Would you like to inspect those fine defects with TY-VISION? The M111SC detects defects of about 10μm with an optical resolution of 2.5μm!
Are you having trouble detecting fine defects? 【We would like to ask about the final appearance inspection machine you are currently using】 * Are you satisfied with the detection? 【YES・NO】 * Are there few false positives? 【YES・NO】 If you answered NO to any of these, please try TY-VISION. It boasts top-class detection performance for package substrates, ceramic substrates, FPCs, and is widely adopted in mass production processes. By adding the AI system XAIS, we have achieved a dramatic reduction in false positives. We are available for demo inspections at any time, so please feel free to consult with us. * Please provide the substrate information initially, and we will hold the data and the subject for implementation.
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■High-resolution specifications / Optical resolution: 2.5μm / 3μm (fixed at the time of manufacture) ■Standard equipped with FFU (Fan Filter Unit) ■Equipped with various focus adjustment mechanisms ■Refined imaging unit and transport unit 〇Target substrate: Rigid substrates (single-sided, double-sided, multilayer) / Ceramics, etc. 〇Target substrate size: Up to 200 (W) × 300 (L) mm 〇Target substrate thickness: Up to 2.0mm 〇Optical resolution: 2.5μm / 3μm / 5μm
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced variants, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while we are advancing further miniaturization and high density technically, we are also undertaking new initiatives such as bump-type and electroplating with special materials. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in mass production sites for FPC and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs in the future. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*