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  4. Strain measurement in thermal shock testing.
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  • Jun 06, 2024
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Jun 06, 2024

Strain measurement in thermal shock testing.

アイテス アイテス
We would like to introduce the "strain measurement of thermal shock testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record strain data in real-time during the test. For two types of copper-clad laminates, the strain behavior during thermal shock testing was observed, and it was noted that significant strain occurred with changes in temperature. It was found that FR-1 exhibited greater strain compared to FR-4.
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Strain measurement in thermal shock testing

Observing the behavior of strain in thermal shock tests! The test materials used are FR-1 and FR-4.

We would like to introduce the "strain measurement in thermal shock testing" conducted by our company. A sample with a strain gauge attached was set up in the thermal shock testing device, and the wiring of the strain gauge was connected to an external data logger to record strain data in real-time during the test. For two types of copper-clad laminates, the strain behavior during the thermal shock test was observed, and it was noted that significant strain occurred with temperature changes. It was found that FR-1 exhibited greater strain compared to FR-4. [Test Conditions] ■ Temperature Cycle: -30°C to 120°C ■ Exposure Time at Each Temperature: 30 min ■ Test Materials - FR-1 Paper Phenolic (double-sided) - FR-4 Glass Epoxy (double-sided) ■ Strain Gauge: Foil strain gauge for printed circuit boards *For more details, please refer to the PDF document or feel free to contact us.

  • Non-destructive testing

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Thermal shock test

Not only the joints of electronic components, but also the evaluation of fixed parts such as screws!

At AITES Co., Ltd., we conduct "Thermal Shock Testing." By repeatedly exposing samples to high and low temperatures, stress is generated not only from the thermal effects of high and low temperatures but also from the expansion and contraction of various parts. Repeated stress also adds to the overall stress. This test is conducted not only for the joints of electronic components but also for evaluating fixed points such as screws. 【Main Specifications of the Thermal Shock Testing Equipment】 ■ Internal Dimensions: W650×H460×D370mm Temperature Range: -65 to 0/+60 to 200℃ ■ Internal Dimensions: W650×H460×D670mm Temperature Range: -65 to 0/+60 to 200℃ ■ Internal Dimensions: W970×H460×D670mm Temperature Range: -65 to 0/+60 to 200℃ *For more details, please refer to the PDF document or feel free to contact us.

  • Measurement and Analysis Equipment

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Observation of time-dependent changes associated with reliability testing.

Applicable to change observation, with support for additional analysis! We evaluate the subject in a time series and non-destructive manner.

During reliability testing, the samples change moment by moment. Do you have any questions such as "At what point did the crack occur?", "How does the degradation progress?", or "How much has it changed from the initial state?" By combining it with reliability testing, we will evaluate the subject in a time-series and non-destructive manner. 【Features】 ■ Applicable for observing changes in whiskers, migration, pressure resistance, solder evaluation, chemical corrosion tests, and aging products in the market ■ Environmental tests and observation frequency will be conducted according to customer requirements ■ Additional analyses such as electrical characteristics, SEM observation, elemental analysis, and cross-sectional observation are also available *For more details, please refer to the PDF document or feel free to contact us.

  • Analysis and prediction system
  • Other analytical equipment

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In-Situ Continuous Measurement Reliability Evaluation Testing Service

In-Situ Continuous Measurement Reliability Evaluation Testing Service

In-situ continuous measurement reliability evaluation tests involve applying stress while measuring characteristics to conduct reliability assessments. ● Accurate understanding of failure time is possible In a readout method where samples are taken out from a stress environment at fixed times, failure can only be understood at the timing of the readout, making it impossible to know the exact time of failure occurrence. In-situ measurement allows for accurate understanding of failure time. ● Detection of recoverable failures is possible Recoverable failures can cause significant issues in the market. In most cases, these recoverable failures cannot be detected using the readout method, but in-situ measurement allows for the detection of recoverable failures, enabling accurate judgment and assessment. ● Monitoring of stress application conditions on samples is possible The stress application conditions and measurement data can be confirmed in real-time.

  • Analysis and prediction system
  • Other analytical equipment

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Total Support Service for Reliability

We conduct environmental testing, as well as non-destructive observation and electrical characteristic measurements.

At AITES, we use environmental testing equipment that complies with standard specifications such as JIS, JEDEC, and MIL to conduct reliability evaluation testing for various electronics products, components, and materials. We offer a range of tests including electrical testing, non-destructive observation, and power cycle testing. 【Environmental Testing】 ■ Highly Accelerated Life Testing ■ Constant Temperature and Humidity Testing ■ Thermal Shock Testing ■ Liquid Bath Thermal Shock Testing ■ Temperature and Humidity Cycle Testing ■ In-Situ Continuous Measurement Reliability Evaluation Testing Service *For more details, please refer to the PDF document or feel free to contact us.

  • Other analytical equipment

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Related catalog(5)

Total Support Service for Reliability

Total Support Service for Reliability

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Thermal shock test

Thermal shock test

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Observation of temporal changes associated with reliability testing.

Observation of temporal changes associated with reliability testing.

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In-Situ Continuous Measurement Reliability Evaluation Testing Service

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Strain measurement in thermal shock testing

Strain measurement in thermal shock testing

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CCS3 product photo

The new product "Vehicle Count Sensor CCS3" enables efficient occupancy management of large parking lots.

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Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily visible at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

Sep 11, 2026

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I participated in the AMD Embedded Computing Summit Tokyo 2026.

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On August 28, 2026 (Friday), I participated in the "AMD Embedded Computing Summit Tokyo 2026" and showcased a "Gesture Demo" as a partner of AMD. The demonstration introduced a configuration that combines gesture recognition using OpenCV, status reporting with LLM, and one-axis motor control using INtime 7.2 and RSI-ECAT, enabling collaboration between AI, image processing, and real-time control on a single PC. We presented a next-generation PC-based industrial control system that integrates AI, image processing, and real-time control on one PC. <Overview of Demo Participation> https://www.mnc.co.jp/INtime/AMDxINtime/AMDEcsTokyoResults.html <Actual Demo Video> https://youtu.be/JmZke75_y0s <AMD CPU + INtime RTOS Introduction Page> https://www.mnc.co.jp/INtime/AMDxINtime/amdxintime.html #PC #RealTimeOS #IndustrialPC #AI

Sep 10, 2026

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[Data] Shirutoku Report 123 # Current Measurement for Switching Evaluation

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This time, I would like to talk a little about current measurement in the switching evaluation of power semiconductors (including power devices and power modules).

Sep 10, 2026

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KSI EXPO 2026 Measurement and 3D Measurement Spatial Digital Comprehensive Exhibition September 16, 2026 (Wednesday) 10:00 AM to 5:00 PM

KSI EXPO 2026 Measurement and 3D Measurement Spatial Digital Comprehensive Exhibition September 16, 2026 (Wednesday) 10:00 AM - 5:00 PM Osaka City Central Public Hall (1-1-27 Nakanoshima, Kita-ku, Osaka)

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From measurement instruments to point cloud processing and analysis software, the latest solutions come together! We propose numerous cutting-edge technologies and products that solve on-site challenges in a one-stop manner. It's not just about seeing; it's about experiencing, consulting, and bringing it back to the field. At the venue, we will showcase the latest measurement instruments and solutions, including 3D laser scanners, handheld 3D scanners, LiDAR drones, and 3DGS (Gaussian Splatting). Additionally, we will announce surprise new products!

Sep 09, 2026

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We have published an article comparing and ranking six system construction manufacturers for 2026 on the Select Beam special site.

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We have updated the article on the website of the semi-custom system construction "Select Beam." When planning factories, logistics warehouses, and stores, "system construction" has become an effective means of achieving cost reduction and shortening construction periods. The rationality of system construction through thorough standardization is very high, and it is adopted in many projects. However, due to the differing characteristics of each manufacturer, many business owners find themselves wondering, "Which manufacturer is suitable for our plans?" and "Is it really optimal compared to conventional methods?" In this article, we will compare and introduce the basic knowledge of the advantages and disadvantages of system construction, as well as recommend manufacturers by purpose in a ranking format. ■ Semi-Custom System Construction "Select Beam" This is a unique method by Sakura Structure, and it is a "third option" that is less expensive than system construction. It is the most suitable method for low-rise long-span buildings such as stores, warehouses, factories, and logistics facilities, as well as high-rise buildings like hotels.

Sep 09, 2026

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