[Book] Formulation Design and High Functionality of Epoxy Resin (No. 2222)

- High heat resistance, high thermal conductivity and insulation, low dielectric constant, toughening -
★ Concrete measures that respond to the latest electronics packaging materials such as high-frequency substrates and semiconductor encapsulation can be understood from the examples of advanced companies!
★ Optimization of the selection, usage amount, and curing process conditions of the appropriate curing agent! Reduction of environmental impact through the realization of low-temperature rapid curing!
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Chapter 1: Characteristics of Epoxy Resins, Synthesis Reactions, and Curing Control Technologies
Chapter 2: Mastering the Use of Epoxy Resins
Chapter 3: Evaluation Methods for Epoxy Resins
Chapter 4: Examples of Improved Heat Resistance and Flame Retardancy
Chapter 5: Examples of Enhanced Thermal Conductivity and Insulation, and Low Dielectric Constant
Chapter 6: Technologies for Toughening, Durability, and Corrosion Resistance of Epoxy Resins
Chapter 7: Technologies for Improving Adhesion of Epoxy Resins
Chapter 8: Trends in Environmental Compatibility of Epoxy Resins
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● Publication Date: October 31, 2023 ● Format: A4 size, 481 pages
● Authors: 52 individuals ● ISBN: 978-4-86104-988-0
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