Strain measurement in thermal shock testing

Observing the behavior of strain in thermal shock tests! The test materials used are FR-1 and FR-4.

We would like to introduce the "strain measurement in thermal shock testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record strain data in real-time during the test. For two types of copper-clad laminates, the strain behavior during the thermal shock test was observed, and it was noted that significant strain occurred with temperature changes. It was found that FR-1 exhibited greater strain compared to FR-4. [Test Conditions] ■ Temperature Cycle: -30°C to 120°C ■ Exposure Time at Each Temperature: 30 min ■ Test Materials - FR-1 Paper Phenolic (double-sided) - FR-4 Glass Epoxy (double-sided) ■ Strain Gauge: Foil strain gauge for printed circuit boards *For more details, please refer to the PDF document or feel free to contact us.

Non-destructive testing