We will introduce EBSD analysis that reveals areas where distortion has accumulated in the wiring of the bending section!
We will introduce the EBSD analysis of flexible printed circuits (FPC). Regarding flexible circuits used in products with movable parts or bending mechanisms, we conducted a verification using EBSD to check for differences in the Cu wiring between the bending section and the fixed section. As a result, while no significant abnormalities or differences were observed in the optical images of the wiring in the bending and fixed sections, the EBSD analysis revealed areas where strain is accumulated in the wiring of the bending section and locations where low-angle grain boundaries are concentrated. [Analysis Content] ■ Appearance of the flexible circuit and optical images of Cu wiring - Appearance of the flexible circuit - Wiring in the bending section - Wiring in the fixed section ■ Comparison of Cu wiring in the bending and fixed sections using EBSD - Wiring in the bending section - Wiring in the fixed section *For more details, please refer to the PDF document or feel free to contact us.
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Company information
Aites was established in 1993, originating from the quality assurance department of the IBM Japan Yasu office. Based on the technical expertise cultivated through cutting-edge defect analysis and reliability assurance of electronic components at the IBM Japan Yasu office, we have provided various products and services that support the development and manufacturing of semiconductors, displays, organic EL, solar cells, and electronic components to customers both domestically and internationally.