Measurement of solder crack rate by cross-sectional observation.

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components using a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks.

Here, we present examples of cross-sectional observations of various components mounted on a board known as an organic substrate. Inside various electronic devices around us, there are substrates equipped with electronic components. When observing the mounted substrates, you can see that numerous components are tightly soldered together. It is necessary to verify that these components are properly joined, as improper connections can lead to malfunction. Please contact us if you are considering observations before and after reliability testing or cross-sectional observations.