Detection sensitivity due to differences in acceleration voltage during SEM-EDX analysis.

Appropriate acceleration conditions for accurate analysis results! The detection depth in EDX changes with different acceleration voltages!

This introduces the detection sensitivity related to differences in acceleration voltage during SEM-EDX analysis. When analyzing the gold-plated surface of a typical printed circuit board (PCB), there are cases where the underlying nickel is detected even though it is not exposed. This is related to the scattering depth of the electron beam, and it is necessary to set appropriate acceleration conditions to obtain accurate analysis results. In this study, we conducted a verification of the EDX detection depth based on differences in acceleration voltage using Monte Carlo simulations. This is just one example, but it is important to set the acceleration voltage while imagining how electrons are scattered in order to obtain accurate analysis results. [Test Board Overview] - The sample used was a gold-plated pad from a typical printed circuit board (PCB). - The layer structure consists of nickel plating and gold plating on copper wiring. - The thickness of the gold plating, as observed in cross-section, is 212 nm. *For more details, please refer to the PDF document or feel free to contact us.*

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