Phase Change Material Special Phase Change Thermal Conductive Sheet

When heat is applied, it softens and melts, improving adhesion.

【Features】 ● This is a thermal conductive material used to reduce thermal resistance by placing it between heat-generating components such as CPUs, GPUs, and power semiconductors, and heat dissipation components like heat sinks and CPU coolers. It is solid at room temperature but softens and melts when heated, filling the fine irregularities on the surface of the components and improving adhesion. ● It is easy to handle in sheet form at room temperature. It can be used simply by placing it on top of heat-generating components such as CPUs, GPUs, and power semiconductors in the specified shape. ● When heated, it softens and melts, adhering to the contact surface. It begins to soften at 45°C, becoming semi-liquid (gel-like) and exhibiting excellent wettability. ● It forms a very thin thermal interface layer. After compression, the thickness can be made very thin, which helps to lower the thermal resistance that affects heat dissipation performance. ● There is little variation in the amount applied. The sheets are managed for thickness, making it less likely to experience issues like "over-application," "under-application," or "uneven application" that can occur with grease, making it suitable for stable quality and workability during mass production. ● It has long-term reliability. It is less likely to experience pump-out issues that occur with conventional grease, providing high reliability.

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