Cross-sectional observation of substrate-mounted components (1) to (6)

Introducing the "Observation Mode" of a chip capacitor (MLCC) under a microscope!

We would like to introduce an example of cross-sectional observation of mounted components conducted by our company. Using commercially available computer circuit boards, we observed the solder joints of mounted components and the internal structures of the components with a metal microscope. The observation modes of the metal microscope include bright field observation, dark field observation, and polarized light observation, among others. Additionally, there are observations using transmitted light, and the observation mode is selected according to the sample. By conducting cross-sectional observations before and after reliability testing, we can evaluate the reliability of the product. When observing, it is important to select an appropriate "observation mode" to clearly capture the condition of the solder joint interface and defects such as cracks. [Case Overview] ■ Using commercially available computer circuit boards ■ Observing the solder joints of mounted components and the internal structures of the components with a metal microscope ・Observation modes: bright field observation, dark field observation, polarized light observation, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Parts and Materials

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and problems not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point and a helpful resource for our customers in resolving issues. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other Software

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

With our advanced technology, we can also create cross-sections of highly challenging samples!

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation quite challenging. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing examples of aluminum welding observations. Internal observations through X-ray fluoroscopy and CT scans provide clearer insights after cross-section preparation!

Here is a case study of the observation of aluminum spot welds. Internal observation using X-ray radiography revealed voids within the weld, and internal observation using X-ray CT confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching, we were able to observe the condition of the weld more clearly. 【Summary】 ■ Internal observation using X-ray radiography - Conducted non-destructive testing and X-ray radiographic observation - Voids were observed within the weld ■ Internal observation using X-ray CT - Conducted non-destructive testing and X-ray CT observation - Confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section tailored to the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing a case study on the cross-section preparation of large samples (65mm × 28mm) and the observation of their internal structures!

We present an observation case of a large sample (expansion valve) measuring 65mm × 28mm. This sample uses magnetic materials, and due to distortion in the images during SEM observation, we primarily conducted observations using an optical microscope. From the appearance and X-ray radiographic observation, it was found that there are some areas that are not visible in the X-ray. 【Overview】 ■ Appearance and X-ray radiographic observation ■ Cross-sectional observation using an optical microscope *For more details, please refer to the PDF document or feel free to contact us.

• others

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within acceptable standards. The evaluation criteria after the solder durability test can be individually established based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• others

Three types of Pb-free soldered products are subjected to reliability tests! We will introduce the main objectives of each test and the results of cross-sectional observations.

We would like to introduce the cross-sectional observation of Pb-free solder after the reliability tests conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints, such as monitoring crack propagation, the TC test, which allows for cross-sectional observation after each cycle, is recommended. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

Hotron Inc. has launched its new product, the "Vehicle Count Sensor CCS3"! This product is a ceiling-mounted sensor that combines infrared and radar technology. It reliably detects vehicles in both directions with a single unit, accommodating traffic during congestion and vehicle passing, thus achieving efficient occupancy management in large parking lots. Additionally, it can be utilized for exit warning purposes in addition to vehicle counting, contributing to the safe and smooth operation of parking facilities. 'Features' - Improved detection performance against changes in road surface during rainy weather by using both infrared and radar. - Equipped with IP67 waterproof and dustproof performance, making it effective even in salt damage areas. - Various settings can be configured from a dedicated app (for Android devices), with current settings easily visible at a glance. - The base dimensions are the same as the previous model "CCS2," allowing for smooth replacement of existing equipment. *For more details, please refer to the product information, catalog download, or contact us.*

We have released a "trial version app (browser version)" that allows you to freely test the "blinking detection technology" developed using joint patent technology with Panasonic, directly in your browser. No application, installation, or membership registration is required. It measures blinking for 30 seconds using your PC's built-in camera or your smartphone's camera, displaying the number of blinks, the rate per minute, the duration of closed eyes (average and longest), and the intervals between blinks in real-time. The camera footage is processed within the browser, and neither the video nor the measurement results are sent externally. Additionally, we have started online sales of the "blinking detection app (Windows version)" that allows unlimited measurements for research and verification purposes. It supports recording and CSV output, with prices set at 33,000 yen for general users and 16,500 yen for academic institutions (tax included, per license, one-time purchase). The camera input version and the file input version are sold separately. For integration into products and services, we also offer the "blinking detection SDK" (with a one-month free trial version available).

We will begin providing a new solution for construction companies, the "Specific Voice Detection Edge AI System," utilizing the development and operational insights from the "Specific Vehicle Detection System" co-developed with Toda Corporation, starting in September 2026. This system applies the technology of the productivity-enhancing AI camera "PROLICA" to pre-learn and analyze specific voice data collected by outdoor microphones, allowing AI to detect target sounds in real-time on-site. By using voice detection, it will be possible to early detect the presence of approaching emergency vehicles even in environments where traditional visual checks or image analysis by AI cameras are difficult due to obstructions like buildings or curves. By linking with various devices and automating the control of construction vehicle departures and alerts to workers, it contributes to improving safety at construction sites and surrounding roads. ■ Main Features of This System 1. High-precision detection using voice AI 2. Safety management independent of visibility 3. Real-time processing with edge AI For more details, please check the linked page.

We will be exhibiting at the "Advanced Construction, Disaster Prevention, and Mitigation Technology Fair in Kumamoto 2026," which will be held for two days from November 18 at Gran Messe Kumamoto (Masaki Town, Kamimashiki District, Kumamoto Prefecture). This exhibition is organized by the organizing committee of the Advanced Construction, Disaster Prevention, and Mitigation Technology Fair in Kumamoto 2026, aiming to enhance disaster prevention awareness through the introduction of advanced technologies and products related to disaster prevention, as well as to promote economic and technological exchanges. On the day of the event, we will showcase the "High Water Content Soil Improvement Agent MT Series" and the "Soil Recycling Technology Bontelan Method," and we will introduce our technologies through demonstrations using actual soil. We invite those nearby to stop by our booth. Venue: Gran Messe Kumamoto (1010 Fukutomi, Masaki Town, Kamimashiki District, Kumamoto Prefecture) Dates: November 18, 2026 (Wednesday) 10:00 AM - 5:00 PM November 19, 2026 (Thursday) 9:30 AM - 3:30 PM Our booth location: B18 Technical Presentation: November 18, 2026 (Wednesday) 1:15 PM - 1:45 PM, Seminar Room 4 Official website of the Advanced Construction, Disaster Prevention, and Mitigation Technology Fair in Kumamoto 2026: https://www.s-kumamoto.jp/

Recently, Intertek Certification AB, the Swedish subsidiary of Intertek, has been accredited by the Swedish national accreditation body Swedac as a verification body for the EU Carbon Border Adjustment Mechanism (CBAM). According to Swedac's announcement, this is the first CBAM accreditation for a verification body in Sweden. This accreditation covers six sectors: cement, steel, aluminum, fertilizers, hydrogen, and electricity, and Intertek Certification AB will provide third-party verification services for embedded emissions associated with the manufacturing of CBAM-covered products based on the scope of accreditation. CBAM is a system that reflects the carbon price on greenhouse gas emissions associated with the manufacturing of certain products imported into the EU, requiring targeted companies to properly calculate and report their greenhouse gas emissions data and comply with third-party verification. Intertek Certification Co., Ltd. supports CBAM compliance in collaboration with accredited entities and global expert teams as the contact point in Japan. If you have any inquiries regarding third-party verification or related services, please feel free to contact us.