ウィンゴーテクノロジー List of Products and Services

"Low-temperature film-forming low thermal expansion polyimide" can be formed at lower temperatures than conventional polyimides, which reduces thermal stress and allows for similar applications as epoxy and others. It achieves high production efficiency and labor savings, making it suitable for applications such as interlayer insulating films (for semiconductor devices, multilayer printed circuit boards, and package substrates). [Features] ■ Thermal expansion coefficient graded from 2 to 20 ppm/K (can match the thermal expansion coefficients of various substrates) ■ Varnish can be stored at room temperature *For more details, please download the PDF or feel free to contact us.

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"Diamine compounds" are products developed for use in resins such as polyimides, polyamides, and polyurethanes, as well as for epoxy resin curing agents. They have a rigid molecular structure and exhibit high solubility in organic solvents. They can be applied as raw materials for new materials that excel in various properties such as high heat resistance, low thermal expansion, and low water absorption. [Features] - Achieves a soluble polyimide that is rigid - Achieves a polyimide with good dimensional stability and a melting point *For more details, please download the PDF or feel free to contact us.

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