Cu solder and NiP pads. At the interface between the NiP pad and Sn-Ag-Cu solder, compounds such as (Ni,Cu)3Sn4 and (Cu,Ni)6Sn5 grow, and surface analysis using EDX reveals the distribution of Ni, Cu, and Sn within these compounds. The EBSD method is an analytical technique based on the crystallographic information of the sample. By combining it with elemental analysis using EDX, it is possible to estimate the composition, and in some cases, it may be feasible to analyze using the crystallographic data of Ni3Sn4 and Cu6Sn5 as substitutes.

We will introduce the observation of metal structures through chemical treatment. By performing chemical treatment on metal samples, it is possible to clearly observe the metal structure. Observing the structure can reveal the condition of the sample and the history of applied heat and stress, providing clues about the quality of the product and any defects based on the structure's shape. In our catalog, you can find details on the observation of metal structures, such as the macrostructure of aluminum plates and the soldered parts of copper terminals. Additionally, we offer cross-sectional observation and various analysis services. Please feel free to contact us if you have any requests.