[Book] Formulation Design and High Functionality of Epoxy Resins (No. 2222)

Available for preview - High heat resistance, high thermal conductivity and insulation, low dielectric constant, reinforcement.

★ Specific measures that respond to the latest electronics packaging materials such as high-frequency substrates and semiconductor encapsulation can be understood from the examples of advanced companies! ★ Optimization of the selection, usage amount, and curing process conditions of the most suitable curing agents! Reduction of environmental impact through the realization of low-temperature rapid curing! －－－－－－－－－－－－－－－－－－－－－ ■ Key Points of This Book 1 ● High heat resistance and high thermal conductivity - Long-term heat resistance for 5G/6G compatible power modules - Increased heat resistance through benzoxazine and bismaleimide modification - High filling of fillers with high thermal conductivity - Low dielectric constant that trades off with heat resistance ● Toughening and high strength - Compatibility with processability as CFRP matrix resin - Coatings with excellent self-healing and corrosion resistance ● High adhesion - Multi-material compatibility - Functions with excellent workability such as high viscosity and high room temperature stability ● Environmental considerations - Development of plant oil-derived resins - Recycling technology for epoxy resins and CFRP - Development of curing processes with low CO2 emissions ● Latest technologies and troubleshooting measures - Low-temperature rapid curing technology for epoxy resins - Measures against mixing unevenness and troubles with curing agents - Data-driven approaches using MI - Evaluation of cured products containing many auxiliary materials

others