Cross-sectional observation of substrate-mounted components.

Observations before and after reliability testing, as well as cross-sectional observations! Here are examples of observations of various implemented components.

We would like to introduce our service for "Cross-sectional Observation of Various Mounted Components on Circuit Boards." Inside various electronic devices around us, there are circuit boards equipped with electronic components. When observing a mounted circuit board, it becomes clear that numerous components are densely soldered together, and it is necessary to confirm that the components are properly joined, as improper connections can lead to malfunction. Please contact us if you are considering observations or cross-sectional examinations before and after reliability testing. 【Examples of Observations (Partial)】 ■ Ceramic Capacitors ■ Transistors ■ Chip Resistors ■ QFP ■ Connector Pins *For more details, please refer to the PDF materials or feel free to contact us.

• Analysis and prediction system

By applying chemical etching, ion milling, and FIB processing to mechanical polishing methods, we will analyze various metal joints, starting with lead-free solder.

The joints of electronic components have a significant impact on the overall reliability of the circuit board. Particularly at solder joints, not only the shape but also the observation of the metal structure becomes important.

• Other analytical equipment

We undertake contract processing and manufacturing of cross-sections of various parts and materials.

At Aites, we undertake the processing of cross-sections of various components and materials, including electronic components, mounted circuit boards, semiconductors, compound semiconductors, power devices, films, resin molded products, solar panels, and LCD glass. We also conduct observations and analyses of the produced cross-sections, providing services for defect analysis and quality evaluation. 【List of Services】 ■Mechanical polishing ■CP processing ■Microtome ■FIB processing ■Analysis of semiconductor diffusion layers, etc. *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment

Introducing the perspectives from which analysis and analytical techniques should be advanced!

Our company supports customers in solving their challenges and problems not only with electronic components but also with a wide range of products, parts, and materials, including inorganic and organic materials, through failure analysis, defect analysis, structural analysis, and reliability evaluation. This document introduces how to approach analysis and evaluation techniques from various perspectives. We hope it serves as a starting point and a helpful resource for our customers in resolving issues. [Contents] ■ Introduction ■ Image of Joining and Positioning of Our Evaluation and Analysis Techniques ■ Causes of Defects ■ Methods ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

• Other Software

Each part is carefully polished by hand, using an efficient process without waste!

Our company specializes in "cross-section polishing of implementation parts and electronic components." To quickly provide cross-section samples suitable for observing various parts, we carefully polish each component by hand, using an efficient process without waste. Please feel free to contact us for more information. 【Features】 ■ Quickly provide cross-section samples suitable for observing various parts ■ Carefully polish each component by hand, using an efficient process without waste *For more details, please refer to the PDF materials or feel free to contact us.

• others

You can closely observe the soldering condition of electronic components on the implementation board and the internal structure of the components!

We conduct "cross-sectional observation of surface-mounted electronic components." Through cross-sectional observation after mechanical polishing, it is possible to closely examine the solder joint condition (presence of cracks or voids) of electronic components on the mounted substrate, as well as the internal structure of the components. For "SOP components," detailed observation can be made from the overall cross-section to the solder connection, and for "aluminum electrolytic capacitors," it is possible to observe the internal structure of the electrolytic capacitor components and their connection to the substrate. 【Features】 ■ SOP (Small Outline Package) components - Detailed observation can be made from the overall cross-section of SOP components to the solder connection. ■ Chip ceramic capacitors - Detailed observation can be made from cracks in the component material to cracks in the solder area. ■ Aluminum electrolytic capacitors - Observation can be made from the internal structure of the electrolytic capacitor components to their connection to the substrate. *For more details, please refer to the PDF document or feel free to contact us.

• others

With our advanced technology, we can also create cross-sections of highly challenging samples!

The CCD camera module is composed of a complex structure that integrates electronic and mechanical technologies, including sensors, control elements, and AF drive mechanisms, all within a small housing. Additionally, a variety of materials such as metal, glass, and resin are used, making cross-section preparation quite challenging. Our company can produce cross-sections of such high-difficulty samples with advanced technology. 【Cross-section of CCD Camera Module】 ■ Multiple lenses and filters are built into the small housing ■ Products with AF functionality also incorporate mechanisms for focus adjustment and control elements *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing examples of aluminum welding observations. Internal observations through X-ray fluoroscopy and CT scans provide clearer insights after cross-section preparation!

Here is a case study of the observation of aluminum spot welds. Internal observation using X-ray radiography revealed voids within the weld, and internal observation using X-ray CT confirmed that the voids are located near the center of the weld (between the two aluminum plates). Additionally, by creating a cross-section of the same sample and combining mechanical polishing with chemical etching, we were able to observe the condition of the weld more clearly. 【Summary】 ■ Internal observation using X-ray radiography - Conducted non-destructive testing and X-ray radiographic observation - Voids were observed within the weld ■ Internal observation using X-ray CT - Conducted non-destructive testing and X-ray CT observation - Confirmed that the voids are located near the center of the weld ■ Cross-sectional observation using optical microscopy and tabletop SEM - Mechanical polishing and chemical etching A cross-section tailored to the sample allows for clearer observation. *For more details, please refer to the PDF document or feel free to contact us.

• others

Introducing a case study on the cross-section preparation of large samples (65mm × 28mm) and the observation of their internal structures!

We present an observation case of a large sample (expansion valve) measuring 65mm × 28mm. This sample uses magnetic materials, and due to distortion in the images during SEM observation, we primarily conducted observations using an optical microscope. From the appearance and X-ray radiographic observation, it was found that there are some areas that are not visible in the X-ray. 【Overview】 ■ Appearance and X-ray radiographic observation ■ Cross-sectional observation using an optical microscope *For more details, please refer to the PDF document or feel free to contact us.

• others

Calculating the crack rate of ball joints and implementing it according to customer specifications!

After the solder durability test on the circuit board, if cracks occur in the solder joints, the crack rate will be calculated to confirm whether the cracks are within acceptable standards. The evaluation criteria after the solder durability test can be individually established based on the product environmental specifications, so most customers have their own standards. The measurement methods vary according to the shape of the components, but when you make a request, we will carry out the tests according to your specifications. 【Service Contents】 ■ Solder joints of BGA - Calculation of crack rate for ball joints ■ Solder joints of chip resistors - Calculation of crack rate for both ends of square and rectangular terminals ■ Solder joints of coil components - Calculation of crack rate for ribbon leads and QFP leads *For more details, please refer to the PDF document or feel free to contact us.

• Other analytical equipment
• others

Three types of Pb-free soldered products are subjected to reliability tests! We will introduce the main objectives of each test and the results of cross-sectional observations.

We would like to introduce the cross-sectional observation of Pb-free solder after the reliability tests conducted by our company. Pb-free solder assemblies (Sn/Ag/Cu alloy solder) were subjected to three types of reliability tests. We compared the initial products with those after testing to check for the presence of cracks and the growth of intermetallic compound layers. To gradually confirm the durability of the solder joints, such as monitoring crack propagation, the TC test, which allows for cross-sectional observation after each cycle, is recommended. 【Test Conditions】 (1) TC Test (Temperature Cycle) 125℃ for 20 minutes / -40℃ for 20 minutes / 1000 cycles (2) HT Test (High-Temperature Storage) 150℃ for 1000 hours (3) TH Test (Temperature and Humidity) 85℃ / 85% RH for 1000 hours *For more details, please refer to the PDF document or feel free to contact us.

• Analysis and prediction system

Our company will be exhibiting at the "Green Cross Exhibition 2026 in Sapporo." Duration: September 16 (Wednesday) to 18 (Friday), 2026 - 16th (Wednesday) 10:00 AM to 5:00 PM - 17th (Thursday) 9:00 AM to 5:00 PM - 18th (Friday) 9:00 AM to 3:00 PM Venue: Sapporo City Sports Exchange Facility Tsudome (Sapporo City, Hokkaido) We look forward to your visit.

Japan is one of the top 10 countries in the world with frequent earthquakes. The 2020 White Paper on Land, Infrastructure, Transport and Tourism has also reported an increase in the probability of major earthquakes occurring. Regarding the Nankai Trough earthquake, the probability of an earthquake with a magnitude of 8 to 9 occurring within the next 30 years is estimated to be 70 to 80%. At Hotron, we recommend the introduction of seismic devices for earthquake countermeasures in buildings and equipment. The seismic device 'HK-2' is a product that automatically performs various controls that have been pre-set when it detects strong shaking equivalent to a seismic intensity of 5 lower or higher. For example, it can automatically execute actions such as: "Open automatic doors and gates to secure evacuation routes and access for emergency vehicles" "Transmit signals to the control room and stop facility equipment" "Unlock the keys to locked lockers" "Automatically play voice guidance" For more details, please download the materials or contact us.

Introduction of a Public Video on the Installation, Storage Methods, and Performance Testing of Waterproof Boards To help you better understand the correct handling methods and product performance of "waterproof boards," we have released a video on YouTube. This video includes smooth procedures for installation and storage using actual products, as well as footage of performance testing under assumed flooding conditions. The content allows you to confirm the safety of the product and the image after installation, so please take a look. ■ Video Link https://youtube.com/playlist?list=PLc0ljXfq9NJ4&si=QD0tckLZrS_MUoK0 ■ Types of Videos - Detachable JP-WP-1D - Detachable JP-WP-1DC - Swing JP-WP-SW - Slide JP-WP-SL - Sheet JP-WP-SR - Electric Lift JP-WP-AU - Roll-up JP-WP-WU ■ Video Overview - Features - Installation Methods - Storage Methods - Performance Testing

On August 28, 2026 (Friday), at Hotel New Otani in Chiyoda, Tokyo, Micronet will showcase a demo at the AMD Embedded Computing Summit Tokyo 2026, a technology event hosted by AMD focused on embedded and edge computing. This participation is aimed at the official support of AMD CPUs, and we plan to set up INtime for Windows on the AMD CPU P100 evaluation CRB, demonstrating fieldbus control, image analysis, and AI processing. <<Micronet Special Page>> https://www.mnc.co.jp/INtime/AMDxINtime/AMDEmbeddedComputingSummit.html #PC #RealTimeControl #INtime #AMD Ryzen AI Embedded P100 Series Processor #AI #MotionControl

We have released three technical documents for the AI visual inspection platform "DeepAge Sensor" for free. The document titled "How to Launch Visual Inspection AI in a Process with No Defective Samples" (12 pages) summarizes five steps to establish anomaly detection using only good product images, along with pitfalls identified through real data validation. Additionally, we have prepared a product catalog (14 pages) and a "Guide to Integrating AI into Inspection Equipment" (13 pages) for equipment manufacturers. You can download them by providing your name, company name, and email address.