When heat is applied, it softens and melts, improving adhesion.
【Features】 ● This is a thermal conductive material used to reduce thermal resistance by placing it between heat-generating components such as CPUs, GPUs, and power semiconductors, and heat dissipation components like heat sinks and CPU coolers. It is solid at room temperature but softens and melts when heated, filling the fine irregularities on the surface of the components and improving adhesion. ● It is easy to handle in sheet form at room temperature. It can be used simply by placing it on top of heat-generating components such as CPUs, GPUs, and power semiconductors in the specified shape. ● When heated, it softens and melts, adhering to the contact surface. It begins to soften at 45°C, becoming semi-liquid (gel-like) and exhibiting excellent wettability. ● It forms a very thin thermal interface layer. After compression, the thickness can be made very thin, which helps to lower the thermal resistance that affects heat dissipation performance. ● There is little variation in the amount applied. The sheets are managed for thickness, making it less likely to experience issues like "over-application," "under-application," or "uneven application" that can occur with grease, making it suitable for stable quality and workability during mass production. ● It has long-term reliability. It is less likely to experience pump-out issues that occur with conventional grease, providing high reliability.
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【Specifications】 ●Size: 35mm × 35mm × 0.25mm ●Thermal conductivity: 9.5 W/m·K ●Phase change temperature: 45℃ ●Operating temperature range: -50℃ to 140℃ ●Thermal resistance value @10 psi: 0.0173℃·in²/W Thermal resistance value @30 psi: 0.0063℃·in²/W Thermal resistance value @50 psi: 0.0057℃·in²/W ●Silicone-free ●Insulating properties
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【Instructions for Use】 1) Please clean the contact surfaces of the CPU, GPU, semiconductors, heat sinks, etc. Remove any oil, dust, or other contaminants from the surface. 2) Remove the protective film from one side of the sheet and place it on top of the heating element. 3) After placing it, remove the protective film from the other side. 4) Install the heat dissipation components such as the CPU cooler and heat sink. 5) Operate the device to apply heat and raise the temperature to the phase change temperature, allowing it to settle. 6) The softened sheet will fill in the surface irregularities, achieving optimal adhesion. *Once used, the shape will have changed, so please do not reuse it.
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Nidec Corporation Authorized Dealer Taiwan CHIA CHERNE General Agent Taiwan SUNON Sales Agent Taiwan PRO-ARIES INDUSTRIES General Agent Tranyoung Technology Sales Agent Taiwan Thermal Transtech International General Agent
