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  4. Cross-sectional observation of substrate-mounted components (1) to (6)
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  • Jun 04, 2024
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Jun 04, 2024

Cross-sectional observation of substrate-mounted components (1) to (6)

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We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components using a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks.
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Cross-sectional observation of substrate-mounted components (1) to (6)

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metal microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

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Analysis of the assembly joint of the component.

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

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Total support service for cross-section grinding, processing, observation, and analysis.

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

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The state of analysis techniques, starting with the failure analysis of bonding, adhesion, and assembly parts.

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and problems not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point and a helpful resource for our customers in resolving issues. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

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Cross-sectional polishing service for implemented parts and electronic components.

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

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Surface mount electronic component cross-sectional observation service

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

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Observation of cross-sectional processing of CCD camera module.

With our advanced technology, we can also create cross-sections of highly challenging samples!

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation quite challenging. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

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Observation of aluminum welding joints

Introducing examples of aluminum welding observations. Internal observations through X-ray fluoroscopy and CT scans provide clearer insights after cross-section preparation!

Here is a case study of the observation of aluminum spot welds. Internal observation using X-ray radiography revealed voids within the weld, and internal observation using X-ray CT confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching, we were able to observe the condition of the weld more clearly. 【Summary】 ■ Internal observation using X-ray radiography - Conducted non-destructive testing and X-ray radiographic observation - Voids were observed within the weld ■ Internal observation using X-ray CT - Conducted non-destructive testing and X-ray CT observation - Confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section tailored to the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

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Cross-sectional observation of large samples (expansion valve)

Introducing a case study on the cross-section preparation of large samples (65mm × 28mm) and the observation of their internal structures!

We present an observation case of a large sample (expansion valve) measuring 65mm × 28mm. This sample uses magnetic materials, and due to distortion in the images during SEM observation, we primarily conducted observations using an optical microscope. From the appearance and X-ray radiographic observation, it was found that there are some areas that are not visible in the X-ray. 【Overview】 ■ Appearance and X-ray radiographic observation ■ Cross-sectional observation using an optical microscope *For more details, please refer to the PDF document or feel free to contact us.

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Measurement of solder crack rate by cross-sectional observation.

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within acceptable standards. The evaluation criteria after the solder durability test can be individually established based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

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Observation of Pb-free solder cross-section after reliability testing.

Three types of Pb-free soldered products are subjected to reliability tests! We will introduce the main objectives of each test and the results of cross-sectional observations.

We would like to introduce the cross-sectional observation of Pb-free solder after the reliability tests conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints, such as monitoring crack propagation, the TC test, which allows for cross-sectional observation after each cycle, is recommended. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

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Related catalog(11)

Cross-sectional observation of substrate-mounted components (1) to (6)

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Analysis of the assembly joint of the implementation components

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Total support service for cross-section grinding, processing, observation, and analysis.

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The state of analysis techniques, starting with defect analysis of joints, adhesion, and implementation parts.

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Measurement of solder crack rate by cross-sectional observation.

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Observation of Pb-free solder cross-section after reliability testing.

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CCS3 product photo

The new product "Vehicle Count Sensor CCS3" enables efficient occupancy management of large parking lots.

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Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily visible at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

Oct 27, 2026

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Obtained certification as a CBAM verification body.

Announcement of Obtaining Certification as a Verification Body for the EU Carbon Border Adjustment Mechanism (CBAM)

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Recently, Intertek Certification AB, the Swedish subsidiary of Intertek, has been accredited by the Swedish national accreditation body Swedac as a verification body for the EU Carbon Border Adjustment Mechanism (CBAM). According to Swedac's announcement, this is the first CBAM accreditation for a verification body in Sweden. This accreditation covers six sectors: cement, steel, aluminum, fertilizers, hydrogen, and electricity, and Intertek Certification AB will provide third-party verification services for embedded emissions associated with the manufacturing of CBAM-covered products based on the scope of accreditation. CBAM is a system that reflects the carbon price on greenhouse gas emissions associated with the manufacturing of certain products imported into the EU, requiring targeted companies to properly calculate and report their greenhouse gas emissions data and comply with third-party verification. Intertek Certification Co., Ltd. supports CBAM compliance in collaboration with accredited entities and global expert teams as the contact point in Japan. If you have any inquiries regarding third-party verification or related services, please feel free to contact us.

Oct 26, 2026

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Scent production in host clubs / Case study of host club establishments in Kabukicho

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We have introduced Majesta Fragrance to a large host club located in Kabukicho, enhancing the atmosphere with scent throughout the establishment. We support the creation of a welcoming space for customers by providing fragrances that match the luxurious ambiance of the interior. **Benefits of Incorporating Scent in Host Clubs** Creating a Memorable Space Scent is deeply connected to human memory and emotions. By incorporating fragrances that align with the store's atmosphere, we can create an impressive environment that makes customers feel, "I want to come back to this space." Enhancing Luxury and Brand Image From the entrance to the floor, the entire establishment is enhanced with high-quality scents. By paying attention to fragrance as well as interior design and lighting, we highlight the glamour and luxury unique to host clubs. Majesta Fragrance has a proven track record of being implemented in various nightlife businesses, including host clubs, cabarets, lounges, clubs, bars, and girls' bars. Please feel free to consult us, starting with a free trial installation.

Oct 26, 2026

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Prepare for high crude oil prices and supply risks | SEA'S7's alternatives for thinner and parts cleaner, and cleaning tools and jigs.

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Oct 25, 2026

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405_Does one's consumption behavior change under the influence of others!? 'Demonstration Effect'

SBS Marketing Co., Ltd. Is your consumption behavior influenced by others!? The "Demonstration Effect"

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Based on practical experience in support companies and business companies, SBS Marketing Co., Ltd. provides consulting services related to marketing, sales promotion, and customer acquisition primarily in the BtoB (business-to-business) sector. On October 22, 2026 (Thursday), they published a page titled "Does Consumption Behavior Change Due to Influence from Others!? 'Demonstration Effect'." The 'Demonstration Effect' refers to how one's consumption behavior can change due to the influence of others' consumption behavior. The page explains the mechanisms behind this phenomenon, its differences from similar concepts, examples of its application, and precautions to take when utilizing it. (Page Overview: Excerpts) ■ What is the 'Demonstration Effect'? ■ Mechanisms behind the occurrence of the 'Demonstration Effect' ■ Differences between the 'Demonstration Effect' and similar concepts ■ Examples of utilizing the 'Demonstration Effect' ■ Precautions when utilizing the 'Demonstration Effect' (DL content only) ▼ For more details, please visit this page. https://sbsmarketing.co.jp/blog/demonstration-effect-2026-10/

Oct 24, 2026

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