Achieve low thermal expansion with low-temperature film formation!
"Low-temperature film-forming low thermal expansion polyimide" can be formed at lower temperatures than conventional polyimides, which reduces thermal stress and allows for similar applications as epoxy and others. It achieves high production efficiency and labor savings, making it suitable for applications such as interlayer insulating films (for semiconductor devices, multilayer printed circuit boards, and package substrates). [Features] ■ Thermal expansion coefficient graded from 2 to 20 ppm/K (can match the thermal expansion coefficients of various substrates) ■ Varnish can be stored at room temperature *For more details, please download the PDF or feel free to contact us.
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【Applications】 ■ Interlayer insulating film (for semiconductor devices, multilayer printed circuit boards, package substrates) ■ Protective film for semiconductor devices ■ Buffer coat film ■ Insulating film for silicon-glass interposers *For more details, please download the PDF or feel free to contact us.
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For more details, please download the PDF or feel free to contact us.
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Our company will contribute to next-generation industrial fields by developing new high-performance polyimide resins that respond to changing market needs. By incorporating functions (such as heat dissipation, transparency, conductivity, and adhesion) that are not found in conventional polyimide materials into our own polyimide products, we aim to create high-value-added polyimide materials, further stimulating the desire to develop next-generation industrial equipment and striving to be a company that meets those needs.