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  6. LED failure analysis

LED failure analysis

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last updated:Sep 14, 2020

アイテス
アイテス
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Applying advanced sample preparation techniques and failure analysis equipment for semiconductors! Investigating the causes of non-lighting and brightness degradation.

In our "LED Failure Analysis," we conduct failure analysis of LEDs using advanced sample preparation techniques and semiconductor failure analysis equipment to investigate the causes of non-lighting and brightness degradation. In the "LED Defect Mode Isolation," we performed lighting tests after lens polishing and observed the resin of the LED, polishing it to stages a, b, and c, conducting lighting observations for (a) and (b), and optical observations of the chip through the resin for (c). Additionally, we also have categories such as "electrically normal," "open, high resistance," etc. 【Initial Diagnosis Items for LED Packages】 ■ Electrical characteristic measurement ■ Appearance observation ■ Lens polishing/package internal optical observation ■ Lighting test (brightness distribution observation) *For more details, please refer to the PDF materials or feel free to contact us.

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LED failure analysis

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  • Related Link - http://www.ites.co.jp/analyze/index.html

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X-ray fluoroscopy and CT examination device: Case of LED malfunction observation (X-ray fluoroscopy observation)

X-ray fluoroscopy and CT examination device: Case of LED malfunction observation (X-ray fluoroscopy observation)

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Total support service for LED.

Total support service for LED.

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LED failure analysis

LED failure analysis

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[Data] We will solve the cause of the issue from a chemical perspective.

[Data] We will solve the cause of the issue from a chemical perspective.

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LCD Panel Analysis Data Collection

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Examples of semiconductor observation by mechanical polishing

Examples of semiconductor observation by mechanical polishing

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Examples of semiconductor observation using mechanical polishing.

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In the methods for cross-section preparation in semiconductor structural observation and defect analysis, CP, FIB, and mechanical polishing are mentioned, each having its own advantages and disadvantages, making it necessary to consider which method to use. In recent years, CP and FIB have become more common, and it seems that the use of mechanical polishing, which requires technical skill, is decreasing. However, it is still not to be dismissed. While there are merits and demerits, it is possible to achieve cross-section preparation with mechanical polishing that is comparable to FIB and CP. At our company, based on years of accumulated know-how, we propose the most appropriate processing methods according to the observation purpose and the composition and structure of the samples.

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アイテス

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Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.

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