Attention companies struggling with final appearance inspection of PCBs! The solution to your problem is "TY-VISION XAIS"! [Final Appearance Inspection + AI System]
Introducing the AI system for final appearance inspection of circuit boards, 'TY-VISION XAIS'. The defect information detected by the AVI (final appearance inspection device for circuit boards) 'TY-VISION' is automatically categorized into "good" and "needs confirmation" by the XAIS (AI system). Only the areas marked as "needs confirmation" received from XAIS are checked by inspectors for the final judgment. This solution addresses issues related to securing inspectors, labor costs, time spent on training, and inspection man-hours to prevent defective products from being shipped. 【Benefits of Implementation】 ■ Reduction in man-hours ■ Reduction in labor costs ■ Stabilization of inspection quality *For more details, please refer to the PDF document or feel free to contact us. #CircuitBoardInspection #InspectionEquipment #AppearanceInspection #FinalAppearance #Efficiency #LaborSaving #AVI #AVFI #Inspection #Defects #DefectDetection
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【Device Configuration and Inspection Flow at the Time of XAIS Introduction】 1. AVI - Conduct inspections using pre-created inspection data - Send information about detected defects to XAIS 2. XAIS - Automatically categorize defects detected by AVI into "Good (PASS)" and "Needs Verification (VERIFY)" - Only the information marked as "Needs Verification (VERIFY)" is sent to VERIFY 3. VERIFY - Inspectors verify only the areas marked as "Needs Verification (VERIFY)" received from XAIS and make the final judgment
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AI system for final appearance inspection of substrates
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![Final appearance inspection device for substrates 'TY-VISION M111SC' [High resolution: 2.5μm/3μm]](https://image.www.ipros.com/public/catalog/image/01/3d1/707248/IPROS52478708147886811742.jpeg?w=120&h=170)
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Taiyo TechnoRex Co., Ltd. continues to operate in the fields of prototype development of flexible printed circuit boards (FPC) and printed circuit board testing systems. Since FPC is fundamentally related to the structure of hardware, both high precision quality and shortened development time are required. We have extensive experience and know-how in the manufacturing processes of single-sided FPC, double-sided FPC, multilayer FPC, and their advanced variants, and we continuously improve and enhance our technology, resulting in consistent evaluations of our delivery times and quality. Additionally, while we are advancing further miniaturization and high density technically, we are also undertaking new initiatives such as bump-type and electroplating with special materials. On the other hand, our printed circuit board testing systems mainly consist of electrical inspection systems and final appearance inspection systems, which are adopted in mass production sites for FPC and package/module-type substrates. They operate day and night in quality control settings for substrates used in smartphones, automotive applications, and various electronic devices. We will continue to respond to the increasingly diverse market needs in the future. *On December 21, 2023, the company name was changed from "Taiyo Kogyo Co., Ltd." to "Taiyo TechnoRex Co., Ltd."*